DOWNLOAD Sony DCR-IP45 / DCR-IP45E / DCR-IP55 / DCR-IP55E Service Manual ↓ Size: 9.99 MB | Pages: 57 in PDF or view online for FREE

Model
DCR-IP45 DCR-IP45E DCR-IP55 DCR-IP55E
Pages
57
Size
9.99 MB
Type
PDF
Document
Service Manual
Brand
Device
Movie / LEVEL 3
File
dcr-ip45-dcr-ip45e-dcr-ip55-dcr-ip55e.pdf
Date
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Sony DCR-IP45 / DCR-IP45E / DCR-IP55 / DCR-IP55E Service Manual ▷ View online

4-79
DCR-IP45/IP45E/IP55/IP55E
COVER
COVER
4-3. PRINTED WIRING BOARDS
4-3. PRINTED WIRING BOARDS
(For printed wiring boards)
•
: Uses unleaded solder.
•
: Pattern from the side which enables seeing.
  (The other layers’ patterns are not indicated)
• Through hole is omitted.
• Circled numbers refer to waveforms.
• There are a few cases that the part printed on diagram
isn’t mounted in this model.
• C: panel designation
THIS NOTE IS COMMON FOR WIRING BOARDS
(In addition to this, the necessary note is printed in each block)
2
1
3
2
1
3
2
1
3
3
4
5
2
1
1
2
3
6
5
4
E
B
C
3
1
5
5
2
4
6
1
2
3
5
4
4
3
1
2
1
2
4
3
3
1 2
4
5
5
3 4
1
2
3
4
2
1
1
2
4
3
4
6
2
5
3
1
1
2
4
3
• Chip parts.
Transistor
Diode
DCR-IP45/IP45E/IP55/IP55E
COVER
COVER
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
4-97
4-98
DI-085(RGB DRIVE/TG, VIDEO IN/OUT, AUDIO IN/OUT, HI CONTROL, DC/DC CONVERTER, CONNECTOR) PRINTED WIRING BOARD
MOUNTED PARTS LOCATION
MOUNTED PARTS LOCATION
DI-085
qa
1-685-186-
3
2
6
5 4
1
7
8
9
For printed wiring board
• Refer to page 4-109 for parts location.
• This board is eight-layer print board. However, the
patterns of layers two to seven have not been in-
cluded in the diagram.
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
• Replacement of CSP (Chip Size Package) IC used
in this set require a tool.
CSP IC: IC2101, 2302, 2401, 2501, 2502
CSP (chip size package)
Conventional
•  
 : Uses unleaded solder.
4-3. PRINTED WIRING BOARDS
DCR-IP45/IP45E/IP55/IP55E
COVER
COVER
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
4-99
4-100
MOUNTED PARTS LOCATION
MOUNTED PARTS LOCATION
DI-085
(LITHIUM BATTERY)
q;
qa
•  
 : Uses unleaded solder.
CAUTION :
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
DCR-IP45/IP45E/IP55/IP55E
COVER
COVER
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
4-2. SCHEMATIC DIAGRAMS
4-3. PRINTED WIRING BOARDS
1-685-185-
4-101
4-102
VC-291 (A/D CONVERTER, TIMING GENERATOR, CAMERA PROCESS, FOCUS/ZOOM/SHUTTER/ND DRIVE, BASE BAND PROCESS, FOCUS/ZOOM CONTROL, VIDEO BUFFER,
MPEG MOVIE/DIGITAL STILL PROCESS, HI CONTROL, DIGITAL STILL CONTROL, FLASH MEMORY, MPEG VIDEO PROCESS, Q PROCESS, I LINK I/F,
MPEG AUDIO ENCODER/DECODER, HEAD AMP, PLL, A/D CONV., USB I/F, DRUM/CAPSTAN/LOADING MOTOR DRIVE, CAMERA CONTROL, EVR,
MECHA CONTROL, SIGNAL PROCESS CONTROL, PITCH/YAW SENSOR AMP, AF, MIC DRIVE, CONNECTOR) PRINTED WIRING BOARD
MOUNTED PARTS LOCATION
MOUNTED PARTS LOCATION
VC-291
•  
 : Uses unleaded solder.
For printed wiring board
• Refer to page 4-110, 4-111 for parts location.
• This board is eight-layer print board. However, the
patterns of layers two to seven have not been in-
cluded in the diagram.
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
• Replacement of CSP (Chip Size Package) IC used
in this set require a tool.
CSP IC: IC201, 301, 501, 601, 602, 701, 1001,
1101, 1103, 1104, 1204, 1205, 1301,
1401, 1503, 1601, 1701, 1803, 1902
CSP (chip size package)
Conventional
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