Sony KDL-46HX729 / KDL-55HX729 (serv.man2) Service Manual ▷ View online
53
KDL-46HX729/55HX729
KDL-46HX729/55HX729
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
CRYSTAL
*
X1401
1-814-501-11
QUARTZ CRYSTAL UNIT
X1801 1-814-238-11 VIBRATOR,
CRYSTAL
*
X1801
1-814-475-11
QUARTZ CRYSTAL UNIT
X5000
1-813-877-11
QUARTZ CRYSTAL UNIT
X5000 1-814-304-11 VIBRATOR,
CRYSTAL
*
X9000
1-814-471-11
QUARTZ CRYSTAL UNIT
X9000
1-814-485-11
QUARTZ CRYSTAL UNIT
X9001 1-781-525-11 VIBRATOR,
CRYSTAL
*
X9001
1-814-476-11
QUARTZ CRYSTAL UNIT
G5
1-474-306-11
G5 BOARD, COMPLETE
(KDL-46HX729
ONLY)
Component level repair information is not available.
G6
1-474-331-11
G6 BOARD, COMPLETE
(KDL-55HX729
ONLY)
Component level repair information is not available.
G7
1-474-305-11
G7 BOARD, COMPLETE
(KDL-55HX729
ONLY)
Component level repair information is not available.
HEM2
A-1792-512-A
HEM2 BOARD, MOUNTED
CAPACITOR
C301 1-100-916-11 CERAMIC
CHIP
0.1
μF 10% 16V
C302 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C303 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C304 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C305 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C306 1-135-366-11 ELECT
CHIP
100
μF 20% 16V
C307 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C308 1-100-916-11 CERAMIC
CHIP
0.1
μF 10% 16V
C309 1-135-366-11 ELECT
CHIP
100
μF 20% 16V
C310 1-114-553-11 CERAMIC
CHIP
10
μF 10%
16V
C311 1-100-916-11 CERAMIC
CHIP
0.1
μF 10% 16V
C319 1-100-912-11 CERAMIC
CHIP
1
μF 10%
25V
DIODE
* D301 6-503-473-01 DIODE
IR-LED-SFH4250S
* D302 6-503-473-01 DIODE
IR-LED-SFH4250S
* D305 6-503-473-01 DIODE
IR-LED-SFH4250S
* D306 6-503-473-01 DIODE
IR-LED-SFH4250S
D309 6-502-979-01 DIODE
DA4J104K0L
TRANSISTOR
* Q301 6-552-755-01 TRANSISTOR
SSM3K36UFV-L3SOF
* Q302 6-552-755-01 TRANSISTOR
SSM3K36UFV-L3SOF
Q303 6-552-408-01 TRANSISTOR
DSC500100L
Q304 6-552-408-01 TRANSISTOR
DSC500100L
Q305 6-551-551-01 TRANSISTOR
RT3N77M-TP-1
RESISTOR
R301 1-216-864-11 SHORT
CHIP
R313 1-216-864-11 SHORT
CHIP
R318 1-220-802-11 METAL
CHIP
3.3 5% 1/16W
R322 1-220-802-11 METAL
CHIP
3.3 5% 1/16W
* R325 1-250-509-11 METAL
CHIP
3.9K 1% 1/16W
* R326 1-250-499-11 METAL
CHIP
1.5K 1% 1/16W
R327 1-250-451-11 METAL
CHIP
15
1% 1/16W
R328 1-250-451-11 METAL
CHIP
15
1% 1/16W
R329 1-250-451-11 METAL
CHIP
15
1% 1/16W
* R333 1-250-509-11 METAL
CHIP
3.9K 1% 1/16W
* R334 1-250-499-11 METAL
CHIP
1.5K 1% 1/16W
R335 1-250-451-11 METAL
CHIP
15
1% 1/16W
R336 1-250-451-11 METAL
CHIP
15
1% 1/16W
R337 1-250-451-11 METAL
CHIP
15
1% 1/16W
R339 1-218-969-11 METAL
CHIP
22K 5% 1/16W
R340 1-250-519-11 METAL
CHIP
10K 1% 1/16W
R343 1-216-864-11 SHORT
CHIP
RESISTOR BRIDGE
RB301
1-250-267-21
RES, NETWORK 33K (1005X4)
HEM2
BATV G5 G6 G7
54
KDL-46HX729/55HX729
KDL-46HX729/55HX729
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
HLR2
A-1792-879-A
HLR2 BOARD, MOUNTED
CAPACITOR
C102
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C108
1-100-916-11
CERAMIC CHIP
0.1µF
10% 16V
C109
1-164-874-11
CERAMIC CHIP
100pF
5%
50V
C110
1-164-874-11
CERAMIC CHIP
100pF
5%
50V
CONNECTOR
CN100
1-821-139-11
HEADER ASSEMBLY FOR PWB
DIODE
* D100 6-502-294-01 DIODE
SML-D13M8WT86S
D101 6-502-196-01 DIODE
SML-D12Y8WT86SP
* D103 6-502-294-01 DIODE
SML-D13M8WT86S
D104
6-502-598-01
DIODE
SML-D12U8WT86
RESISTOR
R102
1-218-952-11
METAL CHIP
820
5%
1/16W
R103
1-218-956-11
METAL CHIP
1.8K
5%
1/16W
R111
1-218-952-11
METAL CHIP
820
5%
1/16W
R112
1-218-957-11
METAL CHIP
2.2K
5%
1/16W
R115
1-218-941-81
METAL CHIP
100
5%
1/16W
R116
1-218-937-11
METAL CHIP
47
5%
1/16W
RESISTOR BRIDGE
RB100
1-234-371-11
RES, NETWORK 47 (1005X4)
VARISTOR
VDR100 1-802-090-21
VARISTOR, CHIP
VDR101 1-802-090-21
VARISTOR, CHIP
VDR103 1-802-090-21
VARISTOR, CHIP
VDR104 1-802-090-21
VARISTOR, CHIP
VDR105 1-802-090-21
VARISTOR, CHIP
VDR107 1-802-090-21
VARISTOR, CHIP
z
HLR2
HMS3
A-1806-495-A
HMS3 BOARD, MOUNTED
CAPACITOR
C101
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C102
1-112-779-11
CERAMIC CHIP
0.047µF 10% 25V
C103
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C104
1-114-807-11
CERAMIC CHIP
0.015µF 10% 25V
C105
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C106
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C107
1-114-807-11
CERAMIC CHIP
0.015µF 10% 25V
C108
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
C109
1-114-332-11
CERAMIC CHIP
22µF
10% 6.3V
CONNECTOR
CN100
1-820-180-11
HEADER ASSEMBLY (PRINT PWB)
DIODE
D100 6-502-934-01 DIODE
DB2S31100K8
D101 6-502-934-01 DIODE
DB2S31100K8
IC
IC100 8-759-337-40 IC
NJM2904V(TE2)
TRANSISTOR
Q100
6-551-321-01
TRANSISTOR
RT3WLMM-TP-1F
RESISTOR
* R104
1-250-559-11
METAL CHIP
470K
1%
1/16W
R107
1-218-989-11
METAL CHIP
1M
5%
1/16W
R110
1-218-973-11
METAL CHIP
47K
5%
1/16W
R112
1-248-243-81
METAL CHIP
8.2M
5%
1/16W
R125
1-218-981-91
METAL CHIP
220K
5%
1/16W
R126
1-218-981-91
METAL CHIP
220K
5%
1/16W
R127
1-218-973-11
METAL CHIP
47K
5%
1/16W
R128
1-248-243-81
METAL CHIP
8.2M
5%
1/16W
* R129
1-250-543-11
METAL CHIP
100K
1%
1/16W
* R130
1-250-507-11
METAL CHIP
3.3K
1%
1/16W
* R131
1-250-501-11
METAL CHIP
1.8K
1%
1/16W
R132
1-218-965-11
METAL CHIP
10K
5%
1/16W
* R134
1-250-507-11
METAL CHIP
3.3K
1%
1/16W
R136
1-218-990-81
SHORT CHIP
R138
1-250-515-11
METAL CHIP
6.8K
1%
1/16W
HMS3
55
KDL-46HX729/55HX729
KDL-46HX729/55HX729
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
SWITCH
* SE100
1-489-437-11
INFRARED RECEIVER SENSOR
RU
A-1820-418-A
RU BOARD, MOUNTED
CAPACITOR
C100
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C102
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C103
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C104
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C105
1-100-909-11
CERAMIC CHIP
10µF
10% 6.3V
C106
1-114-325-11
CERAMIC CHIP
0.1µF
10% 25V
C108
1-112-064-11
CERAMIC CHIP
2.2µF
10% 10V
CONNECTOR
CN100
1-568-426-11
CONNECTOR, D-SUB 9P
CN101
1-820-183-11
HEADER ASSEMBLY (PRINT PWB)
FERRITE BEAD
FB100 1-400-089-21 FERRITE
0µH
IC
IC101 6-705-514-01 IC
MAX3222IPWR
JACK
* J100
1-842-576-11
MINI JACK (RA)
RESISTOR
R101
1-216-864-11
SHORT CHIP
R102
1-216-864-11
SHORT CHIP
R103
1-216-805-11
METAL CHIP
47
5%
1/10W
R105
1-216-821-11
METAL CHIP
1K
5%
1/10W
R106
1-216-864-11
SHORT CHIP
R107
1-216-821-11
METAL CHIP
1K
5%
1/10W
R108
1-216-805-11
METAL CHIP
47
5%
1/10W
R109
1-218-941-81
METAL CHIP
100
5%
1/16W
R110
1-216-809-11
METAL CHIP
100
5%
1/10W
R111
1-216-809-11
METAL CHIP
100
5%
1/10W
R112
1-218-937-11
METAL CHIP
47
5%
1/16W
VARISTOR
VDR100 1-802-078-11
VARISTOR (SMD)
VDR102 1-802-078-11
VARISTOR (SMD)
HMS3 RU
ACCESSORIES AND PACKING
3-209-296-34
BAG, PROTECTION
(US ONLY)
X-2580-572-1
CARTON ASSY (VEG 46 US)
(KDL-46HX729 US ONLY)
X-2580-562-1
CARTON ASSY (VEG 55 US)
(KDL-55HX729 US ONLY)
4-260-890-11
CUSHION, LOWER (SYL 46)
(KDL-46HX729 US ONLY)
4-260-893-11
CUSHION, LOWER (SYL 55)
(KDL-55HX729 US ONLY)
4-269-539-11
CUSHION, SIDE CENTER L (SYL 55)
(KDL-55HX729 US ONLY)
4-269-540-11
CUSHION, SIDE CENTER R (SYL 55)
(KDL-55HX729 US ONLY)
4-270-472-11
CUSHION, T (BAT-V)
(KDL-55HX729 US ONLY)
4-260-889-11
CUSHION, UPPER (SYL 46)
(KDL-46HX729 US ONLY)
4-260-892-11
CUSHION, UPPER (SYL 55)
(KDL-55HX729 US ONLY)
2-291-833-02
LABEL, ENERGY GUIDE
(KDL-46HX729 US ONLY)
2-291-833-12
LABEL, ENERGY GUIDE
(KDL-55HX729 US ONLY)
3-674-673-11
STOPPER (A)
(KDL-55HX729 US ONLY)
4-268-385-11
TRAY (SYL55-2P)
(KDL-55HX729 US ONLY)
A-1
KDL-46HX729/55HX729
KDL-46HX729/55HX729
Sony Corporation
Sony Technology Center
Technical Services
Service Publication Department
9-888-421-53
English
2011DJ74WEB-1
Printed in USA
© 2011.4
is a trademark of Sony Electronics
Reproduction in whole or part without written permission is prohibited. All rights reserved
APPENDIX A: ENCRYPTION KEY COMPONENTS
Encryption key components developed by Sony Corporation contain confidential
information, and shall be handled under the non-disclosure obligations provided in the
applicable agreement with Sony Corporation (and/or its subsidiary).
As part of this agreement specific instructions must be adhered to whenever a Circuit
Board containing encryption key components is repaired and/or replaced pursuant to the
following:
1) In the service manual the Circuit Board(s) containing encryption key components
1) In the service manual the Circuit Board(s) containing encryption key components
shall be identified with a red outline and a .
2) Only repair boards or components listed in the service manual shall be utilized for
replacement and/or repair.
3) Disassembly, decryption, or reverse-engineering component(s) is strictly prohibited.
4) Any board in which the Servicer replaces an encryption key component must be
4) Any board in which the Servicer replaces an encryption key component must be
placed back into the set it orignally came from and the replaced defective component
MUST BE DESTROYED. Boards cannot be swapped.
5) If a Circuit Board identified with a red outline and a in the service manual is deemed
to be defective:
a) and if a core charge is imposed and is covered under the product warranty, the
defective un-repaired or modified board MUST BE RETURNED to Sony.
b) and if the core charge is NOT covered under the product warranty, the defective
un-repaired or modified board MUST BE DESTROYED.
6) If a unit is destroyed (such as field scrap), the Circuit Board identified with a
red outline and a in the service manual MUST BE DESTROYED.
