DOWNLOAD Sony BDP-S560 Service Manual ↓ Size: 5.88 MB | Pages: 127 in PDF or view online for FREE

Model
BDP-S560
Pages
127
Size
5.88 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD
File
bdp-s560.pdf
Date

Sony BDP-S560 Service Manual ▷ View online

Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-712-14
2009K0500-1
© 2009.11
Published by Quality Assurance Dept.
BLU-RAY DISC/DVD PLAYER
Ver. 1.3  2009.11
BDP-S560
RMT-B104A/B104P
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
Australian Model
System
Laser:
 Semiconductor laser
Inputs and outputs
(
Jack name:
Jack type/Output level/Load impedance)
LINE OUT R-AUDIO-L:
Phono jack/2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL):
Optical output jack/–18dBm (wave length 660nm)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
HDMI OUT:
HDMI 19-pin standard connector
COMPONENT VIDEO OUT 
(Y, P
B
, P
R
) (US, CND):
US, CND:
Phono jack/Y: 1.0 Vp-p/P
B
, P
R
: 0.7 Vp-p/75 ohms
(Y, P
B
/C
B
, P
R
/C
R
) (EC1, EC2, CEK, AUS):
Phono jack/Y: 1.0 Vp-p/
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p/75 ohms
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LINE OUT S VIDEO:
4-pin mini DIN/Y: 1.0Vp-p, C: 0.286Vp-p/75ohms
EC1, EC2, CEK, AUS:
4-pin mini DIN/Y: 1.0Vp-p, C: 0.3 Vp-p/75ohms
LAN (100):
100BASE-TX Terminal
EXT:
External memory slot (For connecting the external 
memory)
DC output: 5 V 500 mA Max
USB:
USB jack Type A (For connecting digital still 
camera and USB memory)
Wireless
Wireless LAN standard:
IEEE802.11a/b/g
IEEE802.11n draft 2.0
Frequency range:
US:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-140, 149-165
CND:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-116, 132-140, 
149-165
EC1, EC2, CEK:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140
AUS:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-116, 132-140, 
149-165
Modulation:
DS-SS Modem and OFDM Modem
General
Power requirements:
120 V AC, 60 Hz (US, CND)
220 – 240 V AC, 50/60Hz (EC1, EC2, CEK, AUS)
Power consumption:
28 W
Dimensions (approx.):
430 mm × 216 mm × 70 mm
(17 in. × 8 
5
/
8
 in. × 2 
13
/
16
 in.)
(width/depth/height) incl. projecting parts
Mass (approx.):
2.4 kg (5 lb 4 
5
/
8
 oz)
Operating temperature:
5 ºC to 35 ºC (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to change 
without notice.
• Audio/video cable (phono plug ×3) (1) 
• AC power cord (1)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
(US, CND, AUS)
•  Abbreviation
 AUS  : Australian model
 CND  : Canadian model
– 2 –
BDP-S560
SAFETY  CHECK-OUT
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1.  Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.  Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3.  Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4.  Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5.  Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6.  Check the B+ voltage to see it is at the values specified.
7.  Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following 
safety checks before releasing the set to the customer:
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
 Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
 Soldering irons using a temperature regulator should be set to
about 350°C.
 Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•  Strong viscosity
 Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•  Usable with ordinary solder
 It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
2
WARNING
To reduce the risk of fire or electric 
shock, do not expose this apparatus 
to rain or moisture.
To avoid electrical shock, do not 
open the cabinet. Refer servicing to 
qualified personnel only.
Batteries or batteries installed 
apparatus shall not be exposed to 
excessive heat such as sunshine, 
fire or the like.
CAUTION
The use of optical instruments with 
this product will increase eye 
hazard. As the laser beam used in 
this Blu-ray Disc/DVD player is 
harmful to eyes, do not attempt to 
disassemble the cabinet.
Refer servicing to qualified 
personnel only.
This label is located on the laser 
protective housing inside the 
enclosure.
This appliance is classified as a 
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure. 
(Except US, Canadian, E)
Notice for customers in the 
United Kingdom and 
Republic of Ireland
A molded plug complying with 
BS1363 is fitted to this equipment 
for your safety and convenience.
Should the fuse in the plug 
supplied need to be replaced, a 5 
AMP fuse approved by AST A or 
BSI to BS1362, (i.e., marked with 
 or 
 mark) must be used.
If the plug supplied with this 
equipment has a detachable fuse 
cover, be sure to attach the fuse 
cover after you change the fuse. 
Never use the plug without the fuse 
cover. If you should lose the fuse 
cover, please contact your nearest 
Sony service station.
Disposal of Old Electrical 
& Electronic Equipment 
(Applicable in the 
European Union and 
other European countries 
with separate collection 
systems)
This symbol on the product or on 
its packaging indicates that this 
product shall not be treated as 
household waste. Instead it shall be 
handed over to the applicable 
collection point for the recycling of 
electrical and electronic 
equipment. By ensuring this 
product is disposed of correctly, 
you will help prevent potential 
negative consequences for the 
environment and human health, 
which could otherwise be caused 
by inappropriate waste handling of 
this product. The recycling of 
materials will help to conserve 
natural resources. For more 
detailed information about 
recycling of this product, please 
contact your local Civic Office, 
your household waste disposal 
service or the shop where you 
purchased the product.
Disposal of waste 
batteries (applicable in 
the European Union and 
other European countries 
with separate collection 
systems)
This symbol on the battery or on 
the packaging indicates that the 
battery provided with this product 
shall not be treated as household 
waste.
By ensuring these batteries are 
disposed of correctly, you will help 
prevent potentially negative 
consequences for the environment 
and human health which could 
otherwise be caused by 
inappropriate waste handling of the 
battery. The recycling of the 
materials will help to conserve 
natural resources.
In case of products that for safety, 
performance or data integrity 
reasons require a permanent 
connection with an incorporated 
battery, this battery should be 
replaced by qualified service staff 
only.
To ensure that the battery will be 
treated properly, hand over the 
product at end-of-life to the 
applicable collection point for the 
recycling of electrical and 
electronic equipment.
For all other batteries, please view 
the section on how to remove the 
battery from the product safely. 
Hand the battery over to the 
applicable collection point for the 
recycling of waste batteries.
For more detailed information 
about recycling of this product or 
battery, please contact your local 
Civic Office, your household 
waste disposal service or the shop 
where you purchased the product.
WARNING!!
WHEN  SERVICING,  DO  NOT  APPROACH  THE  LASER 
EXIT  WITH  THE  EYE  TOO  CLOSELY.  IN  CASE  IT  IS 
NECESSARY  TO  CONFIRM  LASER  BEAM  EMISSION, 
BE  SURE  TO  OBSERVE  FROM  A  DISTANCE  OF MORE   
THAN   25  cm  FROM  THE  SURFACE  OF  THE OBJEC-
TIVE  LENS  ON  THE  OPTICAL  PICK-UP  BLOCK.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.  RE-
PLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE  
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR  
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES    COMPOSANTS    IDENTIFIÉS    PAR    UNE    MARQUE    0  
SUR    LES    DIAGRAMMES    SCHÉMATIQUES    ET    LA    LISTE  
DES   PIÈCES  SONT  CRITIQUES  POUR   LA  SÉCURITÉ   DE  
FONCTIONNEMENT.    NE    REMPLACER    CES    COMPOSANTS  
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  
DONNÉS    DANS    CE    MANUEL    OU    DANS    LES    SUPPLÉ-
MENTS  PUBLIÉS  PAR  SONY.
This appliance is classified as a 
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure. (EC1, EC2, CEK, 
Australian)
– 3 –
BDP-S560
TABLE  OF  CONTENTS
Section 
Title 
Page
Section 
Title 
Page
1. 
SERVICE  NOTE
1-1.  Disc Removal Procedure If The Tray Cannot Be 
 
Ejected (Forced Ejection) .............................................  1-1
1-2.  Work when optical device are replaced ........................  1-1
1-3.  Test Disc .......................................................................  1-2
  1-3-1.  Operation and Display .............................................  1-2
1-4.  Drive Repairing.............................................................  1-15
  1-4-1.  Preparation ..............................................................  1-15
  1-4-2.  Checking Flow ~ Drive (BU) section ~ ....................  1-15
  1-4-3.  BU Check Flow [zz] ~ ..............................................  1-16
  1-4-4.  BU (Optical Block) Repair Guide .............................  1-16
  1-4-5.  BU Adjustment Flow [yy] ~ ......................................  1-17
  1-4-6.  KEM-430AAA/C2RP Packing Spec. .......................  1-17
  1-4-7.  KEM-430AAA/C2RP Folding Motor FFC ................  1-18
  1-4-8.  KEM-430AAA/C2RP Packing ..................................  1-18
  1-4-9.  BU Data Decode Jig ................................................  1-19
  1-4-10.  Loading For Service ................................................  1-19
  1-4-11.  Laser Caution Label ................................................  1-20
  1-4-12.  Useful service mode function ..................................  1-20
1-5.  BU Service Policy .........................................................  1-21
2. 
DISASSEMBLY
2-1.  Disassembly Flow ........................................................  2-1
2-2.  Upper Case ..................................................................  2-1
2-3.  Front Panel Block .........................................................  2-2
2-4.  BD Drive .......................................................................  2-3
2-5.  Wireless Lan Card Block ..............................................  2-3
2-6.  Rear Panel Block..........................................................  2-4
2-7.  MB-127 Board ..............................................................  2-4
2-8.  Switching Regulator .....................................................  2-5
2-9.  Circuit Boards Location ................................................  2-5
3. 
BLOCK  DIAGRAMS
3-1.  Overall Block Diagram..................................................  3-1
3-2.  DSP Block Diagram ......................................................  3-2
3-3.  AV OUT Block Diagram ................................................  3-3
3-4.  USB/ETHER, FL Block Diagram ..................................  3-4
3-5.  Power Block Diagram (1/3) ..........................................  3-5
3-6.  Power Block Diagram (2/3) ..........................................  3-6
3-7.  Power Block Diagram (2/3) ..........................................  3-7
4. 
SCHEMATIC  DIAGRAMS
4-1.  This Note Is Common For Schematic Diagrams ..........  4-1
4-2.  Frame Schematic Diagram...........................................  4-2
4-3.  ANT-001 Board (ANTENNA) Schematic Diagram........  4-3
4-4.  ANT-002 Board (ANTENNA) Schematic Diagram........  4-4
4-5.  FL-194 Board (SWITCH) Schematic Diagram .............  4-5
4-6.  FR-302 Board (FL DRIVER) Schematic Diagram ........  4-6
4-7.  HU-012 Board (USB HUB) Schematic Diagram...........  4-7
4-8.  MB-127 Board (EMMA3P DDR2-A) 
 
Schematic Diagram (1/14)............................................  4-8
4-9.  MB-127 Board (EMMA3P DDR2-B) 
 
Schematic Diagram (2/14)............................................  4-9
4-10.  MB-127 Board (POWER1) 
 
Schematic Diagram (3/14)............................................  4-10
4-11.  MB-127 Board (CLK/POWER2) 
 
Schematic Diagram (4/14)............................................  4-11
4-12.  MB-127 Board (FLASH/HOST) 
 
Schematic Diagram (5/14)............................................  4-12
4-13.  MB-127 Board (USB) Schematic Diagram (6/14).........  4-13
4-14.  MB-127 Board (HDMI/SATA) 
 
Schematic Diagram (7/14)............................................  4-14
4-15.  MB-127 Board (AUDIO/VIDEO) 
 
Schematic Diagram (8/14)............................................  4-15
4-16.  MB-127 Board (GPIO/JTAG) 
 
Schematic Diagram (9/14)............................................  4-16
4-17.  MB-127 Board (IPIO) 
 
Schematic Diagram (10/14)..........................................  4-17
4-18.  MB-127 Board (ETHERNET) 
 
Schematic Diagram (11/14) ..........................................  4-18
4-19.  MB-127 Board (RF SDRAM) 
 
Schematic Diagram (12/14)..........................................  4-19
4-20.  MB-127 Board (DRIVE/RF) 
 
Schematic Diagram (13/14)..........................................  4-20
4-21.  MB-127 Board (IFD) Schematic Diagram (14/14) ........  4-21
4-22.  USB-016 Board (USB REAR CONNECTOR) 
 
Schematic Diagram ......................................................  4-22
4-23.  USB-017 Board (USB FRONT CONNECTOR) 
 
Schematic Diagram ......................................................  4-23
4-24.  Waveforms ...................................................................  4-24
5. 
PRINTED  WIRING  BOARDS
5-1.  This Note Is Common For Printed Wiring Boards ........  5-1
5-2.  ANT-001 Board (ANTENNA) Printed Wiring Board ......  5-2
5-3.  ANT-002 Board (ANTENNA) Printed Wiring Board ......  5-3
5-4.  FL-194 Board (SWITCH) Printed Wiring Board............  5-4
5-5.  FR-302 Board (FL DRIVER) Printed Wiring Board ......  5-5
5-6.  HU-012 Board (USB HUB) Printed Wiring Board .........  5-6
5-7.  MB-127 Board (MAIN) 
 
Printed Wiring Board (Side A) ......................................  5-7
5-8.  MB-127 Board (MAIN) 
 
Printed Wiring Board (Side B) ......................................  5-8
5-9.  USB-016 Board (USB REAR CONNECTOR) 
 
Printed Wiring Board ....................................................  5-9
5-10.  USB-017 Board (USB FRONT CONNECTOR) 
 
Printed Wiring Board ....................................................  5-10
6. 
IC  PIN  FUNCTION  DESCRIPTION
 ...................  6-1
7. 
SERVICE  MODE
 .....................................................  7-1
8. 
ERROR  LOG  LIST
 .................................................  8-1
9. 
TROUBLESHOOTING
 .............................................  9-1
10.  REPAIR  PARTS  LIST
10-1.  Exploded Views ............................................................  10-1
  10-1-1.  Case Section ...........................................................  10-1
  10-1-2.  Front/Rear Chassis Section ....................................  10-2
  10-1-3.  Main Chassis Section ..............................................  10-3
  10-1-4.  BD Section ..............................................................  10-4
  10-1-5.  Accessories .............................................................  10-5
10-2.  Electrical Parts List .......................................................  10-6
1-1
BDP-S560
SECTION  1
SERVICE  NOTE
1-1.  DISC  REMOVAL  PROCEDURE  IF  THE  TRAY  CANNOT  BE  EJECTED (FORCED  EJECTION)
1.  Remove the upper case. (Refer to page 2-1)
2.  Insert a clip in the hole of a drive and open a tray. 
 
Note: Use a clip of about 1.2 mm in the diameter
1-2.  Work when optical device are replaced
Note: Please do the following work when you replace the optical device. 
1.  Install it in PC after downloading two set of software from following URL. 
 
(About the procedure, refer to the attached Readme.txt file)
 STEP 
1
 
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
 
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
 STEP 
2
 
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
 
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2.  Take the photograph the part of the bar code of the optical device. (Refer to the following picture)
 
3.  Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec). 
*  The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”. 
*  Because docode software cannot be attached, it separately distributes it.
4.  Input the password when you start decode software.
*  Inquire of each service headquarters because the password cannot be disclosed. 
5.  Write the decode data to the set.  (About the procedure, refer to the attached BU Adjustment flowchart.ppt file)
tray
clip
(Use that of about 1.2 mm in the diameter)
hole
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Sony BDP-S560 Service Manual ▷ Download

  • DOWNLOAD Sony BDP-S560 Service Manual ↓ Size: 5.88 MB | Pages: 127 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony BDP-S560 in PDF for free, which will help you to disassemble, recover, fix and repair Sony BDP-S560 DVD. Information contained in Sony BDP-S560 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.