DOWNLOAD Sony XBR-65HX925 (serv.man4) Service Manual ↓ Size: 8.74 MB | Pages: 46 in PDF or view online for FREE

Model
XBR-65HX925 (serv.man4)
Pages
46
Size
8.74 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LEVEL 3
File
xbr-65hx925-sm4.pdf
Date

Sony XBR-65HX925 (serv.man4) Service Manual ▷ View online

45
XBR-65HX925
XBR-65HX925
 
REF. NO.  
PART NO. 
DESCRIPTION 
 VALUES   
 
REF. NO.  
PART NO. 
DESCRIPTION 
 VALUES   
DIODE
* D301  6-503-473-01  DIODE 
IR-LED-SFH4250S
* D302  6-503-473-01  DIODE 
IR-LED-SFH4250S
* D305  6-503-473-01  DIODE 
IR-LED-SFH4250S
* D306  6-503-473-01  DIODE 
IR-LED-SFH4250S
 D309  6-502-979-01  DIODE 
DA4J104K0L
TRANSISTOR
 Q301  6-552-755-01  TRANSISTOR 
SSM3K36UFV-L3SOF
 Q302  6-552-755-01  TRANSISTOR 
SSM3K36UFV-L3SOF
 Q303  6-552-408-01  TRANSISTOR 
DSC500100L
 Q304  6-552-408-01  TRANSISTOR 
DSC500100L
 Q305  6-551-551-01  TRANSISTOR 
RT3N77M-TP-1
RESISTOR
 
R301 
1-216-864-11 
SHORT CHIP
 
R302 
1-250-531-11 
METAL CHIP 
33K 
1% 
1/16W
 
R303 
1-250-531-11 
METAL CHIP 
33K 
1% 
1/16W
 
R313 
1-216-864-11 
SHORT CHIP
 
R318 
1-220-802-11 
METAL CHIP 
3.3 
5% 
1/16W
 
R322 
1-220-802-11 
METAL CHIP 
3.3 
5% 
1/16W
R325 
1-250-509-11 
METAL CHIP 
3.9K 
1% 
1/16W
R326 
1-250-499-11 
METAL CHIP 
1.5K 
1% 
1/16W
 
R327 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
 
R328 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
 
R329 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
R333 
1-250-509-11 
METAL CHIP 
3.9K 
1% 
1/16W
R334 
1-250-499-11 
METAL CHIP 
1.5K 
1% 
1/16W
 
R335 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
 
R336 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
 
R337 
1-250-451-11 
METAL CHIP 
15 
1% 
1/16W
 
R339 
1-218-969-11 
METAL CHIP 
22K 
5% 
1/16W
 
R340 
1-250-519-11 
METAL CHIP 
10K 
1% 
1/16W
 
R343 
1-216-864-11 
SHORT CHIP
RESISTOR BRIDGE
 
RB301 
1-250-267-21 
RES, NETWORK 33K (1005X4)
HLT2
 
A-1792-920-A 
HLT2 BOARD, MOUNTED
CAPACITOR
 
C101 
1-112-068-11 
CERAMIC CHIP 
220pF 
10% 
50V
 
C102 
1-100-909-11 
CERAMIC CHIP 
10µF 
10% 
6.3V
 
C108 
1-100-916-11 
CERAMIC CHIP 
0.1µF 
10% 
16V
 
C109 
1-164-874-11 
CERAMIC CHIP 
100pF 
5% 
50V
 
C110 
1-164-874-11 
CERAMIC CHIP 
100pF 
5% 
50V
CONNECTOR
CN100 
1-820-189-11 
HEADER ASSEMBLY (PRINT PWB)12P
DIODE
 D100  6-503-064-01  DIODE 
LNJ337W830S0
 D101  6-503-082-01  DIODE 
LNJ437W840S0
 D104  6-503-064-01  DIODE 
LNJ337W830S0
 D105  6-503-068-01  DIODE 
LNJ837W830S0
TRANSISTOR
 Q100  6-551-690-01  TRANSISTOR 
RT3N11M-TP-1
 Q103  6-551-690-01  TRANSISTOR 
RT3N11M-TP-1
RESISTOR
R102 
1-250-469-11 
METAL CHIP 
82 
1% 
1/16W
R114 
1-250-469-11 
METAL CHIP 
82 
1% 
1/16W
R115 
1-250-489-11 
METAL CHIP 
560 
1% 
1/16W
 
R118 
1-218-941-81 
METAL CHIP 
100 
5% 
1/16W
 
R119 
1-218-937-11 
METAL CHIP 
47 
5% 
1/16W
RESISTOR BRIDGE
 
RB100 
1-234-371-11 
RES, NETWORK 47       (1005X4)
HLT2
A-1
XBR-65HX925
XBR-65HX925
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-883-871-52
English
2011JJ74WEB-1
Printed in USA
© 2011.8
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A:  ENCRYPTION KEY COMPONENTS
 
Encryption key components developed by Sony Corporation contain confidential 
information, and shall be handled under the non-disclosure obligations provided in the 
applicable agreement with Sony Corporation (and/or its subsidiary). 
 
As part of this agreement specific instructions must be adhered to whenever a Circuit 
Board containing encryption key components is repaired and/or replaced pursuant to the 
following:
1)  In the service manual the Circuit Board(s) containing encryption key components 
shall be identified with a red outline and a  .
2)  Only repair boards or components listed in the service manual shall be utilized for 
replacement and/or repair.
3)  Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4)  Any board in which the Servicer replaces an encryption key component must be 
placed back into the set it orignally came from and the replaced defective component 
MUST BE DESTROYED. Boards cannot be swapped.
5)  If a Circuit Board identified with a red outline and a   in the service manual is deemed 
to be defective:
a)  and if a core charge is imposed and is covered under the product warranty, the 
defective un-repaired or modified board MUST BE RETURNED to Sony.
b)  and if the core charge is NOT covered under the product warranty, the defective 
un-repaired or modified board MUST BE DESTROYED.
6)  If a unit is destroyed (such as field scrap), the Circuit Board identified with a  
red outline and a   in the service manual MUST BE DESTROYED. 
A-1
XBR-65HX925
XBR-65HX925
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-883-871-52
English
2011JJ74WEB-1
Printed in USA
© 2011.8
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A:  ENCRYPTION KEY COMPONENTS
 
Encryption key components developed by Sony Corporation contain confidential 
information, and shall be handled under the non-disclosure obligations provided in the 
applicable agreement with Sony Corporation (and/or its subsidiary). 
 
As part of this agreement specific instructions must be adhered to whenever a Circuit 
Board containing encryption key components is repaired and/or replaced pursuant to the 
following:
1)  In the service manual the Circuit Board(s) containing encryption key components 
shall be identified with a red outline and a  .
2)  Only repair boards or components listed in the service manual shall be utilized for 
replacement and/or repair.
3)  Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4)  Any board in which the Servicer replaces an encryption key component must be 
placed back into the set it orignally came from and the replaced defective component 
MUST BE DESTROYED. Boards cannot be swapped.
5)  If a Circuit Board identified with a red outline and a   in the service manual is deemed 
to be defective:
a)  and if a core charge is imposed and is covered under the product warranty, the 
defective un-repaired or modified board MUST BE RETURNED to Sony.
b)  and if the core charge is NOT covered under the product warranty, the defective 
un-repaired or modified board MUST BE DESTROYED.
6)  If a unit is destroyed (such as field scrap), the Circuit Board identified with a  
red outline and a   in the service manual MUST BE DESTROYED. 
A-1
XBR-65HX925
XBR-65HX925
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-883-871-52
English
2011JJ74WEB-1
Printed in USA
© 2011.8
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A:  ENCRYPTION KEY COMPONENTS
 
Encryption key components developed by Sony Corporation contain confidential 
information, and shall be handled under the non-disclosure obligations provided in the 
applicable agreement with Sony Corporation (and/or its subsidiary). 
 
As part of this agreement specific instructions must be adhered to whenever a Circuit 
Board containing encryption key components is repaired and/or replaced pursuant to the 
following:
1)  In the service manual the Circuit Board(s) containing encryption key components 
shall be identified with a red outline and a  .
2)  Only repair boards or components listed in the service manual shall be utilized for 
replacement and/or repair.
3)  Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4)  Any board in which the Servicer replaces an encryption key component must be 
placed back into the set it orignally came from and the replaced defective component 
MUST BE DESTROYED. Boards cannot be swapped.
5)  If a Circuit Board identified with a red outline and a   in the service manual is deemed 
to be defective:
a)  and if a core charge is imposed and is covered under the product warranty, the 
defective un-repaired or modified board MUST BE RETURNED to Sony.
b)  and if the core charge is NOT covered under the product warranty, the defective 
un-repaired or modified board MUST BE DESTROYED.
6)  If a unit is destroyed (such as field scrap), the Circuit Board identified with a  
red outline and a   in the service manual MUST BE DESTROYED. 
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