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        MODEL NAME 

REMOTE COMMANDER 

DESTINATION  

Specifi cations ................................................................................. 4
Warnings and Cautions .................................................................. 5
Safety Check-Out ........................................................................... 6
Self-Diagnostic Function................................................................. 7

SECTION 1:  DISASSEMBLY............................................................... 10

1-1.  Rear Cover Removal............................................................ 10
1-2. Chassis Assembly Removal................................................. 10
1-3. Service Position ................................................................... 10
1-4. Picture Tube Removal...........................................................11
 

Anode Cap Removal Procedure............................................11

2-1. Beam Landing ...................................................................... 12
2-2.  V-PIN and V-CEN Adjustment .............................................. 13
2-3. Convergence........................................................................ 13

2-3.1.  Vertical and Horizontal Static Convergence ............ 13
2-3.2.  Operation of BMC (Hexapole) Magnet .................... 14
2-3.3. TLH 

Adjustment .............................................. 14

Convergence................................... 14

2-4. Focus Adjustment................................................................. 15

2-4.1.  Dynamic Focus/Dynamic Quadra-Pole Data ........... 15

2-5. Screen (G2).......................................................................... 16
2-6. Picture Quality Adjustments ................................................. 17

2-6.1.  Video Input - Sub Contrast Adjustment.................... 17
2-6.2.  Video Input - Sub Hue/Sub Color Adjustment.......... 17
2-6.3.  RF Input - Two Picture Sub Contrast Adjustment .... 17
2-6.4.  RF Input - Sub Hue/Sub Color Adjustment .............. 18

2-7.  White Balance (CRT) and Sub Bright Adjustment................ 18

Procedure ......................... 19

2-8.  H Raster Center Adjustment ................................................ 19
2-9. Picture Distortion Adjustments ............................................. 19

2-9.1.  NTSC (DRC) Full Mode Adjustment ........................ 19
2-9.2.  1080i HD Mode Adjustment ..................................... 20
2-9.3.  Twin Mode/Favorite/Index/Normal Mode Geometry 

Confi rmation ............................................................ 20

3-1.  Preparation Before Confi rmation.......................................... 21

3-1.1  Hold-Down Operation Confi rmation......................... 21

3-2.  B+ Max Confi rmation ........................................................... 21
3-3.  HV Service Flowchart........................................................... 22

SECTION 4:  CIRCUIT ADJUSTMENTS.............................................. 23

4-1.  Setting Service Adjustment Mode ........................................ 23

4-1.1.  Service Adjustment Mode In .................................... 23
4-1.2.  Service Adjustment Mode Memory .......................... 23
4-1.3.  Reading the Memory ............................................... 23
4-1.4.  Adjusting the Picture................................................ 23
4-1.5.  Resetting the Data ................................................... 23
4-1.6.  Resetting the MID NVM Data .................................. 23
4-1.7.  Resetting the System NVM Data ............................. 23
4-1.8. Copy 

Function.......................................................... 23

4-2.  Memory Write Confi rmation Method .................................... 24

4-3.  Remote Adjustment Buttons and Indicators ......................... 24
4-4.  Service Data Lists ................................................................ 25
4-5. ID Map Tables ...................................................................... 27

SECTION 5:  DIAGRAMS..................................................................... 28

5-1.  Circuit Boards Location ........................................................ 28
5-2.  Printed Wiring Boards and 

Schematic Diagrams Information ......................................... 28

5-3. Block Diagrams ..................................................................... 29
5-4.  Schematics and Supporting Information .............................. 32

D Board Schematic Diagram (1 of 2) ................................... 32
D Board Schematic Diagram (2 of 2) ................................... 33
M Board Schematic Diagram (1 of 4)................................... 37
M Board Schematic Diagram (2 of 4)................................... 38
M Board Schematic Diagram (3 of 4)................................... 39
M Board Schematic Diagram (4 of 4)................................... 40
U Board Schematic Diagram................................................ 42
BM1C Board Schematic Diagram (1 of 2)............................ 44
BM1C Board Schematic Diagram (2 of 2)............................ 45
HM Board Schematic Diagram............................................. 47
UD Board Schematic Diagram ............................................. 49
A Board Schematic Diagram (1 of 2).................................... 51
A Board Schematic Diagram (2 of 2).................................... 52
B Board Schematic Diagram (1 of 5) ................................... 55
B Board Schematic Diagram (2 of 5) ................................... 56
B Board Schematic Diagram (3 of 5) ................................... 57
B Board Schematic Diagram (4 of 5) ................................... 58
B Board Schematic Diagram (5 of 5) ................................... 59
HB Board Schematic Diagram ............................................. 62
HC Board Schematic Diagram ............................................. 64
CX Board Schematic Diagram ............................................. 66
WX Board Schematic Diagram ............................................ 68

5-5.  Semiconductors (1 of 2) ....................................................... 72
 

Semiconductors (2 of 2) ....................................................... 73

SECTION 6:  EXPLODED VIEWS ........................................................ 74

6-1. Chassis ................................................................................ 74
6-2. Picture Tube ......................................................................... 75
6-3. Beznet .................................................................................. 76

SECTION  7:  ELECTRICAL PARTS LIST........................................... 77

The 

SRS (SOUND RETRIEVAL SYSTEM) is manufactured 

by Sony Corporation under license from SRS Labs, Inc. It is 
covered by U.S. Patent No. 4,748,669. Other U.S. and foreign 
patents pending. 

The word ‘SRS’ and the SRS symbol 

are registered trade-

marks of SRS Labs, Inc. BBE and BBE symbol are trademarks of 
BBE Sound, Inc. and are licensed by BBE Sound, Inc. under U.S. 
Patent No. 4,638,258 and 4,482,866.

TruSurround

™

 

SRS 

 

®

TruSurround is a trademark of SRS Labs, Inc.  SRS and the SRS 
symbol are registered trademarks of SRS Labs, Inc. in the United 
States and in select foreign countries.  SRS and TruSurround are 
incorporated under license from SRS Labs, Inc. and are protected 
under United States Patent Nos. 4,748,669 and 4,841,572 with 
numerous additional issued and pending foreign patents.  Pur-
chase of this product does not convey the right to sell recordings 
made with the TruSurround technology.

1)  1 Vp-p 75 ohms unbalanced, sync negative

2)  Y:  1 Vp-p 75 ohms unbalanced, sync negative 

C:  0.286 Vp-p (Burst signal), 75 ohms

3)  Y: 1.0 Vp-p, 75 ohms unbalanced, sync negative; 

 

P

B

: 0.7 Vp-p, 75 ohms

 

P

R

: 0.7 Vp-p, 75 ohms

4)  500 mVrms (100% modulation), Impedance:  47 kilohms

5)  More than 408 mVrms at the maximum volume setting (variable)

 

More than 408 mVrms (fi x); Impedance (output): 2 kilohms

6)  3.3V T.M.D.S., 50 ohms

The DVI-HDTV input terminal is complieant with the EIA-861 

standard and is not intended for use with personal computers.

120V, 60Hz

4

3

2

7

1

1

YES

7.5W x 2

15W Subwoofer

280W

1W

898 x 576 x 564 mm

in 35

3/8

 x 22 

3/4

 x 22 

1/4

 in

76 kg

167 lbs 9 oz

American TV standard, NTSC

VHF: 2-13/ UHF: 14-69/ CATV: 1-125 

FD Trinitron

 tube

30-inch picture measured diagonally

32-inch measured diagonally

75 ohm external terminal for VHF/UHF 

Remote Commander RM-RM-Y191
Two Size AA (R6) Batteries

AV Cable: VMC-810/820/830 HG 
Audio Cable: RKC-515HG
Component Video Cable: VMC-10/30 HG 

TV Stand:  SU-30HS1 

Memory Stick Media: 8MB (MSA-8A); 16MB (MSA-16A);

 

32MB (MSA-32A); 64MB (MSA-64A); 128MB (MSA-128A)

Short circuit the anode of the picture tube and the anode cap to the metal chassis, CRT shield, or carbon painted on the CRT, after 
removing the anode.

An isolation transformer should be used during any service to avoid possible shock hazard, because of live chassis. The chassis of 
this receiver is directly connected to the ac power line.

!

 SAFETY-RELATED COMPONENT WARNING!!

Components identifi ed by shading and ! mark on the schematic diagrams, exploded views, and in the parts list are critical for safe 
operation. Replace these components with Sony parts whose part numbers appear as shown in this manual or in supplements 
published by Sony. Circuit adjustments that are critical for safe operation are identifi ed in this manual. Follow these procedures 
whenever critical components are replaced or improper operation is suspected. 

Apres avoir deconnecte le cap de l’anode, court-circuiter l’anode du tube cathodique et celui de l’anode du cap au chassis metallique 
de l’appareil, ou la couche de carbone peinte sur le tube cathodique ou au blindage du tube cathodique.

Afi n d’eviter tout risque d’electrocution provenant d’un chássis sous tension, un transformateur d’isolement doit etre utilisé lors de tout 
dépannage. Le chássis de ce récepteur est directement raccordé à l’alimentation du secteur.

! 

Les composants identifi es par une trame et par une marque ! sur les schemas de principe, les vues explosees et les listes de pieces 
sont d’une importance critique pour la securite du fonctionnement. Ne les remplacer que par des composants Sony dont le numero 
de piece est indique dans le present manuel ou dans des supplements publies par Sony. Les reglages de circuit dont l’importance 
est critique pour la securite du fonctionnement sont identifi es dans le present manuel. Suivre ces procedures lors de chaque 
remplacement de composants critiques, ou lorsqu’un mauvais fonctionnement suspecte.