DOWNLOAD LG 15LS1R-MG (CHASSIS:CL-81) Service Manual ↓ Size: 2.98 MB | Pages: 28 in PDF or view online for FREE

- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

This specification is applied to CL-81 chassis.

Testing for standard of each part must be followed in below condition.

(1) Temperature: 25°C ± 2°C
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than 30min.
(5) Adjusting standard for this chassis is followed a special standard.

NOTE : Specifications and others are subject to change without notice for improvement.

No.

Item

Content

Remark

1

2

3

4

5

6

7

8

9

8Keys

NATION

LPL

LC150X02-TL01

Brand

15LS1R-MG

15” LCD-TV

CL-81

Channel(

D

,

E

), Volume(

F

,

G

), OK, Menu, Input, Power

Length : 1.87 ± 0.04 M

Shape : Wall-out

Color : BLACK

No

Maker

LPL

Type

TFT Color LCD Module

Active Display Area

15.0 inches(380.16mm) diagonal(Aspect 4:3)

Pixel Pitch [mm]

0.297mm(H)x0.297mm(V)x RGB

Electrical Interface

LVDS

Color Depth

6BIT, 16,777,216 colors

Size [mm]

332.8(H) x 262.2(V) x 18(D)

Surface Treatment

Anti-Glare(HAZE  3%), Hard Coating(3H) 

Operating Mode

Normally Black

Back light Unit

4 CCFL(4 lamps)

R/T                Typ.

R.T.: 5ms + F.T.: 11ms(Typ)

Customer

User Model Name

Sale region

Feature

Chassis Name

General Scope

External SW & Adj.

Power Cord

Power Adapter

LCD Module Feature

- 7 -

Item

Remark

Specification

Viewing Angle

<CR≥10>

Luminance

Contrast Ratio

CIE Color Coordinates

All White/All Black

In PC input

Contrast 100/Brightness 50

In AV Input

PSM : Standard

White

(100 IRE)

R/L, 

U/D

Luminance(cd/m

2

)

Variation

CR

White

Wx

(Normal)

Wy

White

Wx

(Warm)

Wy

White

Wx

(Normal)

Wy

White

Wx

(Cool)

Wy

Typ

65/65

45/55

400

400

0.283

0.298

0.313

0.329

0.283

0.298

0.274

0.286

Min

55/55

40/50

300

300

0.253

0.268

0.283

0.299

0.253

0.268

0.244

0.256

Max

1.3

0.313

0.328

0.343

0.359

0.313

0.328

0.304

0.316

No.

1

2

3

4

No.

1

Product Dimension

Width(W)

Length(D)

Height(H)

Before Packing

463.3

166.3

353.5

With Stand

After Packing

527

175

470

2

Product Weight

LPL

Only SET

4.44 Kg

With BOX

5.54 Kg

3

Container Loading

20ft

40ft

Quantity

Individual or 

Indi.

Wooden

Indi.

Wooden

Palletizing

858

720

1716

1584

4

Stand Assy

Type

Base detachable

Size (W x D x H)

302.2 x 166.3 x 68

Tilt Degree

-3º (-0/+3º) ~10º (±2)

Tilt force

Target 1.5Kgf(0.8Kgf ~ 2.0Kgf)

5

Appearance

General

Refer to Standard of LG(55)G1-1020

Item

Content

Remark

- 8 -

No

Item

Specification

Remark

1

ENERGY

SYNC(V/H)

VIDEO

POWER CONSUMPTION

LED COLOR

Normal

On/On

Active

≤ 40W BLUE

Sleep Mode

Off/On

(PC Mode)

On/Off

Off

≤ 1W

Amber

Off/Off

Off Mode

-

Off

≤ 1W

Off(PC)

Amber(TV/AV)

2

D-SUB

1 : RED

2 : GREEN

10 : DIGITAL GND

Pin configuration

3 : BLUE

4 : ID2 (GND)

5 : S.T (GND)

6 : RED

7 : GREEN GND

8 : BLUE GND

9 : N.C

10 : D-GND

11 : ID0(GND)

12 : SDA

13 : H-SYNC

14 : V-SYNC

15 : SCL

SHELL : GND

3

Control Function

1) Contrast / Brightness

2) H-Position

3) Tracking : Clock / Phase

4) Auto Configure

5) Reset