DOWNLOAD Sony BDP-BX57 / BDP-S570 Service Manual ↓ Size: 13.74 MB | Pages: 127 in PDF or view online for FREE

Model
BDP-BX57 BDP-S570
Pages
127
Size
13.74 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD
File
bdp-bx57-bdp-s570.pdf
Date

Sony BDP-BX57 / BDP-S570 Service Manual ▷ View online

Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-731-15
2011C6900-1
© 2011.03
Published by Design Engineering Dept.
BLU-RAY DISC/DVD PLAYER
Ver. 1.4  2011.03
BDP-BX57/S570
RMT-B107A/B107P
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
Australian/ New Zealand Model
System
Laser:  Semiconductor laser
Inputs and outputs
(Jack name:
Jack type/Output level/Load impedance)
LINE OUT R-AUDIO-L:
Phono jack/2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL):
Optical output jack/–18dBm (wave length 660nm)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
HDMI OUT:
HDMI 19-pin standard connector
COMPONENT VIDEO OUT 
(Y, P
B
, P
R
) (US, CND):
Phono jack/Y: 1.0 Vp-p/P
B
, P
R
: 0.7 Vp-p/75 ohms
(Y, P
B
/C
B
, P
R
/C
R
) (EC1, EC2, CEK, AUS):
Phono jack/Y: 1.0 Vp-p/
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p/75 ohms
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LAN (100):
100BASE-TX Terminal
EXT:
External memory slot (For connecting the external 
memory)
DC output: 5 V 500 mA Max
USB:
USB jack Type A (For connecting digital still 
camera and USB memory)
Wireless
Wireless LAN standard:
IEEE802.11a/b/g/n
Frequency range:
US:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-140, 149-165
CANADIAN:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-116, 132-140, 
149-165
AEP, UK:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140
AUSTRALIAN:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-116, 132-140, 
149-165
Modulation:
DS-SS Modem and OFDM Modem
General
Power requirements:
120 V AC, 60 Hz (US, CND)
220 – 240 V AC, 50/60Hz (AEP,UK, AUS)
Power consumption:
24 W
Dimensions (approx.):
430 mm × 219 mm × 46mm
(17 in. × 8 
5
/
8
 in. × 1
13
/
16
 in.)
(width/depth/height) incl. projecting parts
Mass (approx.):
2.3 kg (5 lb 1 
1
/
8
 oz)
Operating temperature:
5 ºC to 35 ºC (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to change 
without notice.
• Audio/video cable (phono plug ×3) (1) 
• AC power cord (1)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
(US, CND, AUS)
 
 
BDP-BX57/S570
BDP-S570
   Photo: BDP-S570
Remote : RMT-B107P
• HDMI cable (1)  (BDP-BX57: US)
NEW ZEALAND:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140, 149-165
(BDP-BX57/S570 :  US Only)
ENERGY STAR and the ENERGY STAR mark 
are registered U.S. marks. ENERGY STAR is a 
registered mark owned by the U.S. government.
– 2 –
BDP-BX57/S570
SAFETY  CHECK-OUT
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers' instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a 
passive VOM that is suitable. Nearly all battery operated digital 
multimeters that have a 2V AC range are suitable. (See Fig. A)
1.  Check
 
the area of your repair for unsoldered or poorly-soldered 
connections. Check the entire board surface for solder splashes 
and bridges.
2.  Check the interboard wiring to ensure that no wires are “pinched” 
or contact high-wattage resistors.
3.  Look for unauthorized replacement parts, particularly transistors, 
that were installed during a previous repair. Point them out to 
the customer and recommend their replacement.
4.  Look for parts which, though functioning, show obvious signs 
of deterioration. Point them out to the customer and recommend 
their replacement.
5.  Check the line cord for cracks and abrasion. Recommend the 
replacement of any such line cord to the customer.
6.  Check the B+ voltage to see it is at the values specified.
7.  Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.
After correcting the original service problem, perform the following 
safety checks before releasing the set to the customer:
1.5k
0.15
µ
F
(0.75 V)
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size.)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40°C higher than 
ordinary solder.
  Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
  Soldering irons using a temperature regulator should be set to 
about 350°C.
  Caution: The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
•  Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to flow) than 
ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.
•  Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye 
hazard.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specified herein may result in hazardous radia-
tion exposure.
2
WARNING
To reduce the risk of  re or electric 
shock, do not expose this apparatus 
to rain or moisture.
To avoid electrical shock, do not 
open the cabinet. Refer servicing to 
quali ed personnel only.
Batteries or batteries installed 
apparatus shall not be exposed to 
excessive heat such as sunshine, 
re or the like.
CAUTION
The use of optical instruments with 
this product will increase eye 
hazard. As the laser beam used in 
this Blu-ray Disc/DVD player is 
harmful to eyes, do not attempt to 
disassemble the cabinet.
Refer servicing to quali ed 
personnel only.
This label is located on the laser 
protective housing inside the 
enclosure.
This appliance is classi ed as a 
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure. 
(Except US, Canadian, E)
Notice for customers in the 
United Kingdom and 
Republic of Ireland
A molded plug complying with 
BS1363 is  tted to this equipment 
for your safety and convenience.
Should the fuse in the plug 
supplied need to be replaced, a 5 
AMP fuse approved by ASTA or 
BSI to BS1362, (i.e., marked with 
 or 
 mark) must be used.
If the plug supplied with this 
equipment has a detachable fuse 
cover, be sure to attach the fuse 
cover after you change the fuse. 
Never use the plug without the fuse 
cover. If you should lose the fuse 
cover, please contact your nearest 
Sony service station.
Disposal of Old Electrical 
& Electronic Equipment 
(Applicable in the 
European Union and 
other European countries 
with separate collection 
systems)
This symbol on the product or on 
its packaging indicates that this 
product shall not be treated as 
household waste. Instead it shall be 
handed over to the applicable 
collection point for the recycling of 
electrical and electronic 
equipment. By ensuring this 
product is disposed of correctly, 
you will help prevent potential 
negative consequences for the 
environment and human health, 
which could otherwise be caused 
by inappropriate waste handling of 
this product. The recycling of 
materials will help to conserve 
natural resources. For more 
detailed information about 
recycling of this product, please 
contact your local Civic O ce, 
your household waste disposal 
service or the shop where you 
purchased the product.
Disposal of was
batteries (appli
the European Un
other Europea
with separate 
systems)
This symbol on the
the packaging in
battery provided
shall not be trea
waste.
By ensuring thes
disposed of correctl
prevent potentia
consequences fo
and human heal
otherwise be cau
inappropriate wa
battery. The recyc
materials will he
natural resource
In case of product
performance or 
reasons require 
connection with
battery, this batte
replaced by qua
only.
To ensure that th
treated properly
product at end-o
applicable collec
recycling of elec
electronic equip
For all other batt
the section on h
battery from the
Hand the battery
applicable collec
recycling of was
For more detaile
about recycling 
battery, please co
Ci vic O ce, you
waste disposal s
where you purch
WARNING!!
WHEN  SERVICING,  DO  NOT  APPROACH  THE  LASER 
EXIT  WITH  THE  EYE  TOO  CLOSELY.  IN  CASE  IT  IS 
NECESSARY  TO  CONFIRM  LASER  BEAM  EMISSION, 
   
E
R
O
M
 
F
O
  
E
C
N
A
T
S
I
D
  
A
  
M
O
R
F
  
E
V
R
E
S
B
O
  
O
T
  
E
R
U
S
  
E
B
THAN   25  cm  FROM  THE  SURFACE  OF  THE OBJEC-
TIVE  LENS  ON  THE  OPTICAL  PICK-UP  BLOCK.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  0
  
E
N
I
L
  
D
E
T
T
O
D
  
R
O
  
WITH  MARK  0
  
N
 
D
N
A
  
S
M
A
R
G
A
I
D
  
C
I
T
A
M
E
H
C
S
  
E
H
T
  
N
O
  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.  RE-
  
E
S
O
H
W
  
S
T
R
A
P
  
Y
N
O
S
  
H
T
I
W
  
S
T
N
E
N
O
P
M
O
C
  
E
S
E
H
T
  
E
C
A
L
P
  
R
O
  
L
A
U
N
A
M
  
S
I
H
T
  
N
 
N
W
O
H
S
  
S
A
  
R
A
E
P
P
A
  
S
R
E
B
M
U
N
  
T
R
A
P
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES    COMPOSANTS    IDENTIFIÉS    PAR    UNE    MARQUE      
  
E
T
S
I
L
 
 
A
L
 
 
T
E
 
 
S
E
U
Q
I
T
A
M
É
H
C
S
 
 
S
E
M
M
A
R
G
A
I
D
 
 
S
E
L
 
 
R
U
S
  
E
D
  
É
T
I
R
U
C
É
S
  
A
L
  
R
U
O
P
  
S
E
U
Q
I
T
I
R
C
  
T
N
O
S
  
S
E
C
È
I
P
  
S
E
D
  
S
T
N
A
S
O
P
M
O
C
  
S
E
C
  
R
E
C
A
L
P
M
E
R
  
E
N
  
.
T
N
E
M
E
N
N
O
I
T
C
N
O
F
  
T
N
O
S
  
S
O
R
É
M
U
N
  
S
E
L
  
T
N
O
D
  
Y
N
O
S
  
S
E
C
È
I
P
  
S
E
D
  
R
A
P
  
E
U
Q
DONNÉS    DANS    CE    MANUEL    OU    DANS    LES    SUPPLÉ-
MENTS  PUBLIÉS  PAR  SONY.
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure. (AEP, UK, Australian 
New Zealand)
– 3 –
TABLE  OF  CONTENTS
1. 
SERVICE  NOTE
1-1.  Disc Removal Procedure If The Tray Cannot Be 
 
Ejected (Forced Ejection) .............................................  1-1
1-2.  Work when optical device are replaced ........................  1-1
1-3.  Test Disc .......................................................................  1-2
  1-3-1.  Operation and Display .............................................  1-2
1-4.  Drive Repairing.............................................................  1-15
  1-4-1.  Preparation ..............................................................  1-15
  1-4-2.  Checking Flow ~ Drive (BU) section ~ ....................  1-15
  1-4-3.  BU Check Flow [zz] ~ ..............................................  1-16
  1-4-4.  BU (Optical Block) Repair Guide .............................  1-16
  1-4-5.  BU Adjustment Flow [yy] ~ ......................................  1-17
  1-4-6.  KEM-460AAA/C2RP Packing Spec. .......................  1-17
  1-4-7.  KEM-460AAA/C2RP Packing ..................................  1-18
  1-4-8.  BU Data Decode Jig ................................................  1-18
  1-4-9.  Loading For Service      .........................................  1-19
  1-4-10.  Laser Caution Label ................................................  1-19
2. 
DISASSEMBLY
3. 
BLOCK  DIAGRAMS
3-1.  Overall Block Diagram..................................................  3-1
3-2.  DSP Block Diagram ......................................................  3-2
3-3.  AV OUT Block Diagram ................................................  3-3
4
-
3
 
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
  
  
  
m
a
r
g
a
i
D
 
k
c
o
l
B
  
N
A
L
W
/
R
E
H
T
E
/
B
S
U
 .
4
-
3
5
-
3
 
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
 
  
  
  
 )
2
/
1
m
a
r
g
a
i
D
 
k
c
o
l
B
 r
e
w
o
P
 .
5
-
3
4. 
SCHEMATIC  DIAGRAMS
4-1.  This Note Is Common For Schematic Diagrams ..........  4-1
4-2.  Frame Schematic Diagram...........................................  4-2
4-3.  FR-310 Board (FRONT RIGHT) Schematic Diagram ... 4-3
4-4.  FR-310 Board (USB FRONT CONNECTOR) 
 
.....................................................
 
4-4
4-5.
 
HU-015 Board (USB HUB) Schematic Diagram...........
 
4-5
4-6.  ANT-007 Board (ANTENNA) Schematic Diagram........  4-6
4-16.  MB-134 Board (AUDIO) 
 
Schematic Diagram (9/15)............................................  4-16
4-17.  MB-134 Board (VIDEO) 
 
Schematic Diagram (10/15)..........................................  4-17
4-18.  MB-134 Board (GPIO/JTAG) 
 
Schematic Diagram (11/15) ..........................................  4-18
4-19.  MB-134 Board (ETHERNET) 
 
Schematic Diagram (12/15)..........................................  4-19
4-20.  MB-134 Board (FE_POWER/SF/SATA) 
 
Schematic Diagram (13/15)..........................................  4-20
4-21.  MB-134 Board (FE_OP/MOTOR DRIVE)  
4-26.  USB-024 Board (USB REAR CONNECTOR) 
 
Schematic Diagram ......................................................  4-24
4-27.  Waveforms ...................................................................  4-25E
5. 
PRINTED  WIRING  BOARDS
5-1.  This Note Is Common For Printed Wiring Boards ........  5-1
5-2.  SWB-001 Board (SWITCH) Printed Wiring Board........  5-2
5-3.  SWP-001 Board  
 
Printed Wiring Board ......................................................  5-2
5-4.  FR-310 Board (FRONT RIGHT) 
 
Printed Wiring Board ...................................................  5-3
5-8.  MB-134 Board (MAIN) 
 
Printed Wiring Board (Side A) ......................................  5-7
5-9.  MB-134 Board (MAIN) 
 
Printed Wiring Board (Side B) ......................................  5-8
 )
R
A
E
R
d
r
a
o
B
 
4
2
0
-
B
S
U
 .
1
1
-
5
 
Printed Wiring Board ....................................................  5-10E
6. 
IC  PIN  FUNCTION  DESCRIPTION
 ...................  6-1
7. 
SERVICE  MODE
 .....................................................  7-1
8.  ERROR  LOG  LIST
 .................................................  8-1
9.  TROUBLESHOOTING
 .............................................  9-1
10.   REPAIR  PARTS  LIST
10-1.  Exploded Views ............................................................  10-1
  10-1-1.  Case Section ...........................................................  10-1
  10-1-2.  Front/Rear Chassis Section ....................................  10-2
  10-1-3.  Main Chassis Section ..............................................  10-3
  10-1-4.  BD Section ..............................................................  10-4
  10-1-5.  Accessories .............................................................  10-5
10-2.  Electrical Parts List .......................................................  10-6
BDP-BX57/S570
4-22.  MB-134 BOARD(IFD) 
2
2
-
4
 ..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
  
 
  )
5
1
/
5
1
(  
m
a
r
g
a
i
D
 
c
it
a
m
e
h
c
S
 
4-23.  SWB-001 BOARD 
4-24.  SWP-001 BOARD
Schematic Diagram (14/15) ........................................  4-21
 
Schematic Diagram   ...................................................... 4-23
 
Schematic Diagram   ...................................................... 4-23
4-13.  MB-134 Board (USB) Schematic Diagram (6/15).........  4-13
4-14.  MB-134 Board (HDMI) 
 
Schematic Diagram (7/15)............................................  4-14
4-15.  MB-134 Board (SATA) 
 
Schematic Diagram (8/15)............................................  4-15
1-5.  Harness Dressing .........................................................  1-22
  1-5-1.  Harness (SIM-001)
 
..................................................  1-22
  1-5-2.  USB (USB-007).......................................................
 
9
-
1
 
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
..
.
 
s
n
o
it
c
n
u
n
i
a
M
 .
2
-
3
-
1
  
1-6. Power Cord Soldering Location ................................... 1-22
1-6-1. Soldering point for Switching Regulator (APS-257).... 1-22
1-6-2. Soldering point for Switching Regulator (SRV2206UC)1-22
 )
T
S
O
H
/
H
S
A
L
F
d
r
a
o
B
 
4
3
1
-
B
M
 .
2
1
-
4
 
Schematic Diagram (5/15)............................................  4-12
4-7.
 
2-1.  Disassembly Flow ........................................................  2-1
2-2.  Upper Case ..................................................................  2-1
2-3.  Front Panel Block .........................................................  2-2
2-4.  BD Drive .......................................................................  2-3
2-5.  Wireless Lan Card Block,
 EM-002 Board and HU-015 Block................................
 
2-3
2-6.  Rear Panel Block..........................................................  2-4
2-7.  MB-134 Board ..............................................................  2-4
2-8.  Switching Regulator .....................................................  2-5E
2-9.  Circuit Boards Location ................................................  2-5E
3-6. Power Block Diagram (2/2) .......................................... 3-6E
5-5. HU-015 Board (USB HUB) Printed Wiring Board
5-4
 
 
 
5-6.  ANT-007 Board (ANTENNA) Printed Wiring Board ......  5-5
5-7.  ANT-008 Board (ANTENNA) Printed Wiring Board ......  5-6
 )
r
o
t
c
e
n
n
o
C
d
r
a
o
B
 
2
0
0
-
M
E
 .
0
1
-
5
 
Printed Wiring Board ....................................................  5-9
ANT-008 Board (ANTENNA) Schematic Diagram........  4-7
4-8.   MB-134 Board (CXD9983GG/9984GG) 
 
Schematic Diagram (1/15)............................................ 4-8
4-9.   MB-134 Board (CXD9983GG/9984GG) 
 
Schematic Diagram (2/15)............................................ 4-9
4-10.   MB-134 Board (POWER1) 
 
Schematic Diagram (3/15) ...........................................  4-10
4-11. MB-134 Board (CLK/POWER2) 
 
Schematic Diagram (4/15) ..........................................  4-11
4-25.  EM-002  BOARD
 
  
 
Schematic Diagram   ...................................................... 4-24
1-22
Schematic Diagram
Section 
Title 
Page
Section 
Title 
Page
1-7. Avoid Switching Regulator Board 
          (APS-257) from Floating............................................... 1-23E
1-8.
        Remove PT Protection on MB-134 
          (Service Assy Main Board) .......................................
1-23E
1-1
BDP-BX57/S570
SECTION  1
SERVICE  NOTE
1-1.  DISC  REMOVAL  PROCEDURE  IF  THE  TRAY  CANNOT  BE  EJECTED (FORCED  EJECTION)
1.  Remove the upper case. (Refer to page 2-1)
2.  Insert a clip in the hole of a drive and open a tray. 
 
Note:
1-2.  Work when optical device are replaced
Note: Please do the following work when you replace the optical device. 
1.  Install it in PC after downloading two set of software from following URL. 
 
(Refer to “1-4-9. BU Data Decode Jig” on page 1-19)
 
STEP 1
 
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
 
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
 
STEP 2
 
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
 
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2.  Take a photograph of the bar code on the optical device. The valid bar code photo as shown in  Fig.2
 
3.  Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec). 
*  The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”. 
*  Because decode software cannot be attached, it separately distributes it.
4.  Input the password when you start decode software.
*  Inquire of each service headquarters because the password cannot be disclosed. 
5.  Write the decode data to the set. 
 
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
tray
Fig.2
Fig.1
(Use clip diameter about 1.2 mm)
hole
(12~32)mm
clip
Page of 127
Display

Sony BDP-BX57 / BDP-S570 Service Manual ▷ Download

  • DOWNLOAD Sony BDP-BX57 / BDP-S570 Service Manual ↓ Size: 13.74 MB | Pages: 127 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony BDP-BX57 / BDP-S570 in PDF for free, which will help you to disassemble, recover, fix and repair Sony BDP-BX57 / BDP-S570 DVD. Information contained in Sony BDP-BX57 / BDP-S570 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.