Sony KDL-V40A11E Service Manual ▷ View online
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AT2X
RM-ED001
SERVICE MANUAL
AT2X
CHASSIS
MODEL
COMMANDER
DEST
KDL-V40A11E
RM-ED001
AEP
RM-ED001
FLAT PANEL COLOR TV
KDL-V40A11E
- 2 -
AT2X
RM-ED001
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
6
1. GENERAL ...................................................................
7
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
16
2-2.
Stand Removal ....................................................
16
2-3.
Bracket Removal .................................................
17
2-4.
Loudspeaker Removal ........................................
17
2-5.
Fan Removal .......................................................
18
2-6.
A2 Board Removal .............................................
18
2-7.
BL, N and NP1 Board Removal .........................
19
2-8.
G3L Board Removal ...........................................
19
2-9.
H7 Board Removal .............................................
20
2-10. H8 Board Removal .............................................
20
2-11. H6 Board Removal .............................................
21
2-12. Service Position .................................................
22
3. SET-UP ADJUSTMENTS
3-1.
How to enter Service Mode ...............................
24
3-2.
Signal Level Adjustment ....................................
24
3-2-1. Check AD (CCPX case)
Calibration Registration Items ........................
24
3-2-2. Y Signal AD Calibration
of CCPX Decode .............................................
24
3-2-3. C Signal AD Calibration
of CCPX Decode .............................................
24
3-2-4. Check AD (Component case)
Calibration Registration Items ........................
25
3-2-5. Y Signal AD Calibration
of Component Input .........................................
25
3-2-6. C Signal AD Calibration
of Component Input .........................................
25
3-3.
White Balance Adjustment .................................
25
3-3-1. White Balance of Colour
Temperature “Cool” ........................................
25
3-3-2. White Balance of Colour
Temperature “Neutral” ....................................
26
3-3-3. White Balance of Colour
Temperature “Warm” ......................................
26
3-4.
Panel Replacement .............................................
27
3-5.
Board Replacement ............................................
27
3-5-1. P Board Replacement ......................................
27
3-5-2. BL Board Replacement ....................................
27
3-5-3. A2 Board Replacement ....................................
27
4. DIAGRAMS
4-1.
Block Diagrams (1) ............................................
32
Block Diagrams (2) ............................................
33
Block Diagrams (3) ............................................
34
Block Diagrams (4) ............................................
35
4-2.
Circuit Board Location ........................................
35
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
35
A2 Board Schematic Diagram ............................
36
A2 Board Printed Wiring Board .......................
43
G3L Board Schematic Diagram ..........................
46
G3L Board Printed Wiring Board ....................
48
N Board Schematic Diagram ..............................
50
N Board Printed Wiring Board ...........................
58
H6 Board Schematic Diagram ............................
59
H6 Board Printed Wiring Board .......................
60
H7 Board Schematic Diagram ............................
59
H7 Board Printed Wiring Board .......................
60
H8 Board Schematic Diagram ............................
59
H8 Board Printed Wiring Board .......................
60
NP1 Board Schematic Diagram ..........................
61
NP1 Board Printed Wiring Board ....................
62
4-4. Semiconductors ..................................................
63
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
66
5-2.
Display ................................................................
67
6. ELECTRICAL PARTS LIST .................................. 68
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
AT2X
RM-ED001
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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