Sony KE-P37XS1 / KE-P42XS1 Service Manual ▷ View online
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XS1
RM-Y1010
SERVICE MANUAL
XS1
CHASSIS
MODEL
COMMANDER
DEST
KE-P37XS1
RM-Y1010
AEP
MODEL
COMMANDER
DEST
KE-P42XS1
RM-Y1010
AEP
RM-Y1010
FLAT PANEL COLOR TV
KE-P37/42XS1
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XS1
RM-Y1010
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
6
1. GENERAL ...................................................................
7
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
21
2-2.
Speaker Cover Removal .....................................
21
2-3.
Speaker Removal ................................................
22
2-4.
H1 Board Removal .............................................
22
2-5.
H2 Board Removal .............................................
23
2-6.
H3 Board Removal .............................................
23
2-7.
H4 Board Removal .............................................
24
2-8.
HMP Board Removal .........................................
24
2-9.
U1 Board Removal .............................................
25
2-10. APS-202 Board Removal ...................................
25
3. SET-UP ADJUSTMENTS
3-1.
CVBS PAL System Adjustment .......................
26
3-2.
CVBS NTSC System Adjustment ....................
26
3-3.
CVBS SECAM System Adjustment .................
27
3-4.
YC PAL System Adjustment ............................
27
3-5.
YC NTSC System Adjustment ..........................
28
3-6.
YC SECAM System Adjustment ......................
28
3-7.
RGB System Adjustment ..................................
29
3-8.
YUV System Adjustment ..................................
29
3-9.
HDTV Component System Adjustment ............
30
3-10. White Balance Adjustment .................................
30
4. DIAGRAMS
4-1.
Block Diagrams (1) ............................................
31
Block Diagrams (2) ............................................
32
4-2.
Circuit Board Location ........................................
32
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
32
H1 Board Schematic Diagram ............................
33
H1 Printed Wiring Board ..................................
34
H2 Board Schematic Diagram ............................
33
H2 Printed Wiring Board ..................................
34
H3 Board Schematic Diagram ............................
35
H3 Printed Wiring Board ..................................
36
H4 Board Schematic Diagram ............................
35
H4 Printed Wiring Board ..................................
36
U1 Schematic Diagram .......................................
37
U1 Printed Wiring Board ..................................
43
4-4.
Semiconductors ..................................................
45
4-5.
IC Blocks ...........................................................
46
5. EXPLODED VIEWS
5-1.
Rear Cover and Stand .........................................
47
5-2.
Display Panel, Boards, and Speakers .................
48
6. ELECTRICAL PARTS LIST .................................. 50
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
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XS1
RM-Y1010
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The circuit boards listed below [Table 1] used in these models
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
Table 1
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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