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Model
HDR-HC5 HDR-HC5E HDR-HC7 HDR-HC7E
Pages
61
Size
6.23 MB
Type
PDF
Document
Service Manual
Brand
Device
Movie / LEVEL 3
File
hdr-hc5-hdr-hc5e-hdr-hc7-hdr-hc7e.pdf
Date
PREV: Sony DCR-DVD306E / DCR-DVD308 / DCR-DVD308E / DCR-DVD708 / DCR-DVD708E (serv.man14) Service Manual

Sony HDR-HC5 / HDR-HC5E / HDR-HC7 / HDR-HC7E Service Manual ▷ View online

5. REPAIR  PARTS  LIST
5-1
HDR-HC5/HC5E/HC7/HC7E_L3
(ENGLISH)
NOTE:
•
-XX, -X mean standardized parts, so they may have some differences from
the original one.
•
Items marked “*” are not stocked since they are seldom required for routine
service. Some delay should be anticipated when ordering these items.
•
The mechanical parts with no reference number in the exploded views are not
supplied.
•
Due to standardization, replacements in the parts list may be different from
the parts specified in the diagrams or the components used on the set.
•
CAPACITORS:
uF: 
µF
•
COILS
uH: 
µH
•
RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
•
SEMICONDUCTORS
In each case, u: 
µ, for example:
uA...: 
µA... , uPA... , µPA... ,
uPB... , 
µPB... , uPC... , µPC... ,
uPD..., 
µPD...
When indicating parts by reference number,
please include the board name.
(JAPANESE)
•
Abbreviation
AR
: Argentine model
AUS : Australian model
BR
: Brazilian model
CH
: Chinese model
CND : Canadian model
EE
: East European model
HK
: Hong Kong model
J
: Japanese model
JE
: Tourist model
KR
: Korea model
NE
: North European model
The components identified by mark 
0
 or
dotted line with mark 
0
 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0
 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.
【使用上の注意】
•
ここに記載されている部品は, 補修用部品であるため, 回路図及び
セットに付いている部品と異なる場合があります。
•
-XX, -Xは標準化部品のため, セットに付いている部品と異なる場合
があります。
•
*
印の部品は常備在庫しておりません。
•
コンデンサの単位でuFはμFを示します。
•
抵抗の単位Ωは省略してあります。
金  被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
•
インダクタの単位でuHはμHを示します。
•
半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれμ
A..., μPA..., μPB..., μPC..., μPD...を示します。
0印の部品，または0印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
お願い
5-19
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
5-2. ELECTRICAL  PARTS  LIST
HDR-HC5/HC5E/HC7/HC7E_L3
A-1231-932-A CM-076 BOARD, COMPLETE (HC5/HC5E)
***********************
(IC6901 is not supplied, but this is included in CMOS block assy.)
< CAPACITOR >
C6802
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6803
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6805
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6806
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6808
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6809
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6811
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6812
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6904
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6905
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6906
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6907
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6908
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6909
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6915
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6916
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6917
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6919
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6925
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6928
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6930
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6931
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C8201
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C8202
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C8203
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C8204
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C8205
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C8206
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C8207
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C8208
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C8209
1-100-611-91 CERAMIC CHIP
22uF
20%
6.3V
C8210
1-100-611-91 CERAMIC CHIP
22uF
20%
6.3V
C8211
1-127-760-11 CERAMIC CHIP
4.7uF
10%
6.3V
< CONNECTOR >
* CN6801 1-820-561-11 CONNECTOR, COAXIAL (RECEPTACLE)
< FERRITE BEAD >
FB8201 1-400-833-21 SMD EMI FERRITE
FB8202 1-400-833-21 SMD EMI FERRITE
FB8203 1-400-833-21 SMD EMI FERRITE
FB8204 1-400-833-21 SMD EMI FERRITE
< IC >
IC6801
6-703-977-01 IC   R1114Q331D-TR-FA
* IC6802
6-708-444-01 IC   R1114Q281D-TR-FA
IC6803
6-703-977-01 IC   R1114Q331D-TR-FA
* IC6804
6-708-457-01 IC   R1114Q151D-TR-FA
IC6901
A-1172-742-A CMOS BLOCK ASSY (CMOS IMAGER) (Note 1)
IC8201
6-707-333-01 IC   NJM3230SE7
< COIL >
L6907
1-216-295-91 SHORT CHIP
0 (Note 2)
L6909
1-216-295-91 SHORT CHIP
0 (Note 2)
L6911
1-216-295-91 SHORT CHIP
0 (Note 2)
L6912
1-216-295-91 SHORT CHIP
0 (Note 2)
L6914
1-216-295-91 SHORT CHIP
0 (Note 2)
L8201
1-400-588-11 INDUCTOR
10uH
< RESISTOR >
R6901
1-218-990-81 SHORT CHIP
0
R6903
1-218-933-11 RES-CHIP
22
5%
1/16W
R8201
1-218-965-11 RES-CHIP
10K
5%
1/16W
R8202
1-218-989-11 RES-CHIP
1M
5%
1/16W
R8203
1-218-989-11 RES-CHIP
1M
5%
1/16W
R8204
1-218-965-11 RES-CHIP
10K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB8201 1-234-379-21 RES, NETWORK
22K (1005X4)
< SENSOR >
* SE8201 1-479-022-61 SENSOR, ANGULAR VELOCITY (32.2kHz)
(YAW)
* SE8202 1-479-022-51 SENSOR, ANGULAR VELOCITY (30.8kHz)
(PITCH)
A-1237-309-A CM-077 BOARD, COMPLETE (SERVICE)
(HC7/HC7E)
***********************
(IC6701 is not supplied, but this is included in CMOS block assy.)
< CAPACITOR >
C6607
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6608
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6609
1-100-415-11 CERAMIC CHIP
0.47uF
10%
6.3V
C6610
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6611
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6612
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6613
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6614
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6705
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6706
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6707
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6708
1-125-889-91 CERAMIC CHIP
2.2uF
10%
10V
C6709
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6717
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6718
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6719
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6720
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
C6724
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6725
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
CM-076     CM-077
Note 1: イメージャの交換時は4-4ページの“イメージャ
交換時の注意”を必ずお読みください。
Note 1: Be sure to read “Precautions for Replacement of
Imager” on page 4-3 when changing the imager.
Note 2: Short chips are mounted to the
location where L6907, L6909, L6911,
L6912 and L6914 are printed.
5-20
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-HC5/HC5E/HC7/HC7E_L3
C6729
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6731
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6732
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6733
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6736
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6738
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6739
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C6740
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6743
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C7201
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7202
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7203
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7204
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7205
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C7206
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C7207
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C7208
1-119-923-11 CERAMIC CHIP
0.047uF
10%
10V
C7209
1-100-611-91 CERAMIC CHIP
22uF
20%
6.3V
C7210
1-100-611-91 CERAMIC CHIP
22uF
20%
6.3V
C7211
1-127-760-11 CERAMIC CHIP
4.7uF
10%
6.3V
< CONNECTOR >
* CN6601 1-820-560-11 CONNECTOR, COAXIAL (RECEPTACLE)
< FERRITE BEAD >
FB7201 1-400-833-21 SMD EMI FERRITE
FB7202 1-400-833-21 SMD EMI FERRITE
FB7203 1-400-833-21 SMD EMI FERRITE
FB7204 1-400-833-21 SMD EMI FERRITE
< IC >
IC6603
6-703-977-01 IC   R1114Q331D-TR-FA
* IC6604
6-708-444-01 IC   R1114Q281D-TR-FA
IC6605
6-703-977-01 IC   R1114Q331D-TR-FA
IC6606
6-703-976-01 IC   R1114Q181D-TR-FA
IC6701
A-1209-688-A CMOS BLOCK ASSY (CMOS IMAGER) (Note 1)
IC7201
6-707-333-01 IC   NJM3230SE7
< COIL >
L6702
1-216-295-91 SHORT CHIP
0 (Note 2)
L6704
1-216-295-91 SHORT CHIP
0 (Note 2)
L6705
1-216-295-91 SHORT CHIP
0 (Note 2)
L6706
1-216-295-91 SHORT CHIP
0 (Note 2)
L6707
1-216-295-91 SHORT CHIP
0 (Note 2)
L7201
1-400-588-11 INDUCTOR
10uH
< RESISTOR >
R6703
1-218-990-81 SHORT CHIP
0
R6709
1-218-929-11 RES-CHIP
10
5%
1/16W
R7201
1-218-965-11 RES-CHIP
10K
5%
1/16W
R7202
1-218-989-11 RES-CHIP
1M
5%
1/16W
R7203
1-218-989-11 RES-CHIP
1M
5%
1/16W
R7204
1-218-965-11 RES-CHIP
10K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB7201 1-234-379-21 RES, NETWORK
22K (1005X4)
CM-077
< SENSOR >
* SE7201 1-479-022-61 SENSOR, ANGULAR VELOCITY (32.2kHz)
(YAW)
* SE7202 1-479-022-51 SENSOR, ANGULAR VELOCITY (30.8kHz)
(PITCH)
Note 1: イメージャの交換時は4-4ページの“イメージャ
交換時の注意”を必ずお読みください。
Note 1: Be sure to read “Precautions for Replacement of
Imager” on page 4-3 when changing the imager.
Note 2: Short chips are mounted to the
location where L6702 and L6704 to
L6707 are printed.
5-23
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-HC5/HC5E/HC7/HC7E_L3
A-1231-928-A LD-221 BOARD, COMPLETE (HC7/HC7E)
A-1231-929-A LD-221 BOARD, COMPLETE (HC5/HC5E)
**********************
< CAPACITOR >
C5303
1-164-227-11 CERAMIC CHIP
0.022uF
10%
25V
C5304
1-164-227-11 CERAMIC CHIP
0.022uF
10%
25V
C5305
1-164-874-11 CERAMIC CHIP
100PF
5%
50V
C5306
1-164-874-11 CERAMIC CHIP
100PF
5%
50V
C5308
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C5309
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C5313
1-117-919-11 TANTAL. CHIP
10uF
20%
6.3V
C5314
1-117-920-11 TANTAL. CHIP
10uF
20%
6.3V
C5315
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5316
1-119-750-11 TANTAL. CHIP
22uF
20%
6.3V
C5318
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C5404
1-164-942-11 CERAMIC CHIP
0.0068uF
10%
16V
(HC5/HC5E)
C5405
1-137-987-81 CERAMIC CHIP
0.068uF
10%
10V
C5406
1-137-987-81 CERAMIC CHIP
0.068uF
10%
10V
C5409
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
(HC5/HC5E)
C5409
1-164-939-11 CERAMIC CHIP
0.0022uF
10%
50V
(HC7/HC7E)
C5410
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5411
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
(HC5/HC5E)
C5411
1-164-939-11 CERAMIC CHIP
0.0022uF
10%
50V
(HC7/HC7E)
C5412
1-164-866-11 CERAMIC CHIP
47PF
5%
50V
C5413
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C5414
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5415
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5416
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5417
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5419
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5421
1-165-897-11 TANTAL. CHIP
22uF
20%
10V
C5422
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5423
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5424
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5425
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5427
1-164-930-11 CERAMIC CHIP
330PF
5%
16V
C5428
1-119-750-11 TANTAL. CHIP
22uF
20%
6.3V
C5430
1-127-715-91 CERAMIC CHIP
0.22uF
10%
16V
C5431
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5432
1-119-750-11 TANTAL. CHIP
22uF
20%
6.3V
C5433
1-164-939-11 CERAMIC CHIP
0.0022uF
10%
50V
C5434
1-164-939-11 CERAMIC CHIP
0.0022uF
10%
50V
C5435
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
(HC7/HC7E)
C5436
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
(HC7/HC7E)
C5705
1-165-897-11 TANTAL. CHIP
22uF
20%
10V
(HC7/HC7E)
C5706
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
(HC7/HC7E)
C5707
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
(HC7/HC7E)
C5708
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
(HC7/HC7E)
C5712
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
(HC7/HC7E)
C5713
1-164-939-11 CERAMIC CHIP
0.0022uF
10%
50V
(HC7/HC7E)
C5715
1-164-943-81 CERAMIC CHIP
0.01uF
10%
16V
(HC7/HC7E)
C5716
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
(HC7/HC7E)
C5717
1-107-819-11 CERAMIC CHIP
0.022uF
10%
16V
(HC7/HC7E)
C5719
1-164-943-81 CERAMIC CHIP
0.01uF
10%
16V
(HC7/HC7E)
C5722
1-127-895-91 TANTAL. CHIP
22uF
20%
4V
(HC7/HC7E)
C5723
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
(HC7/HC7E)
C5801
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5803
1-100-611-91 CERAMIC CHIP
22uF
20%
6.3V
< CONNECTOR >
* CN5301 1-817-283-71 CONNECTOR, FPC (ZIF) 51P (HC7/HC7E)
* CN5302 1-817-564-71 CONNECTOR, FPC (ZIF) 33P (HC5/HC5E)
* CN5303 1-817-283-71 CONNECTOR, FPC (ZIF) 51P
* CN5304 1-816-654-51 FFC/FPC CONNECTOR (LIF) 6P
* CN5305 1-816-643-51 FFC/FPC CONNECTOR (LIF) 10P
* CN5306 1-816-655-51 FFC/FPC CONNECTOR (LIF) 8P
< DIODE >
D5301
6-500-044-01 DIODE   DF6A6.8FU (TE85R)
< FERRITE BEAD >
FB5401 1-414-760-21 FERRITE, EMI (SMD) (1608)
< IC >
IC5303
8-759-422-21 IC   NJM4580V (TE2)
* IC5304
6-708-444-01 IC   R1114Q281D-TR-FA
IC5401
8-759-359-49 IC   NJM3414AV (TE2) (HC5/HC5E)
IC5402
8-759-359-49 IC   NJM3414AV (TE2)
IC5403
8-759-359-49 IC   NJM3414AV (TE2)
IC5404
6-708-814-01 IC   BU2343GLU-E2
* IC5703
6-709-026-01 IC   R2J30500LG (HC7/HC7E)
IC5801
6-706-173-01 IC   BD6878GLU-E2
< COIL >
L5301
1-400-588-11 INDUCTOR
10uH
L5401
1-469-555-21 INDUCTOR
10uH
L5701
1-400-588-11 INDUCTOR
10uH (HC7/HC7E)
L5801
1-469-553-21 INDUCTOR
4.7uH
< TRANSISTOR >
Q5301
6-550-384-01 TRANSISTOR
DTC123JMT2L
Q5302
8-729-427-72 TRANSISTOR
XP4501
< RESISTOR >
R5305
1-218-954-11 RES-CHIP
1.2K
5%
1/16W
R5325
1-208-691-11 METAL CHIP
2.2K
0.5%
1/16W
R5326
1-208-691-11 METAL CHIP
2.2K
0.5%
1/16W
R5327
1-219-598-11 METAL CHIP
47K
0.5%
1/16W
LD-221
Page of 61
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