Harman Kardon HK 990 (serv.man2) Service Manual ▷ View online
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1 Second Generation Aureus™ DSPs
1.1 Features
Aureus TMS320DA708, TMS320DA708B, TMS320DA788B
Floating-Point Digital Signal Processors
SPRS297E – JULY 2005 – REVISED JULY 2007
• DA708/B/DA788B: 32-/64-Bit 250-/266-MHz
Floating-Point DSP
• Upgrades to C67x+ CPU From DA6xx Family:
– 2X CPU Registers [64 General-Purpose]
– New Audio-Specific Instructions
– Compatible With the DA6xx C67x CPU
– New Audio-Specific Instructions
– Compatible With the DA6xx C67x CPU
• Enhanced Memory System
– 256K-Byte Unified Program/Data RAM
– 768K-Byte Unified Program/Data ROM
– Single-Cycle Data Access From CPU
– 768K-Byte Unified Program/Data ROM
– Single-Cycle Data Access From CPU
• Applications
– Large Program Cache (32K-Byte) Supports
– A/V and DVD Receiver
RAM, ROM, and External Memory
– Multizone A/V Receiver
• External Memory Interface (EMIF) Supports:
– HDD Jukebox
– 100-/133-MHz SDRAM (16-Bit)
– Navigation Systems
– Async NOR Flash, SRAM (8- or 16-Bit)
– High-Speed Encode With Simultaneous
– NAND Flash (8- or 16-Bit)
Multichannel Decode
• Enhanced I/O System
• Software Support
– High-Performance Crossbar Switch
– Dolby® Digital, Dolby® Digital EX,
Dolby® Digital Plus, Dolby® TrueHD,
– Dedicated McASP DMA Bus
Dolby® Pro Logic® IIx, Dolby® Headphone,
– Deterministic I/O Performance
Dolby® Virtual Surround,
• dMAX Dual Data Movement Accelerator:
– DTS®5.1, DTS-ES™ 6.1, DTS Neo:6™,
– Memory-to-Memory Transfers
DTS 96/24™, DTS-ES 96/24™, DTS-HD™
– Memory-to-Peripheral Transfers
(DA788B only)
– Packing/Unpacking Delay Data
– MPEG-2 AAC LC Decode
– Circular Addressing
– MPEG-4 AAC LC Encode/Decode
– Non-Sequential Addressing for Reverb
– THX® Select 2, THX® Ultra 2,
• Three Multichannel Audio Serial Ports
Neural-THX® Surround
– Transmit/Receive Clocks up to 50 MHz
– MP3 Encode, MP3 Decode
– Five Clock Zones and 16 Serial Data Pins
– WMA8 Encode, WMA9 Decode
– Supports TDM, I2S, and Similar Formats
– HDCD® Decode
– DIT Only (McASP2)
– ATRAC3plus® Encode,
ATRAC3plus® Decode
• Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin
– Audyssey MultEQ XT®, MultEQ®, PrevEQ®,
Options
2EQ®
• Two Inter-Integrated Circuit (I2C) Ports
– SRS® Circle Surround™ II (CS II)
• Real-Time Interrupt Counter/Watchdog
– TI Bass Boost
• Oscillator- and Software-Controlled PLL
– TI Perfect Playback™ Compressed Audio
• Commercial or Extended Temperature
Enhancer
– TI Virtualizer/Headphone
• 144-Pin, 0.5-mm, PowerPAD™ Thin Quad
– TI Effects Library
Flatpack (TQFP) [RFP Suffix]
– TI DSD-to-PCM Decode
• Security Features Available
– TI Filter Library
– TI Performance Audio Framework (PA/F)
– TI DSP/BIOS™
– Chip Support Library and DSP Library
– TI Performance Audio Framework (PA/F)
– TI DSP/BIOS™
– Chip Support Library and DSP Library
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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1.2 Trademarks
Aureus TMS320DA708, TMS320DA708B, TMS320DA788B
Floating-Point Digital Signal Processors
SPRS297E – JULY 2005 – REVISED JULY 2007
Aureus, Perfect Playback, DSP/BIOS, PowerPAD, TMS320C6000, C6000, Code Composer Studio, XDS,
TMS320, TMS320C62x, and TMS320C67x are trademarks of Texas Instruments.
TMS320, TMS320C62x, and TMS320C67x are trademarks of Texas Instruments.
Audyssey MultEQ XT, MultEQ, PrevEQ, and 2EQ are registered trademarks of Audyssey Laboratories.
SRS is a registered trademark of SRS Labs, Inc. in the U.S. and selected foreign countries.
Circle Surround II is a trademark of SRS Labs, Inc.
DTS-ES, DTS Neo:6, DTS 96/24, DTS-ES 96/24, and DTS-HD are trademarks of Digital Theater Systems,
Inc.
Inc.
DTS is a registered trademark of Digital Theater Systems, Inc.
Dolby and Pro Logic are registered trademarks of Dolby Laboratories.
Philips is a registered trademark of Koninklijki Philips Electronics N.V.
HDCD is a registered trademark of Microsoft Corporation in the United States and/or other countries.
ATRAC3plus is a registered trademark of Sony Corporation in Japan and/or other countries/territories.
THX is a registered trademark of THX Ltd.
All trademarks are the property of their respective owners.
Second Generation Aureus™ DSPs
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2.13 Pin Maps
78
EM_A[7]
109
1
108
72
2
107
3
106
4
105
5
104
6
103
7
102
8
101
9
100
10
99
11
98
12
97
13
96
14
95
15
94
16
93
17
92
18
91
19
90
20
89
21
88
22
87
23
86
24
85
25
84
26
83
27
82
28
81
29
80
30
79
31
32
77
33
76
34
75
35
74
36
73
110
71
111
70
112
69
113
68
114
67
115
66
116
65
117
64
118
63
119
62
120
61
121
60
122
59
123
58
124
57
125
56
126
55
127
54
128
53
129
52
130
51
131
50
132
49
133
48
134
47
135
46
136
45
137
44
138
43
139
42
140
41
141
40
142
39
143
38
37
144
V
SS
A
AMUTE0
AMUTE1
AHCLKX1
V
SS
ACLKX1
CV
DD
ACLKR1
DV
DD
AFSX1
AFSR1
V
SS
RESET
V
SS
CV
DD
CLKIN
V
SS
TMS
CV
DD
TRST
OSCV
SS
OSCIN
OSCOUT
OSCV
DD
V
SS
PLLHV
TDI
TDO
V
SS
DV
DD
EMU[0]
CV
DD
EMU[1]
TCK
V
SS
SPI0_CLK/I2C0_SCL
SPI0_SCS
/I2C1_SCL
V
SS
SPI0_ENA
/I2C1_SDA
EM_OE
DV
DD
EM_RW
CV
DD
EM_CS[2]
V
SS
EM_RAS
EM_CS[0]
EM_BA[0]
V
SS
EM_BA[1]
EM_A[10]
DV
DD
EM_A[0]
CV
DD
EM_A[1]
EM_A[2]
V
SS
EM_A[3]
CV
DD
EM_A[4]
EM_A[5]
V
SS
DV
DD
EM_A[6]
V
SS
CV
DD
EM_A[8]
EM_A[9]
EM_A[1
1
]
DV
DD
V
SS
SPI0_SIMO
SPI0_S
DV
DD
AXR0[0]
V
SS
AXR0[1]
AXR0[2]
AXR0[3]
AXR0[2]
AXR0[3]
V
SS
AXR0[4]
AXR0[5]/SP
AXR0[6]/S
AXR0[7]/SP
CV
DD
V
SS
DV
DD
A
A
A
CV
DD
V
SS
AXR0[10]/AX
AXR0[11
]/AX
CV
DD
V
SS
AXR0[12]/AX
AXR0[13]/AX
AXR0[13]/AX
DV
DD
AXR0[14]/A
AXR0[15]/A
AXR0[15]/A
ACLKR0
V
SS
AFSR0
ACLKX0
AHCLKR
AFSX0
V
SS
EM_CLK
EM_CKE
V
SS
DV
DD
EM_WE
_DQM[1]
EM_D[8]
CV
CV
DD
EM_D[9]
EM_D[10]
V
EM_D[10]
V
SS
EM_D[11
]
DV
DD
EM_D[12]
EM_D[13]
CV
EM_D[13]
CV
DD
EM_D[14]
EM_D[15]
V
EM_D[15]
V
SS
CV
DD
EM_D[0]
EM_D[1]
DV
EM_D[1]
DV
DD
EM_D[2]
EM_D[3]
V
EM_D[3]
V
SS
EM_D[4]
EM_D[5]
CV
EM_D[5]
CV
DD
EM_D[6]
DV
DV
DD
EM_D[7]
V
V
SS
EM_WE
_DQM[0]
EM_WE
EM_CAS
EM_CAS
Aureus TMS320DA708, TMS320DA708B, TMS320DA788B
Floating-Point Digital Signal Processors
SPRS297E – JULY 2005 – REVISED JULY 2007
Figure 2-2
shows the pin assignments on the 144-pin RFP package.
Figure 2-2. 144-Pin Low-Profile Quad Flatpack (RFP Suffix)—Top View
Device Overview
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5.3
PowerPAD™ Plastic Quad Flatpack Mechanical Data Drawing (RFP)
0
° − 7
°
0,08
M
0,08
0,50
0,13 NOM
73
72
0,27
0,17
0,17
37
(See Note D)
Thermal Pad
0,25
0,75
0,45
0,45
0,15
0,05
0,05
36
Seating Plane
2/21/03
Gage Plane
108
109
144
SQ
SQ
1
19,80
21,80
22,20
17,50 TYP
20,20
0,95
1,05
1,20 MAX
Aureus TMS320DA708, TMS320DA708B, TMS320DA788B
Floating-Point Digital Signal Processors
SPRS297E – JULY 2005 – REVISED JULY 2007
DA708/B/DA788B Device-Specific RFP (S-PQFP-G144)
PowerPAD™ PLASTIC QUAD
FLATPACK
A.
All linear dimensions are in millimeters.
B.
This drawing is subject to change without notice.
C.
Body dimensions do not include mold flash or protrusion.
D.
The package thermal performance may be enhanced by bonding the thermal pad to an external plane. This pad is
electronically and thermally connected to the backside of the die and possibly selected leads. Actual size:
5.4 mm
electronically and thermally connected to the backside of the die and possibly selected leads. Actual size:
5.4 mm
×
5.4 mm.
E.
Falls within JEDEC MS-026.
Mechanical Data
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