LG 22LC2D (CHASSIS:LA75E) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification is applied all of the LCD TV with LA75E
chassis.
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature : 20 ± 5°C
(2) Relative Humidity : 65 ± 10%
(3) Power voltage
(2) Relative Humidity : 65 ± 10%
(3) Power voltage
: Standard input voltage(100-240V@50/60Hz)
*Standard Voltage of each products is marked by models.
*Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
(5) The receiver must be operated for about 30 minutes prior
to the adjustment.
3. Test method
(1) Performance : LGE TV test method followed
(2) Demanded other specification
(2) Demanded other specification
Safety : UL, CSA, IEA Specification
EMC : FCC, ICES, IEC Specification
EMC : FCC, ICES, IEC Specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No
Item
Specification
Remark
1
Receivable System
ATSC/64 & 256 QAM/ NTSC-M
2
Available Channel
VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3
Input Voltage
100-240V~, 50/60Hz
4
Market
NORTH AMERICA
5
Screen size
22 inch Wide
6
Aspect Ratio
16 : 9
7
Tuning System
FS
8
LCD Module
LM220WE1(1680*1050)
Wide, LPL
M220Z1-L01(1680*1050)
Wide, CHI MEI
9
Operating Environment
Temp : 0 ~ 40 deg
Humidity : 10~90 %RH
10
Storage Environment
Temp : -20 ~ 50 deg
Humidity : 10~90 %RH
- 7 -
5. Chroma & Brightness
(CONDITION : EZ-Picture "Daylight")
No
Item
Min
Typ
Max
Unit
REMARK
1
White peak brightness
250
300
cd/m
2
Module Spec.
190
250
cd/m
2
Set Spec.
2
Contrast ratio
500:1
700:1
3
DFC(Digital Fine Control)
2500:1
3000:1
4
Brightness uniformity
1.25
Refer to LCD SPEC.
5
Color coordinate
RED
X
Typ -0.03
0.638
Typ +0.03
Y
Typ -0.03
0.337
Typ +0.03
GREEN
X
Typ -0.03
0.299
Typ +0.03
Y
Typ -0.03
0.604
Typ +0.03
BLUE
X
Typ -0.03
0.145
Typ +0.03
Y
Typ -0.03
0.059
Typ +0.03
WHITE
X
Typ -0.03
0.283
Typ +0.03
Y
Typ -0.03
0.297
Typ +0.03
6
Viewing angle
Right / Left
150
170
CR>10
Up / Down
140
160
7
Color Temperature
Cool
8,300
9,300
10,300
X=0.283
<Test Signal>
Y=0.297
D-sub 15 input, with 16-gray
Medium
7,000
8,000
9,000
X=0.295
patter, 6th bar from right
Y=0.305
Warm
5,500
6,500
7,500
X=0.313
Y=0.39
6. Component Video Input (Y, PB, PR)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
1
720*480
15.73
59.94
SDTV, DVD 480I
2
720*480
15.75
60.00
SDTV, DVD 480I
3
720*480
31.47
59.94
SDTV 480P
4
720*480
31.50
60.00
SDTV 480P
5 1280*720
44.96
59.94
HDTV
720P
6 1280*720
45.00
60.00
HDTV
720P
7 1920*1080
33.72
59.94
HDTV
1080I
8 1920*1080
33.75
60.00
HDTV
1080I
9
1920*1080
27
24
HDTV 1080P
10
1920*1080
33.75
30
HDTV 1080P
11
1920*1080
67.43
59.94
HDTV 1080P
12
1920*1080
67.5
60
HDTV 1080P
- 8 -
7. RGB Input (PC)
No
Resolution
H-freq.(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Remark
Proposed
PC
DDC
1
640*350
31.469
70.08
25.17
DOS
2
720*400
31.469
70.08
28.32
DOS
O
3
640*480
31.469
59.94
25.17
VESA(VGA)
O
4
800*600
37.879
60.31
40.00
VESA(SVGA)
O
5
1024*768
48.363
60.00
65.00
VESA(XGA)
O
7
1280*768
47.776
59.87
79.50
VESA(WXGA)
O
8
1360*768
47.712
60.01
85.50
VESA(WXGA)
O
9
1366*768
60.023
60.00
80.00
20/23LS7D only
VESA(WXGA)
O
10
1440*900
55.5
59.90
88.750
19LS4D-UA only
WXGA
11
1680*1050
62.290
59.954
146.25
22LS4D-UA only
WSXGA
No
Resolution
H-freq.(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Remark
Proposed
PC
DDC
1. 640*480
31.469
59.94
25.17
VESA(VGA)
O
2. 800*600
37.879
60.31
40.00
VESA(SVGA)
O
3. 1024*768
48.363
60.00
65.00
VESA(XGA)
O
4. 1280*768
47.776
59.87
79.50
CVT(WXGA)
O
5. 1360*768
47.720
59.799
84.75
CVT(WXGA)
O
6. 1366*768
47.13
59.65
72
7. 1440*900
55.5
59.90
88.750
19LS4D-UA
only
WXGA
8. 1680*1050
62.290
59.954
146.25
22LS4D-UA
only
WSXGA
DTV
9. 720*480
31.469
59.94
27.00
SDTV
480P
10. 720*480
31.500
60.00
27.03
SDTV
480P
11. 1280*720
44.96
59.94
74.17
HDTV
720P
12. 1280*720
45.00
60.00
74.25
HDTV
720P
13. 1920*1080
33.72
59.94
74.17
HDTV
1080I
14. 1920*1080
33.75
60.00
74.25
HDTV
1080I
15. 1920*1080
27
24.00
74.25
HDTV
1080P
16. 1920*1080
33.75
30.00
74.25
HDTV
1080P
17. 1920*1080
67.43
59.94
148.35
HDTV
1080P
18.
1920*1080
67.5
60.00
148.50
8. HDMI/DVI input (PC)
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