Sony KDL-65HX729 (serv.man2) Service Manual ▷ View online
49
KDL-65HX729
KDL-65HX729
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
HMS3
A-1806-495-A
HMS3 BOARD, MOUNTED
CAPACITOR
C101
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C102
1-112-779-11
CERAMIC CHIP
0.047µF 10% 25V
C103
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C104
1-114-807-11
CERAMIC CHIP
0.015µF 10% 25V
C105
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C106
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C107
1-114-807-11
CERAMIC CHIP
0.015µF 10% 25V
C108
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C109
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
CONNECTOR
CN100
1-820-180-11
HEADER ASSEMBLY (PRINT PWB)
DIODE
D100 6-502-934-01 DIODE
DB2S31100K8
D101 6-502-934-01 DIODE
DB2S31100K8
IC
IC100 8-759-337-40 IC
NJM2904V(TE2)
TRANSISTOR
Q100
6-551-321-01
TRANSISTOR
RT3WLMM-TP-1F
RESISTOR
* R104
1-250-559-11
METAL CHIP
470K
1%
1/16W
R107
1-218-989-11
METAL CHIP
1M
5%
1/16W
R110
1-218-973-11
METAL CHIP
47K
5%
1/16W
R112
1-248-243-81
METAL CHIP
8.2M
5%
1/16W
R125
1-218-981-91
METAL CHIP
220K
5%
1/16W
R126
1-218-981-91
METAL CHIP
220K
5%
1/16W
R127
1-218-973-11
METAL CHIP
47K
5%
1/16W
R128
1-248-243-81
METAL CHIP
8.2M
5%
1/16W
* R129
1-250-543-11
METAL CHIP
100K
1%
1/16W
* R130
1-250-507-11
METAL CHIP
3.3K
1%
1/16W
* R131
1-250-501-11
METAL CHIP
1.8K
1%
1/16W
R132
1-218-965-11
METAL CHIP
10K
5%
1/16W
* R134
1-250-507-11
METAL CHIP
3.3K
1%
1/16W
R136
1-218-990-81
SHORT CHIP
R138
1-250-515-11
METAL CHIP
6.8K
1%
1/16W
SWITCH
* SE100
1-489-437-11
INFRARED RECEIVER SENSOR
RU
A-1820-418-A
RU BOARD, MOUNTED
CAPACITOR
C100
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C102
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C103
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C104
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C105
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C106
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C108
1-112-064-11
CERAMIC CHIP
2.2µF
10% 10V
CONNECTOR
CN100
1-568-426-11
CONNECTOR, D-SUB 9P
CN101
1-820-183-11
HEADER ASSEMBLY (PRINT PWB)
FERRITE BEAD
FB100 1-400-089-21 FERRITE
0µH
IC
IC101 6-705-514-01 IC
MAX3222IPWR
JACK
* J100
1-842-576-11
MINI JACK (RA)
RESISTOR
R101
1-216-864-11
SHORT CHIP
R102
1-216-864-11
SHORT CHIP
R103
1-216-805-11
METAL CHIP
47
5%
1/10W
R105
1-216-821-11
METAL CHIP
1K
5%
1/10W
R106
1-216-864-11
SHORT CHIP
R107
1-216-821-11
METAL CHIP
1K
5%
1/10W
R108
1-216-805-11
METAL CHIP
47
5%
1/10W
R109
1-218-941-81
METAL CHIP
100
5%
1/16W
R110
1-216-809-11
METAL CHIP
100
5%
1/10W
R111
1-216-809-11
METAL CHIP
100
5%
1/10W
R112
1-218-937-11
METAL CHIP
47
5%
1/16W
VARISTOR
VDR100 1-802-078-11
VARISTOR (SMD)
VDR102 1-802-078-11
VARISTOR (SMD)
HMS3 RU
50
KDL-65HX729
KDL-65HX729
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
ACCESSORIES AND PACKING
4-272-961-01
BAG, PROTECTION (1650X1200)
(US ONLY)
X-2580-566-1
CARTON ASSY (VEG 65 US)
(US ONLY)
4-288-003-11
CUSHION, LOWER FRONT (65 DL)
(US ONLY)
4-288-004-11
CUSHION, LOWER REAR (65 DL)
(US ONLY)
4-268-188-11
CUSHION, LOWER (65 DL)
(US ONLY)
4-297-897-01
CUSHION, SIDE (65 DL)
(US ONLY)
4-268-187-11
CUSHION, UPPER (65 DL)
(US ONLY)
4-291-833-21
LABEL, ENERGY GUIDE (VEG)
(US ONLY)
3-674-673-11
STOPPER (A)
(US ONLY)
4-268-190-11
TRAY (65 DL-2P)
(US ONLY)
A-1
KDL-65HX729
KDL-65HX729
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-883-861-53
English
2011HJ74WEB-1
Printed in USA
© 2011.8
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A: ENCRYPTION KEY COMPONENTS
Encryption key components developed by Sony Corporation contain confidential
information, and shall be handled under the non-disclosure obligations provided in the
applicable agreement with Sony Corporation (and/or its subsidiary).
As part of this agreement specific instructions must be adhered to whenever a Circuit
Board containing encryption key components is repaired and/or replaced pursuant to the
following:
1) In the service manual the Circuit Board(s) containing encryption key components
1) In the service manual the Circuit Board(s) containing encryption key components
shall be identified with a red outline and a .
2) Only repair boards or components listed in the service manual shall be utilized for
replacement and/or repair.
3) Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4) Any board in which the Servicer replaces an encryption key component must be
4) Any board in which the Servicer replaces an encryption key component must be
placed back into the set it orignally came from and the replaced defective component
MUST BE DESTROYED. Boards cannot be swapped.
5) If a Circuit Board identified with a red outline and a in the service manual is deemed
to be defective:
a) and if a core charge is imposed and is covered under the product warranty, the
defective un-repaired or modified board MUST BE RETURNED to Sony.
b) and if the core charge is NOT covered under the product warranty, the defective
un-repaired or modified board MUST BE DESTROYED.
6) If a unit is destroyed (such as field scrap), the Circuit Board identified with a
red outline and a in the service manual MUST BE DESTROYED.
A-1
KDL-65HX729
KDL-65HX729
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-883-861-53
English
2011HJ74WEB-1
Printed in USA
© 2011.8
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A: ENCRYPTION KEY COMPONENTS
Encryption key components developed by Sony Corporation contain confidential
information, and shall be handled under the non-disclosure obligations provided in the
applicable agreement with Sony Corporation (and/or its subsidiary).
As part of this agreement specific instructions must be adhered to whenever a Circuit
Board containing encryption key components is repaired and/or replaced pursuant to the
following:
1) In the service manual the Circuit Board(s) containing encryption key components
1) In the service manual the Circuit Board(s) containing encryption key components
shall be identified with a red outline and a .
2) Only repair boards or components listed in the service manual shall be utilized for
replacement and/or repair.
3) Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4) Any board in which the Servicer replaces an encryption key component must be
4) Any board in which the Servicer replaces an encryption key component must be
placed back into the set it orignally came from and the replaced defective component
MUST BE DESTROYED. Boards cannot be swapped.
5) If a Circuit Board identified with a red outline and a in the service manual is deemed
to be defective:
a) and if a core charge is imposed and is covered under the product warranty, the
defective un-repaired or modified board MUST BE RETURNED to Sony.
b) and if the core charge is NOT covered under the product warranty, the defective
un-repaired or modified board MUST BE DESTROYED.
6) If a unit is destroyed (such as field scrap), the Circuit Board identified with a
red outline and a in the service manual MUST BE DESTROYED.
