Sony HDR-CX300 / HDR-CX300E / HDR-CX305E / HDR-CX350 / HDR-CX350E / HDR-CX350V / HDR-CX350VE / HDR-CX370 / HDR-CX370E / HDR-CX370V / HDR-XR350 / HDR-XR350E / HDR-XR350V Service Manual ▷ View online
Sony Corporation
SERVICE MANUAL
Revision History
HDR-CX300/CX300E/CX305E/CX350/CX350E/CX350V/CX350VE/CX370/CX370E/CX370V/XR350/XR350E/XR350V/XR350VE_L3
LEVEL
3
Check the SERVICE NOTE (LEVEL 2) before the service.
985276813.pdf
2010E08-1
© 2010.05
Published by Sony Techno Create Corporation
Ver. 1.2 2010.05
DIGITAL HD VIDEO CAMERA RECORDER
9-852-768-13
US Model
Canadian Model
AEP Model
UK Model
North European Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Brazilian Model
Tourist Model
Japanese Model
HDR-CX300/CX300E/CX305E/CX350/CX350E/CX350V/CX350VE/
CX370/CX370E/CX370V/XR350/XR350E/XR350V/XR350VE
RMT-835
Photo: HDR-CX300/Black
Replace the previously issued
SERVICE MANUAL 9-852-768-12
with this Manual.
SERVICE MANUAL 9-852-768-12
with this Manual.
Revised-1
Ver.
Date
History
Contents
S.M. Rev.
issued
1.0
2010.01
Official Release
—
—
1.1
2010.02
Revised-1
(A1 09-465)
(A1 09-465)
• Correction of SCHEMATIC DIAGRAMS
Page
Page
6-2
,
6-3
,
6-4
,
6-5
,
6-15
• Correction of PRINTED WIRING BOARDS
Page
Page
6-22
Yes
1.2
2010.05
Supplement-1
(S1 10-043)
• Change of ELECTRICAL PARTS LIST
• Deletion of SCHEMATIC DIAGRAMS
• Deletion of SCHEMATIC DIAGRAMS
Yes*
*: S.M. revised only top cover.
– 2 –
HDR-CX300/CX300E/CX305E/CX350/CX350E/CX350V/CX350VE/CX370/CX370E/CX370V/XR350/XR350E/XR350V/XR350VE_L3
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
注意
電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
サービス，点検時には次のことにご注意ください。
– ENGLISH –
– JAPANESE –
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
safety checks before releasing the set to the customer.
無鉛半田について
本機には無鉛半田が使用されています。
無鉛半田を使用している基板には，無鉛（Lead Free）を意味
するレッドフリーマークがプリントされています。
無鉛半田を使用している基板には，無鉛（Lead Free）を意味
するレッドフリーマークがプリントされています。
（注意： 基板サイズによっては，無鉛半田を使用していて
もレッドフリーマークがプリントされていないも
のがあります）
のがあります）
：レッドフリーマーク
無鉛半田には，以下の特性があります。
・ 融点が従来の半田よりも約40℃高い。
従来の半田こてをそのまま使用することは可能ですが，
少し長めにこてを当てる必要があります。温度調節機能
のついた半田こてを使用する場合，約350℃に設定して
下さい。
少し長めにこてを当てる必要があります。温度調節機能
のついた半田こてを使用する場合，約350℃に設定して
下さい。
注意：半田こてを長く当てすぎると，基板のパターン（銅
箔）がはがれてしまうことがありますので，注意
して下さい。
して下さい。
・ 粘性が強い
従来の半田よりも粘性が強いため，IC端子などが半田ブ
リッジしないように注意して下さい。
リッジしないように注意して下さい。
・ 従来の半田と混ぜて使用可能
無鉛半田には無鉛半田を追加するのが最適ですが，従来
の半田を追加しても構いません。
の半田を追加しても構いません。
1. 注意事項をお守りください。
サービスのとき特に注意を要する個所については，キャ
ビネット，シャーシ，部品などにラベルや捺印で注意
事項を表示しています。これらの注意書き及び取扱説
明書等の注意事項を必ずお守り下さい。
ビネット，シャーシ，部品などにラベルや捺印で注意
事項を表示しています。これらの注意書き及び取扱説
明書等の注意事項を必ずお守り下さい。
2. 指定部品のご使用を
セットの部品は難燃性や耐電圧など安全上の特性を
持ったものとなっています。従って交換部品は，使用
されていたものと同じ特性の部品を使用して下さい。
特に回路図，部品表に0印で指定されている安全上重
要な部品は必ず指定のものをご使用下さい。
持ったものとなっています。従って交換部品は，使用
されていたものと同じ特性の部品を使用して下さい。
特に回路図，部品表に0印で指定されている安全上重
要な部品は必ず指定のものをご使用下さい。
3. 部品の取付けや配線の引きまわしはもとどおりに
安全上，チューブやテープなどの絶縁材料を使用した
り，プリント基板から浮かして取付けた部品がありま
す。また内部配線は引きまわしやクランパによって発
熱部品や高圧部品に接近しないよう配慮されています
ので，これらは必ずもとどおりにして下さい。
り，プリント基板から浮かして取付けた部品がありま
す。また内部配線は引きまわしやクランパによって発
熱部品や高圧部品に接近しないよう配慮されています
ので，これらは必ずもとどおりにして下さい。
4. サービス後は安全点検を
サービスのために取外したネジ，部品，配線がもとど
おりになっているか，またサービスした個所の周辺を
劣化させてしまったところがないかなどを点検し，安
全性が確保されていることを確認して下さい。
おりになっているか，またサービスした個所の周辺を
劣化させてしまったところがないかなどを点検し，安
全性が確保されていることを確認して下さい。
5. チップ部品交換時の注意
・ 取外した部品は再使用しないで下さい。
・ タンタルコンデンサのマイナス側は熱に弱いため交
換時は注意して下さい。
6. フレキシブルプリント基板の取扱いについて
・ コテ先温度を270℃前後にして行なって下さい。
・ 同一パターンに何度もコテ先を当てないで下さい。
（3回以内）
・ パターンに力が加わらないよう注意して下さい。
HDR-CX300/CX300E/CX305E/CX350/CX350E/CX350V/CX350VE/CX370/CX370E/CX370V/XR350/XR350E/XR350V/XR350VE_L3
2-1
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
2. REPAIR PARTS LIST
(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some
• -XX, -X mean standardized parts, so they may have some
differences from the original one.
• Items marked “*” are not stocked since they are seldom re-
quired for routine service. Some delay should be anticipated
when ordering these items.
when ordering these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may
be different from the parts specified in the diagrams or the
components used on the set.
components used on the set.
• CAPACITORS:
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...:
In each case, u: μ, for example:
uA...:
μA... , uPA... , μPA... ,
uPB...
,
μPB... , uPC... , μPC... ,
uPD...,
μPD...
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は, 補修用部品であるため, 回路
図及びセットに付いている部品と異なる場合があります。
• -XX, -Xは標準化部品のため, セットに付いている部品と異な
る場合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
μA..., μPA..., μPB..., μPC..., μPD...を示します。
The components identified by mark 0
or dotted line with mark 0 are critical
for safety.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
portant le numéro spécifié.
0印の部品，または0印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
を併せて指定してください。
お願い
A-1767-897-A CM-114 BOARD, COMPLETE
**********************
(CP002 (CMOS IMAGER) is not supplied, but this is included in CM-114 complete
board.)
board.)
< CAPACITOR >
C6903 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6905 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6907 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6908 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
* C6909 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C6910 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
* C6912 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C6914 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C6915 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C6916 1-165-887-91 CERAMIC
CHIP 0.22uF 10% 6.3V
* C6917 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C6920 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C6921 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6923 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C6924 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6925 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C6927 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C6928 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C6930 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6932 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
* C6933 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C6935 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C6936 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C6939 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C6940 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C6941 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
< CONNECTOR >
CN6901 1-822-378-11
CONNECTOR, FPC (ZIF) 33P
< COMPOSITION CIRCUIT BLOCK >
CP002
(Not supplied) IMX055CHL-13 (Note 1)
(CP002 (CMOS IMAGER) is supplied included in CM-114 complete board.)
< IC >
* IC6902 6-708-455-01
IC R1114Q271D-TR-FA
< LINE FILTER >
* LF6901 1-457-648-21
COMMON MODE CHOKE COIL
* LF6902 1-457-648-21
COMMON MODE CHOKE COIL
* LF6903 1-457-648-21
COMMON MODE CHOKE COIL
* LF6904 1-457-648-21
COMMON MODE CHOKE COIL
* LF6905 1-457-648-21
COMMON MODE CHOKE COIL
< RESISTOR >
R6919 1-208-927-11 METAL
CHIP
47K
0.5% 1/16W
R6932 1-218-953-11 METAL
CHIP
1K
5%
1/16W
************************************************************
A-1760-173-A MM-088 BOARD, COMPLETE
(CX300/CX300E/CX305E)
A-1769-635-A MM-088 BOARD, COMPLETE (SERVICE)
(CX350/CX350E/CX350V/CX350VE)
A-1769-636-A MM-088 BOARD, COMPLETE (SERVICE)
(CX370/CX370E/CX370V)
**********************
(IC8701 and IC8801 (CX350/CX350E/CX350V/CX350VE/CX370/CX370E/CX370V)
are not supplied, but they are included in MM-088 complete board (service).)
are not supplied, but they are included in MM-088 complete board (service).)
< CAPACITOR >
* C8704 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
(CX370/CX370E/CX370V)
* C8705 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
(CX370/CX370E/CX370V)
* C8804 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8805 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
< CONNECTOR >
CN8702 1-816-648-51
FFC/CONNECTOR, FPC (LIF) 20P
< IC >
IC8701 (Not supplied) IC THGBM1G8D8EBAI2 (32GB)
(CX370/CX370E/CX370V)
(IC8701 is supplied included in MM-088 complete board (service).)
* IC8801 6-713-616-01
* IC8801 6-713-616-01
IC THGBM1G7D8EBAI0 (16GB)
(CX300/CX300E/CX305E)
IC8801 (Not supplied) IC THGBM1G8D8EBAI2 (32GB)
(CX350/CX350E/CX350V/CX350VE/CX370/
CX370E/CX370V)
(IC8801 is supplied included in MM-088 complete board (service).)
< RESISTOR >
R8702
1-218-990-81
SHORT CHIP
0 (CX370/CX370E/CX370V)
R8705 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8706 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8707 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8708 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8709 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8710 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8711 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8712 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8721 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8802 1-218-990-81 SHORT
CHIP
0
< COMPOSITION CIRCUIT BLOCK >
RB8701 1-234-381-11 RES,
NETWORK 100K
(1005X4)
RB8702 1-234-381-11 RES,
NETWORK 100K
(1005X4)
************************************************************
A-1769-633-A VC-588 BOARD, COMPLETE (SERVICE)
(EXCEPT
CX305E)
A-1769-634-A VC-588 BOARD, COMPLETE (SERVICE) (CX305E)
**********************
(IC7501 and IC8101 are not supplied, but they are included in VC-588 complete
board (service).)
board (service).)
< CAPACITOR >
* C1012 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
VC-588
MM-088
CM-114
2-2. ELECTRICAL PARTS LIST
Note1 : Be sure to read “Precautions for Replacement of
Imager” on page 6-1 when changing the imager.
Note1 : イメージャの交換時は6-1ページの イメージャ交換
時の注意 を必ずお読みください。
HDR-CX300/CX300E/CX305E/CX350/CX350E/CX350V/CX350VE/CX370/CX370E/CX370V/XR350/XR350E/XR350V/XR350VE_L3
2-2
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
* C1013 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C1018 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C1019 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
* C1021 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2205 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C2206 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C2207 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C2208 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C2209 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C2210 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2211 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2213 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2216 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2217 1-100-611-91 CERAMIC
CHIP 22uF
20% 6.3V
C2218 1-100-611-91 CERAMIC
CHIP 22uF
20% 6.3V
* C2219 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2220 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2228 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2229 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2231 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2233 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2235 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2236 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2239 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2240 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2301 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C2302 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2303 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2304 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2305 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2803 1-119-923-11 CERAMIC
CHIP 0.047uF 10% 10V
C2804 1-119-923-11 CERAMIC
CHIP 0.047uF 10% 10V
C2807 1-127-988-81 CERAMIC
CHIP 0.015uF 10% 16V
C2808 1-127-988-81 CERAMIC
CHIP 0.015uF 10% 16V
C2810 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C2811 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C2812 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C2813 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C2814 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C2815 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C2816 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C2817 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
* C2818 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C2821 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2822 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C2823 1-119-923-11 CERAMIC
CHIP 0.047uF 10% 10V
C2824 1-112-746-11 CERAMIC
CHIP 4.7uF
10% 6.3V
* C2825 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2826 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2827 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2828 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2829 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C2832 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2833 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2835 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2837 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2838 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C2839 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2840 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C2841 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2842 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2843 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2844 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C2845 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2846 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
* C2848 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C2849 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C2850 1-119-750-11 TANTAL.
CHIP 22uF
20% 6.3V
C3501 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C3503 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C3504 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C3505 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C3509 1-127-715-11 CERAMIC
CHIP 0.22uF 10% 16V
C3510 1-127-715-11 CERAMIC
CHIP 0.22uF 10% 16V
C3511 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
* C4602 1-112-298-91 CERAMIC CHIP 1uF
10%
16V
C4604 1-165-875-11 CERAMIC
CHIP 10uF
10% 10V
C4605 1-165-875-11 CERAMIC
CHIP 10uF
10% 10V
C4606 1-165-875-11 CERAMIC
CHIP 10uF
10% 10V
* C4607 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C4701 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4702 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4703 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4704 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4705 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4706 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4708 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4711 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4712 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4713 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4714 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4715 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4716 1-165-875-11 CERAMIC
CHIP 10uF
10% 10V
C4718 1-100-591-91 CERAMIC
CHIP 1uF
10% 25V
C4721 1-127-715-11 CERAMIC
CHIP 0.22uF 10% 16V
* C4722 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4723 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C4724 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C4725 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4726 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C4727 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C4728 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
* C4729 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4730 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4731 1-112-298-91 CERAMIC CHIP 1uF
10%
16V
* C4732 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C4733 1-107-823-11 CERAMIC
CHIP 0.47uF 10% 16V
C4735 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C4736 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C4751 1-100-611-91 CERAMIC
CHIP 22uF
20% 6.3V
C4753 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4754 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4755 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4756 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4760 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4761 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4763 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4768 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C4769 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C4771 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C4772 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4773 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C4901 1-119-750-11 TANTAL.
CHIP 22uF
20% 6.3V
C4906 1-164-850-11 CERAMIC
CHIP 10PF
0.5PF 50V
C4907 1-164-850-11 CERAMIC
CHIP 10PF
0.5PF 50V
C4908 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
* C4909 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4910 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4911 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C4912 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C4913 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C4917 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
* C4919 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5203 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
* C5204 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5205 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
* C5206 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5207 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C5208 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C5209 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5210 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5211 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5212 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5213 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5214 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5215 1-165-897-11 TANTAL.
CHIP 22uF
20% 10V
* C5216 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5217 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5219 1-164-940-11 CERAMIC
CHIP 0.0033uF 10% 16V
C5221 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C5222 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C5223 1-127-715-11 CERAMIC
CHIP 0.22uF 10% 16V
C5506 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C5509 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
* C5511 1-112-298-91 CERAMIC CHIP 1uF
10%
16V
C5514 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C5515 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C5518 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C5519 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
* C5522 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5527 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5528 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5529 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5532 1-137-934-91 TANTAL.
CHIP 47uF
20% 10V
* C5534 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C5536 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C5542 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C5543 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C5707 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C5708 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C7502 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C7505 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7508 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7509 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C7511 1-100-611-91 CERAMIC
CHIP 22uF
20% 6.3V
C7512 1-100-611-91 CERAMIC
CHIP 22uF
20% 6.3V
* C7516 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7517 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7518 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7519 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7524 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7525 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7526 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7530 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7533 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7534 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7535 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7538 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7539 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7540 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C7544 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C7545 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C7701 1-119-750-11 TANTAL.
CHIP 22uF
20% 6.3V
* C7702 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7703 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C7706 1-119-750-11 TANTAL.
CHIP 22uF
20% 6.3V
* C7707 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7708 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7711 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C7715 1-119-750-11 TANTAL.
CHIP 22uF
20% 6.3V
* C7803 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7804 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7805 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7806 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7807 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C7808 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7809 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7818 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7819 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7820 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C7821 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C8001 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C8002 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8003 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C8004 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C8005 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8006 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8007 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C8008 1-100-881-91 CERAMIC
CHIP 47uF
20% 6.3V
C8009 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C8011 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8012 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8014 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8015 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8018 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8019 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8020 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8021 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8022 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C8023 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C8024 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8025 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8101 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C8103 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
VC-588
