Sony BDP-S560 Service Manual ▷ View online
Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-712-14
2009K0500-1
© 2009.11
Published by Quality Assurance Dept.
BLU-RAY DISC/DVD PLAYER
Ver. 1.3 2009.11
BDP-S560
RMT-B104A/B104P
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
Australian Model
System
Laser:
Semiconductor laser
Inputs and outputs
(
Jack name:
Jack type/Output level/Load impedance)
LINE OUT R-AUDIO-L:
Phono jack/2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL):
Optical output jack/–18dBm (wave length 660nm)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
HDMI OUT:
HDMI 19-pin standard connector
COMPONENT VIDEO OUT
(Y, P
B
, P
R
) (US, CND):
US, CND:
Phono jack/Y: 1.0 Vp-p/P
B
, P
R
: 0.7 Vp-p/75 ohms
(Y, P
B
/C
B
, P
R
/C
R
) (EC1, EC2, CEK, AUS):
Phono jack/Y: 1.0 Vp-p/
P
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p/75 ohms
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LINE OUT S VIDEO:
4-pin mini DIN/Y: 1.0Vp-p, C: 0.286Vp-p/75ohms
EC1, EC2, CEK, AUS:
4-pin mini DIN/Y: 1.0Vp-p, C: 0.3 Vp-p/75ohms
LAN (100):
100BASE-TX Terminal
EXT:
External memory slot (For connecting the external
memory)
DC output: 5 V 500 mA Max
memory)
DC output: 5 V 500 mA Max
USB:
USB jack Type A (For connecting digital still
camera and USB memory)
camera and USB memory)
Wireless
Wireless LAN standard:
IEEE802.11a/b/g
IEEE802.11n draft 2.0
IEEE802.11n draft 2.0
Frequency range:
US:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-140, 149-165
CND:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
EC1, EC2, CEK:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140
AUS:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-140, 149-165
CND:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
EC1, EC2, CEK:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140
AUS:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
Modulation:
DS-SS Modem and OFDM Modem
General
Power requirements:
120 V AC, 60 Hz (US, CND)
220 – 240 V AC, 50/60Hz (EC1, EC2, CEK, AUS)
220 – 240 V AC, 50/60Hz (EC1, EC2, CEK, AUS)
Power consumption:
28 W
Dimensions (approx.):
430 mm × 216 mm × 70 mm
(17 in. × 8
(17 in. × 8
5
/
8
in. × 2
13
/
16
in.)
(width/depth/height) incl. projecting parts
Mass (approx.):
2.4 kg (5 lb 4
5
/
8
oz)
Operating temperature:
5 ºC to 35 ºC (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to change
without notice.
without notice.
• Audio/video cable (phono plug ×3) (1)
• AC power cord (1)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
(US, CND, AUS)
• Abbreviation
AUS : Australian model
CND : Canadian model
– 2 –
BDP-S560
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
2
WARNING
To reduce the risk of fire or electric
shock, do not expose this apparatus
to rain or moisture.
To avoid electrical shock, do not
open the cabinet. Refer servicing to
qualified personnel only.
shock, do not expose this apparatus
to rain or moisture.
To avoid electrical shock, do not
open the cabinet. Refer servicing to
qualified personnel only.
Batteries or batteries installed
apparatus shall not be exposed to
excessive heat such as sunshine,
fire or the like.
apparatus shall not be exposed to
excessive heat such as sunshine,
fire or the like.
CAUTION
The use of optical instruments with
this product will increase eye
hazard. As the laser beam used in
this Blu-ray Disc/DVD player is
harmful to eyes, do not attempt to
disassemble the cabinet.
Refer servicing to qualified
personnel only.
this product will increase eye
hazard. As the laser beam used in
this Blu-ray Disc/DVD player is
harmful to eyes, do not attempt to
disassemble the cabinet.
Refer servicing to qualified
personnel only.
This label is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
(Except US, Canadian, E)
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
(Except US, Canadian, E)
Notice for customers in the
United Kingdom and
Republic of Ireland
United Kingdom and
Republic of Ireland
A molded plug complying with
BS1363 is fitted to this equipment
for your safety and convenience.
Should the fuse in the plug
supplied need to be replaced, a 5
AMP fuse approved by AST A or
BSI to BS1362, (i.e., marked with
BS1363 is fitted to this equipment
for your safety and convenience.
Should the fuse in the plug
supplied need to be replaced, a 5
AMP fuse approved by AST A or
BSI to BS1362, (i.e., marked with
or
mark) must be used.
If the plug supplied with this
equipment has a detachable fuse
cover, be sure to attach the fuse
cover after you change the fuse.
Never use the plug without the fuse
cover. If you should lose the fuse
cover, please contact your nearest
Sony service station.
equipment has a detachable fuse
cover, be sure to attach the fuse
cover after you change the fuse.
Never use the plug without the fuse
cover. If you should lose the fuse
cover, please contact your nearest
Sony service station.
Disposal of Old Electrical
& Electronic Equipment
(Applicable in the
European Union and
other European countries
with separate collection
systems)
& Electronic Equipment
(Applicable in the
European Union and
other European countries
with separate collection
systems)
This symbol on the product or on
its packaging indicates that this
product shall not be treated as
household waste. Instead it shall be
handed over to the applicable
collection point for the recycling of
electrical and electronic
equipment. By ensuring this
product is disposed of correctly,
you will help prevent potential
negative consequences for the
environment and human health,
which could otherwise be caused
by inappropriate waste handling of
this product. The recycling of
materials will help to conserve
natural resources. For more
detailed information about
recycling of this product, please
contact your local Civic Office,
your household waste disposal
service or the shop where you
purchased the product.
its packaging indicates that this
product shall not be treated as
household waste. Instead it shall be
handed over to the applicable
collection point for the recycling of
electrical and electronic
equipment. By ensuring this
product is disposed of correctly,
you will help prevent potential
negative consequences for the
environment and human health,
which could otherwise be caused
by inappropriate waste handling of
this product. The recycling of
materials will help to conserve
natural resources. For more
detailed information about
recycling of this product, please
contact your local Civic Office,
your household waste disposal
service or the shop where you
purchased the product.
Disposal of waste
batteries (applicable in
the European Union and
other European countries
with separate collection
systems)
batteries (applicable in
the European Union and
other European countries
with separate collection
systems)
This symbol on the battery or on
the packaging indicates that the
battery provided with this product
shall not be treated as household
waste.
By ensuring these batteries are
disposed of correctly, you will help
prevent potentially negative
consequences for the environment
and human health which could
otherwise be caused by
inappropriate waste handling of the
battery. The recycling of the
materials will help to conserve
natural resources.
the packaging indicates that the
battery provided with this product
shall not be treated as household
waste.
By ensuring these batteries are
disposed of correctly, you will help
prevent potentially negative
consequences for the environment
and human health which could
otherwise be caused by
inappropriate waste handling of the
battery. The recycling of the
materials will help to conserve
natural resources.
In case of products that for safety,
performance or data integrity
reasons require a permanent
connection with an incorporated
battery, this battery should be
replaced by qualified service staff
only.
To ensure that the battery will be
treated properly, hand over the
product at end-of-life to the
applicable collection point for the
recycling of electrical and
electronic equipment.
performance or data integrity
reasons require a permanent
connection with an incorporated
battery, this battery should be
replaced by qualified service staff
only.
To ensure that the battery will be
treated properly, hand over the
product at end-of-life to the
applicable collection point for the
recycling of electrical and
electronic equipment.
For all other batteries, please view
the section on how to remove the
battery from the product safely.
Hand the battery over to the
applicable collection point for the
recycling of waste batteries.
the section on how to remove the
battery from the product safely.
Hand the battery over to the
applicable collection point for the
recycling of waste batteries.
For more detailed information
about recycling of this product or
battery, please contact your local
Civic Office, your household
waste disposal service or the shop
where you purchased the product.
about recycling of this product or
battery, please contact your local
Civic Office, your household
waste disposal service or the shop
where you purchased the product.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure. (EC1, EC2, CEK,
Australian)
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure. (EC1, EC2, CEK,
Australian)
– 3 –
BDP-S560
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1.
SERVICE NOTE
1-1. Disc Removal Procedure If The Tray Cannot Be
Ejected (Forced Ejection) ............................................. 1-1
1-2. Work when optical device are replaced ........................ 1-1
1-3. Test Disc ....................................................................... 1-2
1-3-1. Operation and Display ............................................. 1-2
1-4. Drive Repairing............................................................. 1-15
1-4-1. Preparation .............................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-430AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-430AAA/C2RP Folding Motor FFC ................ 1-18
1-4-8. KEM-430AAA/C2RP Packing .................................. 1-18
1-4-9. BU Data Decode Jig ................................................ 1-19
1-4-10. Loading For Service ................................................ 1-19
1-4-11. Laser Caution Label ................................................ 1-20
1-4-12. Useful service mode function .................................. 1-20
1-5. BU Service Policy ......................................................... 1-21
1-3. Test Disc ....................................................................... 1-2
1-3-1. Operation and Display ............................................. 1-2
1-4. Drive Repairing............................................................. 1-15
1-4-1. Preparation .............................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-430AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-430AAA/C2RP Folding Motor FFC ................ 1-18
1-4-8. KEM-430AAA/C2RP Packing .................................. 1-18
1-4-9. BU Data Decode Jig ................................................ 1-19
1-4-10. Loading For Service ................................................ 1-19
1-4-11. Laser Caution Label ................................................ 1-20
1-4-12. Useful service mode function .................................. 1-20
1-5. BU Service Policy ......................................................... 1-21
2.
DISASSEMBLY
2-1. Disassembly Flow ........................................................ 2-1
2-2. Upper Case .................................................................. 2-1
2-3. Front Panel Block ......................................................... 2-2
2-4. BD Drive ....................................................................... 2-3
2-5. Wireless Lan Card Block .............................................. 2-3
2-6. Rear Panel Block.......................................................... 2-4
2-7. MB-127 Board .............................................................. 2-4
2-8. Switching Regulator ..................................................... 2-5
2-9. Circuit Boards Location ................................................ 2-5
2-2. Upper Case .................................................................. 2-1
2-3. Front Panel Block ......................................................... 2-2
2-4. BD Drive ....................................................................... 2-3
2-5. Wireless Lan Card Block .............................................. 2-3
2-6. Rear Panel Block.......................................................... 2-4
2-7. MB-127 Board .............................................................. 2-4
2-8. Switching Regulator ..................................................... 2-5
2-9. Circuit Boards Location ................................................ 2-5
3.
BLOCK DIAGRAMS
3-1. Overall Block Diagram.................................................. 3-1
3-2. DSP Block Diagram ...................................................... 3-2
3-3. AV OUT Block Diagram ................................................ 3-3
3-4. USB/ETHER, FL Block Diagram .................................. 3-4
3-5. Power Block Diagram (1/3) .......................................... 3-5
3-6. Power Block Diagram (2/3) .......................................... 3-6
3-7. Power Block Diagram (2/3) .......................................... 3-7
3-2. DSP Block Diagram ...................................................... 3-2
3-3. AV OUT Block Diagram ................................................ 3-3
3-4. USB/ETHER, FL Block Diagram .................................. 3-4
3-5. Power Block Diagram (1/3) .......................................... 3-5
3-6. Power Block Diagram (2/3) .......................................... 3-6
3-7. Power Block Diagram (2/3) .......................................... 3-7
4.
SCHEMATIC DIAGRAMS
4-1. This Note Is Common For Schematic Diagrams .......... 4-1
4-2. Frame Schematic Diagram........................................... 4-2
4-3. ANT-001 Board (ANTENNA) Schematic Diagram........ 4-3
4-4. ANT-002 Board (ANTENNA) Schematic Diagram........ 4-4
4-5. FL-194 Board (SWITCH) Schematic Diagram ............. 4-5
4-6. FR-302 Board (FL DRIVER) Schematic Diagram ........ 4-6
4-7. HU-012 Board (USB HUB) Schematic Diagram........... 4-7
4-8. MB-127 Board (EMMA3P DDR2-A)
4-2. Frame Schematic Diagram........................................... 4-2
4-3. ANT-001 Board (ANTENNA) Schematic Diagram........ 4-3
4-4. ANT-002 Board (ANTENNA) Schematic Diagram........ 4-4
4-5. FL-194 Board (SWITCH) Schematic Diagram ............. 4-5
4-6. FR-302 Board (FL DRIVER) Schematic Diagram ........ 4-6
4-7. HU-012 Board (USB HUB) Schematic Diagram........... 4-7
4-8. MB-127 Board (EMMA3P DDR2-A)
Schematic Diagram (1/14)............................................ 4-8
4-9. MB-127 Board (EMMA3P DDR2-B)
Schematic Diagram (2/14)............................................ 4-9
4-10. MB-127 Board (POWER1)
Schematic Diagram (3/14)............................................ 4-10
4-11. MB-127 Board (CLK/POWER2)
Schematic Diagram (4/14)............................................ 4-11
4-12. MB-127 Board (FLASH/HOST)
Schematic Diagram (5/14)............................................ 4-12
4-13. MB-127 Board (USB) Schematic Diagram (6/14)......... 4-13
4-14. MB-127 Board (HDMI/SATA)
4-14. MB-127 Board (HDMI/SATA)
Schematic Diagram (7/14)............................................ 4-14
4-15. MB-127 Board (AUDIO/VIDEO)
Schematic Diagram (8/14)............................................ 4-15
4-16. MB-127 Board (GPIO/JTAG)
Schematic Diagram (9/14)............................................ 4-16
4-17. MB-127 Board (IPIO)
Schematic Diagram (10/14).......................................... 4-17
4-18. MB-127 Board (ETHERNET)
Schematic Diagram (11/14) .......................................... 4-18
4-19. MB-127 Board (RF SDRAM)
Schematic Diagram (12/14).......................................... 4-19
4-20. MB-127 Board (DRIVE/RF)
Schematic Diagram (13/14).......................................... 4-20
4-21. MB-127 Board (IFD) Schematic Diagram (14/14) ........ 4-21
4-22. USB-016 Board (USB REAR CONNECTOR)
4-22. USB-016 Board (USB REAR CONNECTOR)
Schematic Diagram ...................................................... 4-22
4-23. USB-017 Board (USB FRONT CONNECTOR)
Schematic Diagram ...................................................... 4-23
4-24. Waveforms ................................................................... 4-24
5.
PRINTED WIRING BOARDS
5-1. This Note Is Common For Printed Wiring Boards ........ 5-1
5-2. ANT-001 Board (ANTENNA) Printed Wiring Board ...... 5-2
5-3. ANT-002 Board (ANTENNA) Printed Wiring Board ...... 5-3
5-4. FL-194 Board (SWITCH) Printed Wiring Board............ 5-4
5-5. FR-302 Board (FL DRIVER) Printed Wiring Board ...... 5-5
5-6. HU-012 Board (USB HUB) Printed Wiring Board ......... 5-6
5-7. MB-127 Board (MAIN)
5-2. ANT-001 Board (ANTENNA) Printed Wiring Board ...... 5-2
5-3. ANT-002 Board (ANTENNA) Printed Wiring Board ...... 5-3
5-4. FL-194 Board (SWITCH) Printed Wiring Board............ 5-4
5-5. FR-302 Board (FL DRIVER) Printed Wiring Board ...... 5-5
5-6. HU-012 Board (USB HUB) Printed Wiring Board ......... 5-6
5-7. MB-127 Board (MAIN)
Printed Wiring Board (Side A) ...................................... 5-7
5-8. MB-127 Board (MAIN)
Printed Wiring Board (Side B) ...................................... 5-8
5-9. USB-016 Board (USB REAR CONNECTOR)
Printed Wiring Board .................................................... 5-9
5-10. USB-017 Board (USB FRONT CONNECTOR)
Printed Wiring Board .................................................... 5-10
6.
IC PIN FUNCTION DESCRIPTION
................... 6-1
7.
SERVICE MODE
..................................................... 7-1
8.
ERROR LOG LIST
................................................. 8-1
9.
TROUBLESHOOTING
............................................. 9-1
10. REPAIR PARTS LIST
10-1. Exploded Views ............................................................ 10-1
10-1-1. Case Section ........................................................... 10-1
10-1-2. Front/Rear Chassis Section .................................... 10-2
10-1-3. Main Chassis Section .............................................. 10-3
10-1-4. BD Section .............................................................. 10-4
10-1-5. Accessories ............................................................. 10-5
10-2. Electrical Parts List ....................................................... 10-6
10-1-1. Case Section ........................................................... 10-1
10-1-2. Front/Rear Chassis Section .................................... 10-2
10-1-3. Main Chassis Section .............................................. 10-3
10-1-4. BD Section .............................................................. 10-4
10-1-5. Accessories ............................................................. 10-5
10-2. Electrical Parts List ....................................................... 10-6
1-1
BDP-S560
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the upper case. (Refer to page 2-1)
2. Insert a clip in the hole of a drive and open a tray.
2. Insert a clip in the hole of a drive and open a tray.
Note: Use a clip of about 1.2 mm in the diameter
1-2. Work when optical device are replaced
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(About the procedure, refer to the attached Readme.txt file)
STEP
1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
STEP
2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take the photograph the part of the bar code of the optical device. (Refer to the following picture)
3. Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec).
* The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”.
* Because docode software cannot be attached, it separately distributes it.
* The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”.
* Because docode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
* Inquire of each service headquarters because the password cannot be disclosed.
5. Write the decode data to the set. (About the procedure, refer to the attached BU Adjustment flowchart.ppt file)
tray
clip
(Use that of about 1.2 mm in the diameter)
(Use that of about 1.2 mm in the diameter)
hole