Sony KE-42M1 / KE-MV42A1 / KE-MV42M1 / KE-P42M1 Service Manual ▷ View online
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2. PRECAUTIONS
To prevent the risks of unit damage, electrical shock and radiation, take the following safety, service, and ESD
precautions.
2-1. Handling Precautions for Plasma Display
2-2. Safety Precautions for Service (Handling, prevention of electrical shock, measure
against power outage, etc)
2-2-1. Safety Precautions
1) Before replacing a board, discharge forcibly the remaining electricity from the board.
2) When connecting FFC and TCPs to the module, recheck that they are securely
connected.
3) To prevent electrical shock, be careful not to touch leads during circuit operations.
4) To prevent the Logic circuit from being damaged, do not connect/disconnect signal
cables during circuit operations.
5) Follow voltage information when adjust it.
6) Before reinstalling the chassis and the chassis assembly, be sure to use necessary
protective stuffs.
7) Caution for design change: Do not install any additional devices to the module, and do
not change the electrical circuit design.
8) If any parts or wire is overheated or damaged, replace it with a new specified one
immediately, and identify the cause of the problem to resolve it.
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9) Check that the wires are correctly arranged and connected. Do not change the
distances between the parts and the printed circuit board. Check that the AC power
cord is not damaged. Keep heating parts away from lead wires and other parts.
10) Product safety indication : Some electrical circuits and devices have specific safety
characteristics. Therefore when replacing parts, use the same parts as originals.
Safety and protective function will be lost even if parts with higher voltage and wattage
capability are used.
11) Be sure to disconnect the AC power cord before servicing.
12) After servicing, check that the screws, parts, and wires are correctly installed. Also
check that the peripheral parts are not damaged.
2-2-2. Precautions for servicing electrostatic sensitive devices
Some semiconductors (such as ICs and FETs) are easily damaged by electrostatic.
These devices are called electrostatic sensitive devices (ESD).
The rate of electrostatic damage to devices can be decreased by observing the
following precautions.
1) Before handling semiconductors and assemblies, discharge electrostatic from your
body with an earth ground, or wear an antistatic band.
(Be sure to discharge electrostatic before turning on the power, to prevent electrical
shock
shock
)
2) After removing the ESD assembly, place it on an antistatic mat with aluminum foil to
avoid electrostatic charge.
3) Use only a ground-tip soldering iron to solder and unsolder the ESD.
4) Use only an antistatic soldering removal device for the ESD. General soldering
removal devices are non-antistatic. Using such non-antistatic devices will damage the
ESD.
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5) Before removing the protective material from the lead of a new ESD, bring the lead
into contact with the chassis or the circuit assembly that the ESD is to be installed on.
6) When handling an unpacked ESD for replacement, do not move around too much.
Moving (legs on the carpet, for example) generates enough electrostatic to damage
the ESD.
7) Do not take a new ESD from the protective case until the ESD is ready to be installed.
Most ESDs have a lead, which is easily short-circuited by conductive materials (such
as conductive foam and aluminum).
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3. NAME and FUNCTION
3-1. Layout of Assemblies
No. Board
1 Logic
Main
2 X-Main
3 Y-Main
4 Y-Buffer
(upper)
5 Y-Buffer
(lower)
6
Logic E Buffer
7
Logic F Buffer
8
Logic G Buffer
1
2
3
4
5
6
7
8
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