Sony BDP-S495 Service Manual ▷ View online
Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-772-11
2011D 6900-1
© 2012.04
BDP-S495
RMT-B121P
SPECIFICATIONS
System
Laser: Semiconductor laser
Inputs and outputs
( Jack name:
Jack type/Output level/Load impedance)
HDMI OUT:
HDMI 19-pin standard connector
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LAN (100):
100BASE-TX Terminal
USB:
General
Power requirements:
Power requirements:
220V – 240V AC, 50/60Hz
Power consumption:
15 W
Dimensions (approx.):
430mm × 202mm × 42mm
(width/depth/height) incl. projecting parts
(width/depth/height) incl. projecting parts
Mass (approx.):
Operating temperature:
5 ºC to 35 ºC
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to change
without notice.
without notice.
•
Audio/video cable (phono plug ×3) (1)
•
Remote commander (remote) (1)
•
Size AA (R6) batteries (2)
Photo: BDP-S495
Remote : RMT-B121P
Remote : RMT-B121P
Russian Model
LINE OUT R-AUDIO-L:
Phone jack/2 Vrms/10 kilohms
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
Ver. 1.0 2012.04
BDP-S495
DIGITAL OUT (OPTICAL):
Optical output jack/-18dBm
(wavelength 660 nm)
(wavelength 660 nm)
MIC Input 1/2:
Phone jacks
1.6 kg
Published by Document Design Dept.
Blu-ray Disc™ / DVD Player
USB jack Type A (For connecting a
USB memory, memory card reader,
digital still camera, and digital video
camera)
– 2 –
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
instruments.
2. A
battery-operated
AC
milliammeter.
The
Data
Precision
245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
Ω
μ
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
For customers in European countries
product. The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
MARKING is located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
OR DOTTED LINE WITH
MARK
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
BDP-S495
For customers in Taiwan
BDP-S495
TABLE OF CONTENTS
Section
Title
P a g e
1. SERVICE NOTE
1-1. Disc Removal Procedure If The Tray Cannot Be
Ejected (Forced Ejection) ............................................................... 1-1
1-2. Work when optical device are replaced ........................................... 1-1
1-3. Test Disc ......................................................................................... 1-2
1-3. Test Disc ......................................................................................... 1-2
1-3-1. Operation and Display ............................................................. 1-2
1-3-2. Menu functions ........................................................................ 1-9
1-3-2. Menu functions ........................................................................ 1-9
1-4. Drive Repairing................................................................................ 1-15
1-4-1. Preparation .............................................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................................... 1-15
1-4-3. BU Check Flow [zz] ~ ............................................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................................ 1-16
1-4-5. BU Adjustment Flow [yy] ~ ..................................................... 1-17
1-4-6. KEM-480AAA/C2RP1 Packing Spec ...................................... 1-17
1-4-7. KEM-480AAA/C2RP1 Packing ................................................ 1-18
1-4-8. BU Data Decode Jig ............................................................... 1-19
1-4-9. Loading For Service ................................................................ 1-20
1-4-10. Laser Caution Label ................................................................ 1-22
1-4-2. Checking Flow ~ Drive (BU) section ~ .................................... 1-15
1-4-3. BU Check Flow [zz] ~ ............................................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................................ 1-16
1-4-5. BU Adjustment Flow [yy] ~ ..................................................... 1-17
1-4-6. KEM-480AAA/C2RP1 Packing Spec ...................................... 1-17
1-4-7. KEM-480AAA/C2RP1 Packing ................................................ 1-18
1-4-8. BU Data Decode Jig ............................................................... 1-19
1-4-9. Loading For Service ................................................................ 1-20
1-4-10. Laser Caution Label ................................................................ 1-22
1-5. Assembly Caution .......................................................................... 1-23E
2. DISASSEMBLY
2-1. Disassembly Flow .......................................................................... 2-1
2-2. Side And Top Panel ........................................................................ 2 -1
2-3. Tray Cover Assy .............................................................................. 2-2
2-4. Front Panel And Top Bracket ........................................................... 2-2
2-5. FR-321 Board, FL-212 Board and MC-205 Board.............................2-3
2-6. Switching Regulator ........................................................................ 2-3
2 -7. MB-144 Board ................................................................................ 2-4
2-8. Op-020 Board And BD Drive ........................................................... 2-4
2-9. Circuit Board Location ................................................................... 2-5E
2-2. Side And Top Panel ........................................................................ 2 -1
2-3. Tray Cover Assy .............................................................................. 2-2
2-4. Front Panel And Top Bracket ........................................................... 2-2
2-5. FR-321 Board, FL-212 Board and MC-205 Board.............................2-3
2-6. Switching Regulator ........................................................................ 2-3
2 -7. MB-144 Board ................................................................................ 2-4
2-8. Op-020 Board And BD Drive ........................................................... 2-4
2-9. Circuit Board Location ................................................................... 2-5E
3. BLOCK DIAGRAMS
3-1. Overall Block Diagram .................................................................... 3-1
3-2. DSP Block Diagram ........................................................................ 3-2
3-3. AV OUT Block Digram ..................................................................... 3-3
3-4. USB/ETHER/Block Diagram ........................................................... 3-4
3-5. Power Block Diagram ................................................................. 3-5E
3-2. DSP Block Diagram ........................................................................ 3-2
3-3. AV OUT Block Digram ..................................................................... 3-3
3-4. USB/ETHER/Block Diagram ........................................................... 3-4
3-5. Power Block Diagram ................................................................. 3-5E
4. SCHEMATIC DIAGRAM
4-1. This Note Is Common For Schematic Diagrams .............................. 4-1
4-2. Frame Schematic Diagram...............................................................4-2
4-3. FR-321 Board (FRONT BOARD) Schematic Diagram ..................... 4-3
4-4. FR-321 Board (FRONT USB) Schematic Diagram .......................... 4-4
4-5. FL-212 Board Schematic Diagram .................................................. 4-5
4-6. OP-020 Board Schematic Diagram ................................................. 4-6
4-7. MC-205 Board Schematic Diagram ................................................. 4-7
4-8. MB-144 Board (DDR 3 A)
4-2. Frame Schematic Diagram...............................................................4-2
4-3. FR-321 Board (FRONT BOARD) Schematic Diagram ..................... 4-3
4-4. FR-321 Board (FRONT USB) Schematic Diagram .......................... 4-4
4-5. FL-212 Board Schematic Diagram .................................................. 4-5
4-6. OP-020 Board Schematic Diagram ................................................. 4-6
4-7. MC-205 Board Schematic Diagram ................................................. 4-7
4-8. MB-144 Board (DDR 3 A)
Schematic Diagram (1/12) .............................................................. 4-8
4-9. MB-144 Board (DDR 3 B)
Schematic Diagram (2/12) .............................................................. 4-9
4-10.MB-144 Board (POWER)
Schematic Diagram (3/12) ............................................................. 4-10
4-11. MB-144 Board (CLK/POWER2)
Schematic Diagram (4/12) ............................................................. 4-11
4-12.MB-144 Board (FLASH/HOST)
Schematic Diagram (5/12) ............................................................. 4-12
4-13.MB-144 Board (USB)
Schematic Diagram (6/12) ............................................................. 4-13
4-14.MB-144 Board (HDMI/VIDEO)
Schematic Diagram (7/12) ............................................................. 4-14
4-15.MB-144 Board (ETHERNET)
Schematic Diagram (8/12) ............................................................. 4-15
4-16.MB-144 Board (AUDIO/VIDEO)
Schematic Diagram (9/12) ............................................................. 4-16
4-17.MB-144 Board (GPIO/JTAG)
Schematic Diagram (10/12) ........................................................... 4-17
4-18.MB-144 Board (FE_POWER/OP)
Schematic Diagram (11/12) ............................................................ 4-18
4-19.MB-144 Board (FE_POWER/MOTOR DRIVE)
Schematic Diagram (12/12) ........................................................... 4-19
4-20.Waveforms ...................................................................................... 4-20E
5. PRINTED WIRING BOARDS
5-1. This Note Is Common For Printed Wiring Boards .......................... 5-1
5-2. FR-321 Board (FRONT RIGHT) Printed Wiring Board.................... 5-2
5-3. FL-212 Board (FRONT LEFT) and
5-2. FR-321 Board (FRONT RIGHT) Printed Wiring Board.................... 5-2
5-3. FL-212 Board (FRONT LEFT) and
OP-020 Board (OPTICAL) Printed Wiring Board ............................5-3
5-4. MC-205 Board (MIC) Printed Wiring Board...................................... 5-4
5-5. MB-144 Board(MAIN)
5-5. MB-144 Board(MAIN)
Printed Wiring Board (Side A) ......................................................... 5-5
5-6. MB-144 Board (MAIN)
Printed Wiring Board (Side B) ....................................................... 5-6E
6. IC PIN FUNCTION DESCRIPTION .................................... 6-1
7. SERVICE MODE ................................................................ 7-1
8. ERROR LOG LIST ............................................................. 8-1
9. TROUBLESHOOTING......................................................... 9-1
10. REPAIR PARTS LIST
10-1.Exploded Views ............................................................................ 10-1
10-1-1. Case Section ......................................................................... 10-1
10-1-2. Main Chassis Section............................................................. 10-2
10-1-3. BD Section.............................................................................. 10-3
10-1-4. Accessories ........................................................................... 10-4
10-1-2. Main Chassis Section............................................................. 10-2
10-1-3. BD Section.............................................................................. 10-3
10-1-4. Accessories ........................................................................... 10-4
10-2.Electrical Parts List ....................................................................... 10-5
Section
Title
P a g e
- 3 -
1-1
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the side panel left. (Refer to page 2-1)
2. Insert a clip in the hole of a drive and open a tray.
2. Insert a clip in the hole of a drive and open a tray.
1-2. Work when optical device are replaced
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(Refer to “1-4-8. BU Data Decode Jig” on page 1-19)
STEP
1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
STEP
2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take a photograph of the bar code on the optical device. The valid bar code photo as shown in Fig.2
3. Drag-and-drop the bar code photograph to the icon of decode software (BDPRdec).
* The decode software is a complete set of “BDPRdec”, “Tasman.Bars.dll”, and “SavePath”.
* Because decode software cannot be attached, it separately distributes it.
* The decode software is a complete set of “BDPRdec”, “Tasman.Bars.dll”, and “SavePath”.
* Because decode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
* Inquire of each service headquarters because the password cannot be disclosed.
5. Write the decode data to the set.
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
BDP-S495
Tray
2
1 Insert a clip in the hole of a drive
to open a tray.
to open a tray.
Fig.2