Sony DVP-PQ2 Service Manual ▷ View online
SERVICE MANUAL
US Model
Canada Model
Europe Model
Mexico Model
CD/DVD PLAYER
DVP-PQ2
RMT-D148A
System
Laser: Semiconductor laser
Signal format system:
Signal format system:
*(PQ2: MX2,U2,CA2): NTSC
*(PQ2:EC1,EC2,CEK): PAL/NTSC
*(PQ2:EC1,EC2,CEK): PAL/NTSC
Outputs
(Jack name: Jack type/Output level/Load impedance)
AUDIO OUT L/R: Phonojack/2 Vrms/10 k
AUDIO OUT L/R: Phonojack/2 Vrms/10 k
W
DIGITAL OUT (COAXIAL): Phonojack/0.5 Vp-p/75
W
VIDEO OUT: Phonojack/1.0 Vp-p/75
W
S-VIDEO OUT: 4-pin mini DIN/
Y: 1.0 Vp-p
C: 0.3 Vp-p (PAL), 0.286 Vp-p (NTSC)/75
C: 0.3 Vp-p (PAL), 0.286 Vp-p (NTSC)/75
W
HEADPHONES/EARPHONES JACK:
Stereo mini-jack/9 m W + 9 m W/32
W
General
Power requirements:
*(PQ2: MX2,U2,CA2): 120 V, 60 Hz
*(PQ2:EC1,EC2,CEK): 220-240 V, 50/60 Hz
*(PQ2:EC1,EC2,CEK): 220-240 V, 50/60 Hz
Power consumption: 9 W
Dimensions (approx.): 190
Dimensions (approx.): 190
´ 147 ´ 235 mm (7 ´ 5
7
/
8
´ 9 in.)
(w/h/d)
Mass (approx.): 1.3 kg (2.9 lbs)
Operating temperature: 5°C to 35°C (41°F to 95°F)
Operating humidity: 25-80%
Operating temperature: 5°C to 35°C (41°F to 95°F)
Operating humidity: 25-80%
Supplied accessories
Operating Instructions (1)
Audio/video cord (1)
Remote (1)
AA (R6) size batteries (2)
EURO AV adaptor (PQ2:EC1,EC2,CEK)* (1)
Design sheet
Audio/video cord (1)
Remote (1)
AA (R6) size batteries (2)
EURO AV adaptor (PQ2:EC1,EC2,CEK)* (1)
Design sheet
Specifications and design are subject to change
without notice.
without notice.
ENERGY STAR
Ò
is a U.S. registered mark. As an
ENERGY STAR
Ò
Partner, Sony Corporation has
determined that this product meets the ENERGY STAR
Ò
guidelines for energy efficiency.
* Refer Pg.4-1 for Abbreviation
SPECIFICATIONS
– 2 –
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF
MORE THAN 25 cm FROM THE SURFACE OF THE
OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF
MORE THAN 25 cm FROM THE SURFACE OF THE
OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
OR DOTTED
LINE WITH MARK
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
hazard.
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15 µF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
a return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-sol-
dered connections. Check the entire board surface for solder
splashes and bridges.
splashes and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transis-
tors, that were installed during a previous repair. Point them
out to the customer and recommend their replacement.
out to the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recom-
mend their replacement.
mend their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
Check leakage as described below.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C .
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
– 3 –
TABLE OF CONTENTS
SERVICE NOTE
................................................................... 4
1.
GENERAL
................................................................... 1
2.
DISASSEMBLY
2-1.
LID Assembly Removal ................................................. 2-1
2-2.
Disk Base Assembly Removal ...................................... 2-1
2-3.
Base Unit Removal ........................................................ 2-1
2-4.
BU Holder Removal ....................................................... 2-1
2-5.
SW-406 Board Removal ................................................ 2-2
2-6.
HP-137 & Jack Plate Removal ...................................... 2-2
2-7.
Lower Case Removal .................................................... 2-2
2-8.
Power Switching Regulator Block Removal ................. 2-2
2-9.
Shield Plate Removal .................................................... 2-3
2-10. AV-77 Board Removal ................................................... 2-3
2-11. IF-106 Board Removal .................................................. 2-3
2-12. MB-108 & SW-407 Boards Removal ............................ 2-3
2-13. Circuit Boards Location ................................................. 2-4
2-11. IF-106 Board Removal .................................................. 2-3
2-12. MB-108 & SW-407 Boards Removal ............................ 2-3
2-13. Circuit Boards Location ................................................. 2-4
3.
BLOCK DIAGRAMS
3-1.
Overall Block Diagram ................................................... 3-1
3-2.
System Control Block Diagram ..................................... 3-3
3-3.
RF/Servo Block Diagram ............................................... 3-5
3-4.
Signal Processor Block Diagram .................................. 3-7
3-5.
Video/Audio Block Diagram .......................................... 3-9
3-6.
Interface Control Block Diagram ................................... 3-11
3-7.
Power 1 Block Diagram ................................................. 3-13
3-8.
Power 2 Block Diagram ................................................. 3-15
4.
PRINTED WIRING BOARDS AND SCHEMATIC
DIAGRAMS
DIAGRAMS
4-1.
Printed Wiring Boards and Schematic Diagrams ........ 4-1
4-2.
Frame Schematic Diagram ............................................ 4-3
Waveforms ..................................................................... 4-5
•
Waveforms ..................................................................... 4-5
•
MB-108 Printed Wiring Board .................................. 4-7
•
MB-108 (System Control) Schematic Diagram ....... 4-9
•
MB-108 (Motor Drive) Schematic Diagram ............. 4-11
•
MB-108 (Servo) Schematic Diagram ....................... 4-13
•
MB-108 (AV Decoder) Schematic Diagram ............ 4-15
•
MB-108 (Audio DAC, PLL) Schematic Diagram ...... 4-17
•
MB-108 Board Differential Part List ......................... 4-17
•
AV-77 Printed Wiring Board ..................................... 4-19
•
AV-77 (Audio/Video Out) Schematic Diagram ........ 4-21
•
AV-77 Board Differential Part List ............................ 4-23
•
IF-106 Printed Wiring Board .................................... 4-25
•
IF-106 (Interface Control) Schematic Diagram ....... 4-27
•
SW-406, SW-407 Printed Wiring Boards ................ 4-29
•
SW-406 (Function Switch), SW-407 (Door Switch)
Schematic Diagram ............................................. 4-31
Schematic Diagram ............................................. 4-31
•
HP-137 Printed Wiring Board .................................. 4-33
•
HP-137 (Headphone) Schematic Diagram ............. 4-35
•
DPSN-20CP Printed Wiring Board .......................... 4-37
•
DPSN-20CP (Switching Regulator)
Schematic Diagram ............................................. 4-39
Schematic Diagram ............................................. 4-39
•
DPSN-20CP-2 Printed Wiring Board ....................... 4-41
•
DPSN-20CP-2 (Switching Regulator)
Schematic Diagram ............................................. 4-43
Schematic Diagram ............................................. 4-43
5.
IC PIN FUNCTION DESCRIPTION
5-1.
System Control Pin Function
(MB-108 BOARD IC104: MB9130RPFV-G-BND-E1) ... 5-1
(MB-108 BOARD IC104: MB9130RPFV-G-BND-E1) ... 5-1
6.
TEST MODE
6-1.
General Description ...................................................... 6-1
6-2.
Starting Test Mode ......................................................... 6-1
6-3.
Syscon Diagnosis .......................................................... 6-1
6-4.
Drive Auto Adjustment ................................................... 6-5
6-5.
Drive Manual Operation ................................................ 6-7
6-6.
Emergency History ........................................................ 6-10
6-7.
Version Information ....................................................... 6-11
6-8.
Video Level Adjustment ................................................ 6-11
6-9.
Troubleshooting ............................................................. 6-11
7.
ELECTRICAL ADJUSTMENT
7-1.
Power Supply Check ..................................................... 7-1
7-2.
Adjustment of Video System ......................................... 7-2
1.
Video Level Adjustment ................................................ 7-2
2.
Checking S Video Output S-Y ....................................... 7-2
3.
Checking S Video Output S-C ...................................... 7-2
7-3.
Adjustment Related Parts Arrangement ....................... 7-3
8.
REPAIR PARTS LIST
8-1.
Exploded Views ............................................................. 8-1
8-1-1. Disk Base Section .................................................... 8-1
8-1-2. Lower Case Section ................................................. 8-2
8-1-2. Lower Case Section ................................................. 8-2
8-2.
Electrical Parts List ........................................................ 8-3
– 4 –
SERVICE NOTE
1.
DISASSEMBLY
• This set can be disassembled in the order shown below.
Set
Lid Assembly
(Page 2-1)
BU Holder
(Page 2-1)
SW-406 Board
(Page 2-2)
Disk Base Assembly
(Page 2-1)
Base Unit
(Page 2-1)
HP-137 Board &
Jack Plate
(Page 2-2)
Lower Case
(Page 2-2)
AV-77 Board
(Page 2-3)
IF-106 Board
(Page 2-3)
MB-108 &
SW-407 Boards
(Page 2-3)
Shield Plate
(Page 2-3)
Power Switching
Regulator Block
(Page 2-2)
2.
PRECAUTIONS FOR USE OF BASE UNIT
As the laser diode in the base unit is easily damaged by static
electricity, desolder the laser tap of the flexible board of the base
unit when using it.
Before disconnecting the connector, solder first. Before connect-
ing the connector, be careful not to remove the solder. Also take
adequate measures to prevent damage by static electricity. Handle
the flexible board with care as it breaks easily.
electricity, desolder the laser tap of the flexible board of the base
unit when using it.
Before disconnecting the connector, solder first. Before connect-
ing the connector, be careful not to remove the solder. Also take
adequate measures to prevent damage by static electricity. Handle
the flexible board with care as it breaks easily.
Base unit
Laser tap
