Sony BDP-SX910 Service Manual ▷ View online
General
Power requirements:
DC 12V 1.5A (AC adaptor/Car battery
adaptor)
Power consumption:
8.5W (when playing a BD-ROM using
headphones)
Dimensions (approx.):
246.7mm × 184.7mm × 42.2mm
(9 3/4 in. × 7 3/8 in. × 1 11/16 in.)
(width/depth/height) incl. projecting parts
Mass (approx.): 1.31kg (2.89 lbs)
Operating temperature: 5ºC to 35ºC (41°F to 95°F)
Operating humidity: 25% to 80%
AC adaptor: 110-240V AC, 50/60Hz
Car battery adaptor: 12V DC
Supplied accessories
• AC adaptor (1)
• Car battery adaptor (1)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
Specifications and design are subject to change
without notice.
BDP-SX90/SX910
Ver. 1.1 2012.06
US Model
BDP-SX90/SX910
Canadian Model
BDP-SX910
SPECIFICATIONS
9-890-777-12
2012F3100-1
© 2012.06
Published by Sony EMCS Corporation
RMT-B113A
SERVICE MANUAL
Sony Corporation
Home Entertainment Business Group
System
Laser: Semiconductor laser
Signal format system: NTSC
Inputs/Outputs
PHONES (headphones):
Stereo minijack
USB:
USB jack Type A, maximum current
500mA (For connecting a USB memory,
memory card reader, digital still camera,
and digital video camera)
HDMI OUT:
HDMI 19-pin standard connector
Liquid Crystal Display
Panel size(approx.):
9 inches wide (diagonal)
Driving system: TFT active matrix
Resolution: 800 × 480
Panel size(approx.):
9 inches wide (diagonal)
Driving system: TFT active matrix
Resolution: 800 × 480
PORTABLE
Blu-ray Disc /DVD PLAYER
TM
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
1.5 k
0.15 µF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
－ 2 －
BDP-SX90/SX910
This appliance is classified as a CLASS 3R laser product. This
label is located on the bottom of the unit.
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1.
DISASSEMBLY
1-1. DISASSEMBLY FLOW ................................................. 1-1
1-2. BOTTOM BLOCK ......................................................... 1-1
1-3. BATTERY/MAIN BOARD ............................................. 1-2
1-4. TRAVERS UNIT ........................................................... 1-3
1-5. UPPER BLOCK ............................................................ 1-3
1-6. LCD SCREEN .............................................................. 1-4
1-7. LCD BOARD ................................................................ 1-4
2.
BLOCK DIAGRAM
2-1. FUNCTION BLOCK DIAGRAM .................................... 2-1
3.
SCHEMATIC DIAGRAMS
3-1. FRAME SCHEMATIC DIAGRAM (1/3) ......................... 3-1
3-2. FRAME SCHEMATIC DIAGRAM (2/3) ......................... 3-2
3-3. FRAME SCHEMATIC DIAGRAM (3/3) ......................... 3-3
3-4. MAIN BOARD (DC-DC POWER) ................................. 3-4
3-5. MAIN BOARD (MCU) ................................................... 3-5
3-6. MAIN BOARD (DDR CHA) ........................................... 3-6
3-7. MAIN BOARD (HDMI) ................................................. 3-7
3-8. MAIN BOARD (FLASH&USB) ..................................... 3-8
3-9. MAIN BOARD (LCD CONNECTOR&VIDEO OUT) ...... 3-9
3-10. MAIN BOARD (AUDIO DAC) ....................................... 3-10
3-11. MAIN BOARD (BD OPU) ............................................. 3-11
3-12. MAIN BOARD (Motor Driver) ....................................... 3-12
3-13. LCD BOARD ................................................................ 3-13
3-14. TOUCH BOARD .......................................................... 3-14
4.
PRINTED WIRING BOARDS
4-1. MAIN BOARD............................................................... 4-1
4-2. LCD BOARD ................................................................ 4-2
4-3. TOUCH BOARD ........................................................... 4-3
5.
WAVEFORMS AND CIRCUIT VOLTAGE
5-1. WAVEFORMS .............................................................. 4-1
6.
IC PIN FUNCTION DESCRIPTION
6-1. NAND FLASH U15 ....................................................... 6-1
6-2. DDR3 U11 .................................................................... 6-2
6-3. DDR3 U12 .................................................................... 6-3
6-4. Motor drive U22 ............................................................ 6-4
6-5. MCU U9........................................................................ 6-5
7.
SERVICE MODE
7-1. HOW TO ENTER TO SERVICE MODE ....................... 7-1
7-2. TRV DATA WRITE ....................................................... 7-2
7-3. SAVE ERROR LOG ..................................................... 7-3
7-4. OPU DATA CHECK ...................................................... 7-4
8.
TROUBLESHOOTING
8-1. ELECTRICAL TROUBLE SHOOTING GUIDE ............. 8-1
9.
REPAIR PARTS LIST
9-1. EXPLODED VIEWS ..................................................... 9-1
9-1-1. BOTOM BLOCK ...................................................... 9-1
9-1-2. UPPER BLOCK ....................................................... 9-2
9-1-3. LCD SCREAN/ LCD BOARD .................................. 9-2
9-1-4. ACCESSORIES ...................................................... 9-3
－ 3 －
BDP-SX90/SX910
BDP-SX90/SX910
SECTION 1
DISASSEMBLY
･This set can be disassembled in the order shown below.
1-1. DISASSEMBLY FLOW
NOTE: Follow the disassembly procedure in the numerical order given.
1-1
SET
1-2. BOTTOM BLOCK
(Page 1-1)
1-5. UPPER BLOCK
(Page 1-3)
1-2. BOTTOM BLOCK
⑤ upper block
⑤ bottom block
① two foot rubbers
① two foot rubbers
① one screw pad
② eleven screws
(TS2 x 11)
【 bottom 】
② four screws
(TS3 x 16)
③ harness
④ two connectors
1-4. TRAVERS UNIT
(Page 1-3)
1-6. LCD SCREEN
1-7. LCD BOARD
(Page 1-4E)
1-3. BATTERY/
MAIN BOARD
(Page 1-2)
※ See [NOTE] on the next page.