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- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

This specification is applied to the 19”/ 22” Wide LCD TV used
LA85C chassis.

Each part is tested as below without special appointment.

1) Temperature:  20±5ºC
2) Relative Humidity:  65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)

* Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Option

Remark

1

Receivable System

ATSC/64 & 256 QAM/ NTSC-M

USA only

2

Available Channel

VHF : 02 ~ 13

UHF : 14 ~ 69

DTV : 02 ~ 69

CATV : 01 ~ 135

CADTV : 01 ~ 135

3

Input Voltage

100-240V~, 50/60Hz 

4

Market

5

Screen Size

19/22 Inch

6

Aspect Ratio

16:9

7

Tuning System

FS

8

LCD Module

LM190WX1 (1440*900)

Wide, LPL

M190A1-L07 (1440*900)

Wide, CHI MEI

LM220WE1 (1680*1050)

Wide, LPL

M220Z1-L01 (1680*1050)

Wide, CHI MEI

.

9

Operating Environment

Temp  : 0 ~ 40 deg

Humidity : ~ 80 %

10

Storage Environment

Temp  : -20 ~ 60 deg

Humidity : 0 ~ 85 %

Model

Market

Appliance

19LG30-UA

Safety : UL1492, CSA C22.2.No.1

22LG30-UA

EMC : FCC Class B, IEC Class B 

- 7 -

No

Resolution

H-freq(kHz)

V-freq.(kHz)

Proposed

1 

720*480

15.73

59.94

SDTV, DVD 480I(525I)

2

720*480

15.73

60.00

SDTV, DVD 480I(525I)

3

720*480

31.47

59.94

SDTV 480P

4

720*480

31.50

60.00

SDTV 480P

5 1280*720

44.96

59.94

HDTV 

720P

6 1280*720

45.00

60.00

HDTV 

720P

7 1920*1080

33.72

59.94

HDTV 

1080I

8 1920*1080

33.75

60.00

HDTV 

1080I

9

1920*1080

27

24

HDTV 1080P

10

1920*1080

33.75

30

HDTV 1080P

11

1920*1080

67.43

59.94

HDTV 1080P

12

1920*1080

67.5

60

HDTV 1080P

No

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Remark

Proposed

DDC

1

640*480

31.469

59.94

25.17

VESA(VGA)

O

2

800*600

37.879

60.31

40.00

VESA(SVGA)

O

3

1024*768

48.363

60.00

65.00

VESA(XGA)

O

4

1280*768

47.776

59.87

79.50

CVT(WXGA)

O

5

1360*768

47.720

59.799

84.75

CVT(WXGA)

O

6

1440*900

55.5

59.90

88.750

19/22LG30-UA only

WXGA

7

1400*1050

64.744

59.948

101.00

22LG30-UA only

WSXGA

8

1680*1050

65.290

59.954

146.25

22LG30-UA only

WSXGA

1

720*480

31.469

59.94

27.00

SDTV 480P

2

720*480

31.500

60.00

27.03

SDTV 480P

3

1280*720

44.96

59.94

74.17

HDTV 720P

4

1280*720

45.00

60.00

74.25

HDTV 720P

5

1920*1080

33.72

59.94

74.17

HDTV 1080I

6

1920*1080

33.75

60.00

74.25

HDTV 1080I

7

1920*1080

27

24.00

74.25

HDTV 1080P

8

1920*1080

33.75

30.00

74.25

HDTV 1080P

9

1920*1080

67.43

59.94

148.35

HDTV 1080P

10

1920*1080

67.5

60.00

148.50

HDTV 1080P

No

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Remark

Proposed

PC

DDC

1

640*350

31.469

70.08

25.17

DOS

2

720*400

31.469

70.08

28.32

DOS

O

3

640*480

31.469

59.94

25.17

VESA(VGA)

O

4

800*600

37.879

60.31

40.00

VESA(SVGA)

O

5

1024*768

48.363

60.00

65.00

VESA(XGA)

O

6

1280*768

47.776

59.87

79.50

VESA(WXGA)

O

7

1360*768

47.712

60.01

85.50

VESA(WXGA)

O

8

1440*900

55.5

59.90

88.750

WXGA

9

1400*1050

64.744

59.948

101.00

22LG30-UA only

WSXGA

10

1680*1050

62.290

59.954

146.25

22LG30-UA only

WSXGA

- 8 -

This specification sheet is applied for all of the LCD TV with
LA85C chassis.

1) The adjustment is according to the order which is

designated and which must be followed, according to the
plan which can be changed only on agreeing.

2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes 
6) Adjustment equipments: Color Analyzer(CA-210 or CA-

110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control

* APC - After Manual-Insult, executing APC

1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

2) Set as below, and then click “Auto Detect” and check “OK”

message. If display “Error”, Check connect computer, jig,
and set.

3) Click “Connect” tab. If display “Can’t”, Check connect

computer, jig, and set.

4) Click “Read” tab, and then load download file(XXXX.bin) by

clicking “Read”.

5) Click “Auto” tab and set as below
6) click “Run”.
7) After downloading, check “OK” message.

(1) Auto RGB Gain/Offset Adjustment

1) Convert to PC in Input-source

I

2

C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)

cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),

0x60(RGB), 0x90(HDMI)

2) Signal equipment displays

Output Voltage : 700 mVp-p
Impress Resolution XGA (1024x 768 @ 60Hz)

Model : 60   in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].

3) Adjust by commanding AUTO_COLOR _ADJUST

(0xF1) 0x00 0x02 instruction.

(2) Confirmation

1) We confirm whether “0xB6” address of EEPROM

“0xA2” is “0xAA” or not.

2) If  “0xB6(RGB)” address of EEPROM “0xB2” isn’t

“0xAA”, we adjust once more.

3) We can confirm the ADC values from “0xB0~0xB5

(RGB)” addresses in a page “0xA2”

* Manual ADC process using Service Remote control. After

enter Service Mode by pushing “ADJ” key, execute “Auto-
adjust” by pushing “

G

” key at “0. ADC CALIBRATION”.

(1)

(3)

(2)

 OK

Please Check Speed :
To us speed between from 200 KHz
to 400 KHz

(4)

filexxx.bin

(5)

(7) ........ OK

(6)

filexxx.bin

<Adjustment pattern (PC)>