Sony KDL-L32MRX1 / KDL-L32MRX1D / KDL-L42MRX1 / KDL-L42MRX1D Service Manual ▷ View online
- 1 -
MRX1
RM-Y1013
SERVICE MANUAL
MRX1
CHASSIS
MODEL
COMMANDER
DEST
KDL-L32MRX1
D
RM-Y1013
UK
MODEL
COMMANDER
DEST
KDL-L42MRX1
D
RM-Y1013
UK
RM-Y1013
FLAT PANEL COLOR TV
MBD-MRX1
D
LDM-3210/LDM-4210
- 2 -
MRX1
RM-Y1013
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
6
1. GENERAL ...................................................................
7
2. DISASSEMBLY
2-1.
Display Unit-1 (LDM-3210) ..............................
22
2-1-1. Stand Assy and Rear Panel Removal ..............
22
2-1-2. DES and K Boards Removal ...........................
22
2-1-3. G1 Board Removal ..........................................
23
2-1-4. R1 and R2 Boards Removal ............................
23
2-1-5. LCD Panel Removal ........................................
24
2-2.
Display Unit-2 (LDM-4210) ..............................
25
2-2-1. Rear Cover Removal .......................................
25
2-2-2. K1 and K2 Boards Removal ...........................
25
2-2-3. DES Board Removal .......................................
26
2-2-4. G2 Board Removal ..........................................
26
2-2-5. R3 and R4 Boards Removal ............................
27
2-2-6. Display Panel Removal ...................................
27
2-3.
Media Receiver Unit (MBD-MRX1D) ..............
28
2-3-1. Top Cover Removal .........................................
28
2-3-2. U2 Board Removal ..........................................
28
2-3-3. Baseplate and HMP Board Removal ...............
29
2-3-4. H5, H6 and H7 Board Removal ......................
29
2-3-5. G Board Removal ............................................
30
2-3-6. A1 Board Removal ..........................................
31
2-3-7. Service Position ...............................................
32
2-3-8. Service Connector for DIC Board ...................
32
2-3-9. LVDS Service Cable .......................................
32
2-4.
Cable Arrangements for Media Receiver
Unit (MBD-MRX1D) ........................................
33
2-4-1. Front Panel Dressing .......................................
33
2-4-2. A1 Board Dressing ..........................................
33
2-4-3. A1 and G Board Dressing ...............................
33
2-4-4. LVDS and Copper Tape Dressing .................
33
3. ADJUSTMENTS
3-1.
White Balance Adjustment .................................
34
4. DIAGRAMS
4-1.
Block Diagrams ..................................................
35
4-1-1. Display Unit (LDM-3210/4210) .....................
35
4-1-2. Media Receiver Unit (MBD-MRX1D) ...........
39
4-2.
Circuit Board Location ........................................
44
4-2-1. Display Unit (LDM-3210) ..............................
44
4-2-2. Display Unit (LDM-4210) ..............................
44
4-2-3. Media Receiver Unit (MBD-MRX1D) ...........
44
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
44
4-3-1. Display Unit (LDM-3210/4210) .....................
45
4-3-2. Media Receiver Unit (MBD-MRX1D) ...........
65
A1 Board Schematic Diagram ............................
65
A1 Printed Wiring Board ..................................
77
G Board Schematic Diagram ..............................
79
G Printed Wiring Board ....................................
80
H5 Board Schematic Diagram ............................
81
H5 Printed Wiring Board ..................................
82
IF Board Schematic Diagram ..............................
83
IF Printed Wiring Board ...................................
84
N2 Board Schematic Diagram ............................
85
N2 Printed Wiring Board ..................................
84
U2 Schematic Diagram .......................................
86
U2 Printed Wiring Board ..................................
87
4-4.
Semiconductors ..................................................
88
5. EXPLODED VIEWS
5-1.
Display Unit (LDM-3210) ...............................
91
5-1-1. Display Unit-1 .................................................
91
5-1-2. Display Unit-2 .................................................
92
5-2.
Display Unit (LDM-4210) ...............................
93
5-2-1. Display Unit-1 .................................................
93
5-2-2. Display Unit-2 .................................................
94
5-2-3. Display Unit-3 .................................................
95
5-3.
Packing Materials for Display
Unit (LDM-3210) .............................................
96
5-4.
Packing Materials for Display
Unit (LDM-4210) .............................................
97
5-5.
Media Receiver Unit-1 (MBD-MRX1D) ...........
98
5-6.
Media Receiver Unit-2 (MBD-MRX1D) ...........
99
5-7.
Media Receiver Unit-3 (MBD-MRX1D) ......... 100
5-8.
Packing Materials for Media Receiver
Unit (MBD-MRX1D) ........................................ 101
6. ELECTRICAL PARTS LIST
6-1.
Display Unit (LDM-3210/4010) ...................... 102
6-2.
Media Receiver Unit (MBD-MRX1) ................. 127
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
MRX1
RM-Y1013
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The circuit boards listed below [Table 1] used in these models
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
Table 1
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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