Sony KDL-26S3000 Service Manual ▷ View online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-26S3000
Date Part Number Description of Revisions
Version
1.0
9-927-579-01
2007.10
Original Manual.
2.0
9-927-579-02
2007.11
Addition of full size schematic diagrams.
(P82-88)
- 1 -
SE2
RM-ED009
SERVICE MANUAL
SE2
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-26S3000
RM-ED009
UK
RM-ED009
FLAT PANEL COLOR TV
KDL-26S3000
KDL-26S3000
RM-ED009
AEP
- 2 -
SE2
RM-ED009
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1. GENERAL ...................................................................
3
Caution ................................................................
3
Specifications ......................................................
5
Connectors ..........................................................
6
Self Diagnosis .....................................................
8
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
9
2-2.
Stand Removal ....................................................
9
2-3.
Loudspeaker Removal ........................................
10
2-4.
B1 Board Removal ..............................................
10
2-5.
GS2 Board Removal ...........................................
11
2-6.
H1S Board Removal ...........................................
11
2-7.
H3S Board Removal ...........................................
12
2-8.
H4S Board Removal ...........................................
12
2-9.
LCD Panel Removal ...........................................
13
3. CIRCUIT ADJUSTMENTS
3-1.
Electrical Adjustments .......................................
14
3-2.
TT Mode ............................................................
16
3-3.
TT OSD Labels ..................................................
17
4. DIAGRAMS
4-1.
Block Diagram ....................................................
18
4-2.
Circuit Board Location ........................................
19
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
19
B1 Board Schematic Diagram .............................
20
GS2 Board Schematic Diagram ..........................
45
H3S Board Schematic Diagram ..........................
50
H1S Board Schematic Diagram ..........................
51
H4S Board Schematic Diagram ..........................
51
B1 Printed Wiring Board ....................................
52
H1S Printed Wiring Board .................................
52
H3S Printed Wiring Board .................................
53
H4S Printed Wiring Board .................................
53
GS2 Printed Wiring Board .................................
54
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
55
5-2.
Rear Cover, Stand & Bezel .................................
56
6. ELECTRICAL PARTS LIST .................................. 57
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
SE2
RM-ED009
SECTION 1 GENERAL
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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1
CAUTION
SECTION 1 GENERAL
