Sony BDP-BX58 / BDP-S480 / BDP-S483 / BDP-S580 Service Manual ▷ View online
Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-745-14
2011H 6900-1
© 2011.08
Published by Design Engineering Dept.
BLU-RAY DISC / DVD PLAYER
Ver. 1.3 2011.08
BDP-BX58/S480/S483/S580
RMT-B109A/B109P/B110A/B110P
SPECIFICATIONS
System
Laser: Semiconductor laser
Inputs and Outputs:
(Jack name:Jack type/Output level/Load impedance)
HDMI Out :
HDMI 19-pin standard connector
Component Video out:
(Y, P
B
, P
R
Phono jack/Y: 1.0 Vp-p/
P
P
B
, P
R
: 0.7 Vp-p/75 ohms
Phono jack/1.0 Vp-p/75 ohms
LAN (100):
100BASE-TX Terminal
USB:
USB jack Type A (For connecting a USB memory,
General
Power requirements:
120V AC, 60Hz (US, CND)
220 – 240V AC, 50/60Hz (AEP,UK, AUS,RUS,)
Power consumption:
20W (BDP-S480/S483)
Dimensions (approx.):
430 mm × 199 mm × 36mm
(17 in. × 7
(17 in. × 7
4
/
5
in. × 1
7
/
16
in.)
(width/depth/height) incl. projecting parts
Mass (approx.):
g
k
7
..
1
Operating temperature:
5 ºC to 35 ºC(41 F to 95 F)
Operating humidity:
25 % to 80 %
Supplied accessories:
Specifications and design are subject to change
without notice.
without notice.
• Audio/video cable (phono plug ×3) (1)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
Photo: BDP-S480
Remote : RMT-B109A
Remote : RMT-B109A
• HDMI cable (1) (BDP-BX58:US)
(BDP-S480:US/S580:US/BX58:US)
ENERGY STAR and the ENERGY STAR mark
are registered U.S. marks. ENERGY STAR is a
registered mark owned by the U.S. government.
are registered U.S. marks. ENERGY STAR is a
registered mark owned by the U.S. government.
US Model
Canadian Model
Saudi Arabia Model
Latin America Model
Korean Model
Indian Model
Brazilian Model
Taiwan Model
AEP Model
UK Model
Australia/NZ Model
Argentina Model
Middle East Model
memory card reader,digital still camera and digital
video camera)
video camera)
•
(1) (BDP-S480 :
TW
only)
LAN cable
(Except
AEP,UK,E,AR,KR,IN,TW,BR)
22W (BDP-S580)
110 – 240V AC, 50/60Hz (E,AR,BR,EA,KS,IN)
110V AC, 60Hz (TW)
110V AC, 60Hz (TW)
) :
Line Out R-Audio-L:
Phone jack/2 Vrms/10 kilohms
Digital Out(Coxial):
Phono jack/0.5 Vp-p/75 ohms
BDP-S480
BDP-S480/S580/BX58
BDP-S480/S580
º
º
TM
BDP-S580
BDP-S480/S483
BDP-S480/S580
220V AC, 60Hz (KR)
Russian Model
Wireless(BDP-S580/BX58 only)
IEEE 802.11 b/g/n
Frequency Range:
Wireless LAN standard:
2.4GHz Band:Channels 1-11(US, CND)
Modulation:
DSSS and OFDM
2.4GHz Band:Channels 1-13 (OTHERS)
Line Out Video:
Mexican Model
– 2 –
BDP-BX58/S480/S483/S580
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check
the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
1.5k
Ω
0.15
µ
F
(0.75 V)
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
2
WARNING
To reduce the risk of re or electric
shock, do not expose this apparatus
to rain or moisture.
To avoid electrical shock, do not
open the cabinet. Refer servicing to
quali ed personnel only.
Batteries or batteries installed
apparatus shall not be exposed to
excessive heat such as sunshine,
re or the like.
CAUTION
The use of optical instruments with
this product will increase eye
hazard. As the laser beam used in
this Blu-ray Disc/DVD player is
harmful to eyes, do not attempt to
disassemble the cabinet.
Refer servicing to quali ed
personnel only.
This label is located on the laser
protective housing inside the
enclosure.
This appliance is classi ed as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
(Except US, Canadian, E)
Notice for customers in the
United Kingdom and
Republic of Ireland
United Kingdom and
Republic of Ireland
A molded plug complying with
BS1363 is tted to this equipment
for your safety and convenience.
Should the fuse in the plug
supplied need to be replaced, a 5
AMP fuse approved by ASTA or
BSI to BS1362, (i.e., marked with
or
mark) must be used.
If the plug supplied with this
equipment has a detachable fuse
cover, be sure to attach the fuse
cover after you change the fuse.
Never use the plug without the fuse
cover. If you should lose the fuse
cover, please contact your nearest
Sony service station.
Disposal of Old Electrical
& Electronic Equipment
(Applicable in the
European Union and
other European countries
with separate collection
systems)
& Electronic Equipment
(Applicable in the
European Union and
other European countries
with separate collection
systems)
This symbol on the product or on
its packaging indicates that this
product shall not be treated as
household waste. Instead it shall be
handed over to the applicable
collection point for the recycling of
electrical and electronic
equipment. By ensuring this
product is disposed of correctly,
you will help prevent potential
negative consequences for the
environment and human health,
which could otherwise be caused
by inappropriate waste handling of
this product. The recycling of
materials will help to conserve
natural resources. For more
detailed information about
recycling of this product, please
contact your local Civic O ce,
your household waste disposal
service or the shop where you
purchased the product.
Disposal of was
batteries (appli
the European Un
other Europea
with separate
systems)
batteries (appli
the European Un
other Europea
with separate
systems)
This symbol on the
the packaging in
battery provided
shall not be trea
waste.
By ensuring thes
disposed of correctl
prevent potentia
consequences fo
and human heal
otherwise be cau
inappropriate wa
battery. The recyc
materials will he
natural resource
In case of product
performance or
reasons require
connection with
battery, this batte
replaced by qua
only.
To ensure that th
treated properly
product at end-o
applicable collec
recycling of elec
electronic equip
For all other batt
the section on h
battery from the
Hand the battery
applicable collec
recycling of was
For more detaile
about recycling
battery, please co
Ci vic O ce, you
waste disposal s
where you purch
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
For customers in European countries
product. The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK OR DOTTED LINE WITH
MARK ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
– 3 –
TABLE OF CONTENTS
1.
SERVICE NOTE
1-1. Disc Removal Procedure If The Tray Cannot Be
Ejected (Forced Ejection) ............................................. 1-1
1-2. Work when optical device are replaced ........................ 1-1
1-3. Test Disc ....................................................................... 1-2
1-3-1. Operation and Display ............................................. 1-2
1-4. Drive Repairing............................................................. 1-15
1-4-1. Preparation .............................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-470AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-470AAA/C2RP Packing .................................. 1-18
1-4-8. BU Data Decode Jig ................................................ 1-19
1-4-9. Loading For Service ......................................... 1-20
1-4-10. Laser Caution Label ................................................ 1-20
2.
DISASSEMBLY
2-1. Disassembly Flow ........................................................ 2-1
2-2. Upper Case .................................................................. 2-1
2-3. Tray Cover Assy .......................................................... 2-2
2-4. Front Panel Assy, FL-203 and IF-170 Board
.... ............... 2-2
2-5. Rear Panel Block ......................................................... 2-3
2-6. MB-139 Board ............................................................. 2-3
2-7. BD Drive
....................................................................... 2-4
2-8. Switching Regulator ..................................................... 2-5E
3.
BLOCK DIAGRAM
3-1. Overall Block Diagram.................................................. 3-1
3-2. DSP Block Diagram ...................................................... 3-2
3-3. AV OUT Block Diagram ................................................ 3-3
3-4. USB/ETHER, Block Diagram .................................. 3-4
3-5. Power Block Diagram .......................................... 3-5E
4.
SCHEMATIC DIAGRAM
4-1. This Note Is Common For Schematic Diagrams .......... 4-1
4-2. Frame Schematic Diagram........................................... 4-2
4-3. IF-170 Board (FRONT RIGHT) Schematic Diagram ... 4-3
4-4. IF-170 Board (USB FRONT) Schematic Diagram ...... 4-4
4-6. MB-139 Board (DDR 3 A)
Schematic Diagram (1/17)............................................ 4-6
4-7. MB-139 Board (DDR 3 B)
Schematic Diagram (2/17)............................................ 4-7
4-14. MB-139 Board (AUDIO)
Schematic Diagram (9/17)............................................ 4-14
4-15. MB-139 Board (VIDEO)
Schematic Diagram (10/17).......................................... 4-15
4-16. MB-139 Board (GPIO/JTAG)
Schematic Diagram (11/17) .......................................... 4-16
4-17. MB-139 Board (IF CON)
Schematic Diagram (12/17).......................................... 4-17
4-18. MB-139 Board (FE OP/GIO)
Schematic Diagram (13/17).......................................... 4-18
4-19. MB-139 Board (FE_POWER/MOTOR DRIVE)
4-23. Waveforms ................................................................... 4-23E
5.
PRINTED WIRING BOARD
5-1. This Note Is Common For Printed Wiring Boards ........ 5-1
5-2. FL-203 Board (REAR) Printed Wiring Board....
5-2
5-3. IF-170 Board
Printed Wiring Board ...................................................... 5-3
5-4. MB-139 Board(MAIN)
Printed Wiring Board (Side A) ..................................... 5-4
5-5. MB-139 Board (MAIN)
Printed Wiring Board (Side B) ...................................... 5-5E
6.
IC PIN FUNCTION DESCRIPTION
................... 6-1
7.
SERVICE MODE
..................................................... 7-1
8.
ERROR LOG LIST
................................................. 8-1
9.
TROUBLESHOOTING
............................................. 9-1
10. REPAIR PARTS LIST
10-1. Exploded Views ............................................................ 10-1
10-1-1. Case Section ........................................................... 10-1
10-1-2.
........................................... 10-2
10-1-3.
Main Chassis Section
............................................................. 10-3
10-1-4.
BD Section
.......................................................... 10-4
Accessories
10-2. Electrical Parts List ....................................................... 10-5
BDP-BX58/S480/S483/S580
Schematic Diagram (14/17) ........................................ 4-19
4-11. MB-139 Board (USB) Schematic Diagram (6/17)......... 4-11
4-12. MB-139 Board (HDMI)
Schematic Diagram (7/17)............................................ 4-12
4-13. MB-139 Board (ETHERNET)
Schematic Diagram (8/17)............................................ 4-13
2-9. Circuit Boards Location ................................................ 2-5E
1-5.
Rear Panel Assembly Caution................................... 1-23E
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it
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e
S
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a
P
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lt
i
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e
S
1-3-2. Main functions
......................................................... 1-9
4-9. MB-139 Board (POWER 2)
Schematic Diagram (4/17)............................................ 4-9
4-10. MB-139 Board (FLASH/HOST)
Schematic Diagram (5/17)............................................ 4-10
4-8. MB-139 Board (POWER)
Schematic Diagram (3/17)............................................ 4-8
4-5. FL-203 Board (POWER) Schematic Diagram ... 4-5
4-20. MB-139 Board (DC FAN)
Schematic Diagram (15/17).......................................... 4-20
4-21. MB-139 Board (VIDEO IN OUT)
Schematic Diagram (16/17).......................................... 4-21
4-22. MB-139 Board (SATA)
Schematic Diagram (17/17) ........................................ 4-22
1-1
BDP-BX58/S480/S483/S580
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the upper case. (Refer to page 2-1)
2. Insert a clip in the hole of a drive and open a tray.
Note:
1-2. Work when optical device are replaced
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(Refer to “1-4-8. BU Data Decode Jig” on page 1-19)
STEP 1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
STEP 2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take a photograph of the bar code on the optical device. The valid bar code photo as shown in Fig.2
3. Drag-and-drop the bar code photograph to the icon of decode software (BDPRdec).
* The decode software is a complete set of “BDPRdec”, “Tasman.Bars.dll”, and “SavePath”.
* Because decode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
5. Write the decode data to the set.
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
tray
Fig.2
Fig.1
(Use clip diameter about 1.2 mm)
hole
(12~32)mm
clip