Sony KDL-46HX820 / KDL-55HX820 (serv.man3) Service Manual ▷ View online
49
KDL-46HX820/55HX820
KDL-46HX820/55HX820
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
HEM2
A-1792-512-A
HEM2 BOARD, MOUNTED
CAPACITOR
C301
1-100-916-11
CERAMIC CHIP
0.1µF
10%
16V
C302
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C303
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C304
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C305
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C306
1-135-366-11
ELECT CHIP
100µF
20%
16V
C307
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C308
1-100-916-11
CERAMIC CHIP
0.1µF
10%
16V
C309
1-135-366-11
ELECT CHIP
100µF
20%
16V
C310
1-114-553-11
CERAMIC CHIP
10µF
10%
16V
C311
1-100-916-11
CERAMIC CHIP
0.1µF
10%
16V
C319
1-100-912-11
CERAMIC CHIP
1µF
10%
25V
DIODE
*
D301
6-503-473-01
DIODE
IR-LED-SFH4250S
*
D302
6-503-473-01
DIODE
IR-LED-SFH4250S
*
D305
6-503-473-01
DIODE
IR-LED-SFH4250S
*
D306
6-503-473-01
DIODE
IR-LED-SFH4250S
D309 6-502-979-01 DIODE
DA4J104K0L
TRANSISTOR
* Q301
6-552-755-01
TRANSISTOR
SSM3K36UFV-L3SOF
* Q302
6-552-755-01
TRANSISTOR
SSM3K36UFV-L3SOF
Q303 6-552-408-01 TRANSISTOR
DSC500100L
Q304 6-552-408-01 TRANSISTOR
DSC500100L
Q305
6-551-551-01 TRANSISTOR
RT3N77M-TP-1
RESISTOR
R301
1-216-864-11
SHORT CHIP
R313
1-216-864-11
SHORT CHIP
R318
1-220-802-11
METAL CHIP
3.3
5%
1/16W
R322
1-220-802-11
METAL CHIP
3.3
5%
1/16W
*
R325
1-250-509-11
METAL CHIP
3.9K
1%
1/16W
*
R326
1-250-499-11
METAL CHIP
1.5K
1%
1/16W
R327
1-250-451-11
METAL CHIP
15
1%
1/16W
R328
1-250-451-11
METAL CHIP
15
1%
1/16W
R329
1-250-451-11
METAL CHIP
15
1%
1/16W
*
R333
1-250-509-11
METAL CHIP
3.9K
1%
1/16W
*
R334
1-250-499-11
METAL CHIP
1.5K
1%
1/16W
R335
1-250-451-11
METAL CHIP
15
1%
1/16W
R336
1-250-451-11
METAL CHIP
15
1%
1/16W
R337
1-250-451-11
METAL CHIP
15
1%
1/16W
R339
1-218-969-11
METAL CHIP
22K
5%
1/16W
R340
1-250-519-11
METAL CHIP
10K
1%
1/16W
R343
1-216-864-11
SHORT CHIP
RESISTOR BRIDGE
RB301
1-250-267-21
RES, NETWORK 33K (1005X4)
HLT2
A-1792-920-A
HLT2 BOARD, MOUNTED
CAPACITOR
C101
1-112-068-11
CERAMIC CHIP
220pF
10%
50V
C102
1-100-909-11
CERAMIC CHIP
10µF
10%
6.3V
C108
1-100-916-11
CERAMIC CHIP
0.1µF
10%
16V
C109
1-164-874-11
CERAMIC CHIP
100pF
5%
50V
C110
1-164-874-11
CERAMIC CHIP
100pF
5%
50V
CONNECTOR
*
CN100
1-820-189-11
HEADER ASSEMBLY (PRINT PWB) 12P
DIODE
* D100 6-502-294-01 DIODE
SML-D13M8WT86S
D101
6-502-196-01
DIODE
SML-D12Y8WT86SP
* D104 6-502-294-01 DIODE
SML-D13M8WT86S
D105
6-502-598-01
DIODE
SML-D12U8WT86
TRANSISTOR
Q100
6-551-690-01 TRANSISTOR
RT3N11M-TP-1
Q103
6-551-690-01 TRANSISTOR
RT3N11M-TP-1
RESISTOR
*
R102
1-250-469-11
METAL CHIP
82
1%
1/16W
*
R114
1-250-469-11
METAL CHIP
82
1%
1/16W
*
R115
1-250-489-11
METAL CHIP
560
1%
1/16W
R118
1-218-941-81
METAL CHIP
100
5%
1/16W
R119
1-218-937-11
METAL CHIP
47
5%
1/16W
RESISTOR BRIDGE
RB100
1-234-371-21
RES, NETWORK 47 (1005X4)
HEM2 HLT2
50
KDL-46HX820/55HX820
KDL-46HX820/55HX820
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
ACCESSORIES AND PACKING
4-272-960-01
BAG, PROTECTION (1450X975)
(KDL-46HX820 US ONLY)
4-272-961-01
BAG, PROTECTION (1600X1200)
(KDL-55HX820 US ONLY)
X-2580-552-1
CARTON ASSY (POR 46 US)
(KDL-46HX820 US ONLY)
X-2580-556-1
CARTON ASSY (POR 55 US)
(KDL-55HX820 US ONLY)
4-257-414-11
CUSHION, LOWER (46 EL)
(KDL-46HX820 US ONLY)
4-257-417-11
CUSHION, LOWER (55 EL)
(KDL-55HX820 US ONLY)
4-268-133-11
CUSHION, SIDE CENTER L (46 EL)
(KDL-46HX820 US ONLY)
4-268-135-11
CUSHION, SIDE CENTER L (55 EL)
(KDL-55HX820 US ONLY)
4-268-134-11
CUSHION, SIDE CENTER R (46 EL)
(KDL-46HX820 US ONLY)
4-268-136-11
CUSHION, SIDE CENTER R (55 EL)
(KDL-55HX820 US ONLY)
4-268-137-11
CUSHION, TERMINAL
(US ONLY)
4-274-982-01
CUSHION, UPPER (46 ELU)
(KDL-46HX820 US ONLY)
4-257-416-11
CUSHION, UPPER (55 EL)
(KDL-55HX820 US ONLY)
2-291-502-02
LABEL, ENERGY GUIDE
(KDL-46HX820 US ONLY)
2-291-502-22
LABEL, ENERGY GUIDE
(KDL-55HX820 US ONLY)
3-674-673-11
STOPPER (A)
(US ONLY)
4-268-164-11
TRAY (46 EL-2P)
(KDL-46HX820 US ONLY)
4-268-172-11
TRAY (55 EL-2P)
(KDL-55HX820 US ONLY)
A-1
KDL-46HX820/55HX820
KDL-46HX820/55HX820
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-888-418-53
English
2011CJ74WEB-1
Printed in USA
© 2011.3
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A: ENCRYPTION KEY COMPONENTS
Encryption key components developed by Sony Corporation contain confidential
information, and shall be handled under the non-disclosure obligations provided in the
applicable agreement with Sony Corporation (and/or its subsidiary).
As part of this agreement specific instructions must be adhered to whenever a Circuit
Board containing encryption key components is repaired and/or replaced pursuant to the
following:
1) In the service manual the Circuit Board(s) containing encryption key components
1) In the service manual the Circuit Board(s) containing encryption key components
shall be identified with a red outline and a .
2) Only repair boards or components listed in the service manual shall be utilized for
replacement and/or repair.
3) Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4) Any board in which the Servicer replaces an encryption key component must be
4) Any board in which the Servicer replaces an encryption key component must be
placed back into the set it orignally came from and the replaced defective component
MUST BE DESTROYED. Boards cannot be swapped.
5) If a Circuit Board identified with a red outline and a in the service manual is deemed
to be defective:
a) and if a core charge is imposed and is covered under the product warranty, the
defective un-repaired or modified board MUST BE RETURNED to Sony.
b) and if the core charge is NOT covered under the product warranty, the defective
un-repaired or modified board MUST BE DESTROYED.
6) If a unit is destroyed (such as field scrap), the Circuit Board identified with a
red outline and a in the service manual MUST BE DESTROYED.
A-1
KDL-46HX820/55HX820
KDL-46HX820/55HX820
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-888-418-53
English
2011CJ74WEB-1
Printed in USA
© 2011.3
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A: ENCRYPTION KEY COMPONENTS
Encryption key components developed by Sony Corporation contain confidential
information, and shall be handled under the non-disclosure obligations provided in the
applicable agreement with Sony Corporation (and/or its subsidiary).
As part of this agreement specific instructions must be adhered to whenever a Circuit
Board containing encryption key components is repaired and/or replaced pursuant to the
following:
1) In the service manual the Circuit Board(s) containing encryption key components
1) In the service manual the Circuit Board(s) containing encryption key components
shall be identified with a red outline and a .
2) Only repair boards or components listed in the service manual shall be utilized for
replacement and/or repair.
3) Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4) Any board in which the Servicer replaces an encryption key component must be
4) Any board in which the Servicer replaces an encryption key component must be
placed back into the set it orignally came from and the replaced defective component
MUST BE DESTROYED. Boards cannot be swapped.
5) If a Circuit Board identified with a red outline and a in the service manual is deemed
to be defective:
a) and if a core charge is imposed and is covered under the product warranty, the
defective un-repaired or modified board MUST BE RETURNED to Sony.
b) and if the core charge is NOT covered under the product warranty, the defective
un-repaired or modified board MUST BE DESTROYED.
6) If a unit is destroyed (such as field scrap), the Circuit Board identified with a
red outline and a in the service manual MUST BE DESTROYED.
