Sony KDL-32S2510 / KDL-32S2520 / KDL-32S2530 / KDL-40S2510 / KDL-40S2530 / KDL-46S2510 / KDL-46S2530 Service Manual ▷ View online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-32/40/46S2510_KDL-32S2520_KDL-32/40/46S2530
Date Part Number Description of Revisions
Version
1.0
9-927-541-01
2006.10
Original Manual.
2.0
9-927-541-02
2007.03
Correction of ‘B2H’ board part number.
(P.70 & P.83)
- 1 -
WAX2T
RM-ED008
SERVICE MANUAL
WAX2T
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-32S2510
RM-ED008
UK
KDL-40S2510
RM-ED008
UK
KDL-46S2510
RM-ED008
UK
KDL-32S2520
RM-ED008
UK
KDL-32S2530
RM-ED008
UK
KDL-40S2530
RM-ED008
UK
KDL-46S2530
RM-ED008
UK
RM-ED008
FLAT PANEL COLOR TV
KDL-32S2510 / KDL-40S2510 / KDL-46S2510 / KDL-32S2520
KDL-32S2530 / KDL-40S2530 / KDL-46S2530
KDL-32S2530 / KDL-40S2530 / KDL-46S2530
KDL-32S2510
RM-ED008
AEP
KDL-40S2510
RM-ED008
AEP
KDL-46S2510
RM-ED008
AEP
KDL-32S2520
RM-ED008
AEP
KDL-32S2530
RM-ED008
AEP
KDL-40S2530
RM-ED008
AEP
KDL-46S2530
RM-ED008
AEP
- 2 -
WAX2T
RM-ED008
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
6
Self Diagnosis .....................................................
7
1. GENERAL ...................................................................
8
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
18
2-2.
Stand Removal ....................................................
18
2-3.
Vesa Bracket Removal ........................................
19
2-4.
AC Inlet Removal ...............................................
19
2-5.
Speaker Removal ................................................
20
2-6.
AE and TUE Board Removal .............................
20
2-7.
B2H and FEE Board Removal ............................
21
2-8.
G1 or G2A Board Removal ................................
21
2-9.
H1E Board Removal ...........................................
22
2-10. H2E or H46E Board Removal ............................
22
2-11. H3E Board Removal ...........................................
23
2-12. LCD Panel Removal ...........................................
23
3. SET-UP ADJUSTMENTS
3-1.
How to enter Service Mode ...............................
24
3-2.
Signal Level Adjustment ....................................
24
3-2-1. Set up of AD calibration1 adjustment for
terrestrial analog ...............................................
24
3-2-2. Y signal calibration1 adjustment for
terrestrial analog ...............................................
24
3-2-3. Set up of C signal calibration1 adjustment for
terrestrial analog ...............................................
24
3-2-4. C signal calibration1 adjustment for
terrestrial analog ...............................................
25
3-2-5. Set up of AD calibration1 adjustment for
video ................................................................
25
3-2-6. Y signal calibration1 adjustment for video ......
25
3-2-7. Set up of C signal calibration1 adjustment for
video ................................................................
25
3-2-8. C signal calibration1 adjustment for video ......
25
3-2-9. Set up of AD calibration2 adjustment for
video ................................................................
25
3-2-10. Y signal calibration2 adjustment for video ....
25
3-2-11. Set up of C signal calibration2 adjustment for
video ..............................................................
26
3-2-12. C signal calibration2 adjustment for video ....
26
3-3.
Gamma Adjustment ...........................................
26
3-3-1. Set up mode for Gamma Adjustment ..............
26
3-3-2. Set up Trident internal SG and brightness
measurement ....................................................
26
3-4.
White Balance Adjustment .................................
26
3-4-1. Set up mode for White Balance Adjustment ...
26
3-4-2. White Balance of colour temperature “Cool” ..
26
3-4-3. White Balance of colour temperature “Neutral”
27
3-4-4. White Balance of colour temperature “Warm1”
27
3-4-5. White Balance of colour temperature “Warm2”
28
3-5.
Panel Replacement .............................................
28
3-6.
Board Replacement ............................................
28
3-6-1. AE Board Replacement ...................................
28
3-6-2. B2H Board Replacement .................................
28
4. DIAGRAMS
4-1.
Block Diagrams(1) .............................................
29
Block Diagrams(2) .............................................
30
Block Diagrams(3) .............................................
31
Block Diagrams(4) .............................................
32
Block Diagrams(5) .............................................
33
4-2.
Circuit Board Location ........................................
33
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
33
AE Board Schematic Diagram ............................
34
AE Printed Wiring Board .................................
38
B2H Board Schematic Diagram ..........................
40
B2H Printed Wiring Board ................................
50
FEE Board Schematic Diagram ..........................
52
FEE Printed Wiring Board .................................
58
G2A Board Schematic Diagram
(40 and 46 inch only) ..........................................
59
G2A Printed Wiring Board
(40 and 46 inch only) ........................................
60
H1E Board Schematic Diagram ..........................
62
H1E Printed Wiring Board ...............................
63
H2E Board Schematic Diagram
(32 and 40 inch only) ..........................................
62
H2E Printed Wiring Board
(32 and 40 inch only) ........................................
63
H3E Board Schematic Diagram ..........................
62
H3E Printed Wiring Board ...............................
63
H46E Board Schematic Diagram
(46 inch only) ......................................................
64
H46E Printed Wiring Board
(46 inch only) ......................................................
63
TUE Schematic Diagram ....................................
64
TUE Printed Wiring Board ...............................
66
4-4.
Semiconductors ..................................................
67
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
69
5-2.
Rear Cover, Stand and Vesa Bracket ..................
71
6. ELECTRICAL PARTS LIST .................................. 73
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
WAX2T
RM-ED008
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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