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2012

H6900-1

© 2012.08

Laser:  Semiconductor laser

Inputs and outputs

(Jack name:

Jack type/Output level/Load impedance)

HDMI 19-pin standard connector

(Y, P

B

, P

R

Phono jack/Y: 1.0 Vp-p/
P

B

, P

R

: 0.7 Vp-p/75 ohms

Phono jack/1.0 Vp-p/75 ohms

100BASE-TX Terminal

USB jack Type A (For connecting a USB memory,

Power requirements:

120V  AC, 60Hz (US, CND)
220 – 240V AC, 50/60Hz (AEP,UK, AUS,RUS,CN)

18 W (BDP-S380/S383/BX38)

430 mm  ×  199 mm  ×  36mm
(17 in. × 7 

4

/

5

 in. × 1

7

/

16

 in.)

(width/depth/height) incl. projecting parts

1..6 kg 

5 ºC to 35 ºC(41 F to 95 F) 

25 % to 80 %

Specifications and design are subject to change 
without notice.

‡ Audio/video cable (phono plug ×3) (1) 

‡ Remote commander (remote) (1)
‡ Size AA (R6) batteries (2)

 

 

   Photo: BDP-S280
Remote : RMT-B109A

‡ HDMI cable (1)  (Except 

AEP,UK,AUS,US,CND,PX,RUS)

(BDP-S280:US/S380:US/BX38:US)

ENERGY STAR and the ENERGY STAR mark 
are registered U.S. marks. ENERGY STAR is a 
registered mark owned by the U.S. government.

memory card reader,digital stil camera and digital
video camera)
All model (REAR USB) 
BDP-BX38/S380/S383 (FRONT USB)

‡

(1)  (BDP-S380 : 

TW

  only)

LAN cable

(Except 

AEP,UK,E,AR,SP,TH,CN,IN

,TW)

16 W (BDP-S280)

110 – 240V AC, 50/60Hz (PX,E,AR,BR,SP,TH,EA,KS,IN)
110V AC, 60Hz (TW)

) :

Phone jack/2 Vrms/10 kilohms

Phono jack/0.5 Vp-p/75 ohms

  BDP-S380

  BDP-S280/S380/BX38

  BDP-S280/S380/S383

º

º

  BDP-S280/S380/S383

  BDP-S280/S380

  BDP-S380/S383

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers' instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a 
passive VOM that is suitable. Nearly all battery operated digital 
multimeters that have a 2V AC range are suitable. (See Fig. A)

1. Check the area of your repair for unsoldered or poorly-soldered 

connections. Check the entire board surface for solder splashes 
and bridges.

2.  Check the interboard wiring to ensure that no wires are “pinched” 

or contact high-wattage resistors.

3.  Look for unauthorized replacement parts, particularly transistors, 

that were installed during a previous repair. Point them out to 
the customer and recommend their replacement.

4.  Look for parts which, though functioning, show obvious signs 

of deterioration. Point them out to the customer and recommend 
their replacement.

5.  Check the line cord for cracks and abrasion. Recommend the 

replacement of any such line cord to the customer.

6.  Check the B+ voltage to see it is at the values specified.
7.  Check the antenna terminals, metal trim, “metallized” knobs, 

screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.

After correcting the original service problem, perform the following 
safety checks before releasing the set to the customer:

Ω

μ

Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
‡  Unleaded solder melts at a temperature about 40°C higher than 

ordinary solder.

  Ordinary soldering irons can be used but the iron tip has to be 

applied to the solder joint for a slightly longer time.

  Soldering irons using a temperature regulator should be set to 

about 350°C.

  Caution: The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

‡ Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to flow) than 

ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.

‡  Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may 

also be added to ordinary solder.

CAUTION:
The use of optical instrument with this product will increase eye 
hazard.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specified herein may result in hazardous radia-
tion exposure.

This label is located on the laser 
protective housing inside the 
enclosure.

product. The CLASS 1 LASER PRODUCT 
MARKING is located on the rear exterior.

1. 

SERVICE  NOTE

1-1.  Disc Removal Procedure If The Tray Cannot Be 
 

Ejected (Forced Ejection) .............................................  1-1

1-2.  Work when optical device are replaced ........................  1-1
1-3. Test 

Disc 

.......................................................................  

1-2

  1-3-1.  Operation and Display .............................................  1-2

1-4. Drive 

Repairing.............................................................  

1-15

  1-4-1.  Preparation ..............................................................  1-15
  1-4-2.  Checking Flow ~ Drive (BU) section ~ ....................  1-15
  1-4-3.  BU Check Flow [zz] ~ ..............................................  1-16
  1-4-4.  BU (Optical Block) Repair Guide .............................  1-16
  1-4-5.  BU Adjustment Flow [yy] ~ ......................................  1-17
  1-4-6.  KEM-470AAA/C2RP Packing Spec. .......................  1-17
  1-4-7.  KEM-470AAA/C2RP Packing ..................................  1-18

  1-4-8.  BU Data Decode Jig ................................................  1-19
  1-4-9.  Loading For Service

      .........................................  1-20

  1-4-10.  Laser Caution Label ................................................  1-20

2. DISASSEMBLY

2-1. Disassembly 

Flow 

........................................................  

2-1

2-2. Upper 

Case 

..................................................................  

2-1

2-3. Tray 

Cover 

Assy 

 

..........................................................  

2-2

2-4.  Front Panel Assy, FL-203 and IF-170 Board

 ....                                                    ...............  2-2

2-5.  Rear Panel Block .........................................................  2-3
2-6.  MB-138 Board  .............................................................  2-3
2-7. BD 

Drive

 

.......................................................................  2-4

2-8.    Switching Regulator .....................................................  2-5E

3. 

BLOCK  DIAGRAMS

3-1.  Overall Block Diagram..................................................  3-1
3-2.  DSP Block Diagram ......................................................  3-2
3-3.  AV OUT Block Diagram ................................................  3-3
3-4.  USB/ETHER,  Block Diagram      ..................................  3-4
3-5.  Power Block Diagram         ..........................................  3-5E

4. 

SCHEMATIC  DIAGRAMS

4-1.  This Note Is Common For Schematic Diagrams ..........  4-1
4-2.  Frame Schematic Diagram...........................................  4-2
4-3.  IF-170 Board (FRONT LEFT) Schematic Diagram  ... 4-3
4-4.  IF-170 Board (USB FRONT) Schematic Diagram  ...... 4-4

4-6.  MB-138 Board (DDR 3 A) 
 

Schematic Diagram (1/14)............................................  4-6

4-7.  MB-138 Board (DDR 3 B) 
 

Schematic Diagram (2/14)............................................  4-7

4-14.  MB-138 Board (AUDIO) 
 

Schematic Diagram (9/14)............................................  4-14

4-15.  MB-138 Board (VIDEO) 
 

Schematic Diagram (10/14)..........................................  4-15

4-16.  MB-138 Board (GPIO/JTAG) 
 

Schematic Diagram (11/14) ..........................................  4-16

4-17.  MB-138 Board (IF CON) 
 

Schematic Diagram (12/14)..........................................  4-17

4-18.  MB-138 Board (FE_POWER/OP/GIO) 
 

Schematic Diagram (13/14)..........................................  4-18

4-19.  MB-138 Board (FE_POWER/MOTOR DRIVE)  

4-20. Waveforms ...................................................................  4-20E

5. 

PRINTED  WIRING  BOARDS

5-1.  This Note Is Common For Printed Wiring Boards ........  5-1
5-2.  FL-203 Board (FRONT LEFT) Printed Wiring Board.....   5-2
5-3.  IF-170 Board  
 

Printed Wiring Board ......................................................  5-3

5-4. MB-138 

Board(MAIN)

 

Printed Wiring Board (Side A)   ...................................

..  5-4

5-5.  MB-138 Board (MAIN) 
 

Printed Wiring Board (Side B) ......................................  5-5E

6. 

IC  PIN  FUNCTION  DESCRIPTION

 ...................   6-1

7. 

SERVICE  MODE

 .....................................................   7-1

8. 

ERROR  LOG  LIST

 .................................................   8-1

9. TROUBLESHOOTING

 .............................................  9-1

10.  REPAIR  PARTS  LIST

10-1. Exploded Views ............................................................  10-1
  10-1-1.  Case Section ...........................................................  10-1
  10-1-2. 

 

...........................................  10-2

  10-1-3. 

Main Chassis Section

 

.............................................................  10-3

  10-1-4. 

BD Section

 ..........................................................  

10-4

  Accessories 

 

10-2.  Electrical Parts List .......................................................  10-5

Schematic Diagram (14/14) ........................................  4-19

4-11.  MB-138 Board (USB) Schematic Diagram (6/14).........  4-11

4-12.  MB-138 Board (HDMI) 
 

Schematic Diagram (7/14)............................................  4-12

4-13.  MB-138 Board (ETHERNET) 
 

Schematic Diagram (8/14)............................................  4-13

2-9.    Circuit Boards Location ................................................  2-5E

1-5.

 

Rear Panel Assembly Caution.................................

..  1-23E

  1-3-2.  Main functions

 

.........................................................  1-9

4-9.  MB-138 Board (CLK/POWER) 
 

Schematic Diagram (4/14)............................................  4-9

4-10.  MB-138 Board (FLASH/HOST) 
 

Schematic Diagram (5/14)............................................  4-10

4-8.  MB-138 Board (POWER) 
 

Schematic Diagram (3/14)............................................  4-8

4-5.  FL-203 Board (FRONT RIGHT)  Schematic Diagram ... 4-5

1.  Remove the upper case. (Refer to page 2-1)
2.  Insert a clip in the hole of a drive and open a tray. 
 

Note: Please do the following work when you replace the optical device. 

1.  Install it in PC after downloading two set of software from following URL. 
 

(Refer to “1-4-9. BU Data Decode Jig” on page 1-19)

 STEP 

1

 

Microsoft .NET Framework Version 2.0 Redistributable Package (x86)

 

http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5

 STEP 

2

 

Microsoft .NET Framework 2.0 Service Pack 1 (x86)

 

http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5

2.  Take a photograph of the bar code on the optical device. The valid bar code photo as shown in  Fig.2

 

3.  Drag-and-drop the bar code photograph to the icon of decode software (BDPRdec). 
*  The decode software is a complete set of “BDPRdec”,  “Tasman.Bars.dll”, and “SavePath”. 
*  Because decode software cannot be attached, it separately distributes it.

4.  Input the password when you start decode software.
*  Inquire of each service headquarters because the password cannot be disclosed. 

5.  Write the decode data to the set. 
 

(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)

tray

Fig.2

Fig.1

(Use clip diameter about 1.2 mm)

hole

(12~32)mm

clip