DOWNLOAD Sony DSC-T1 / DSC-T11 (serv.man2) Service Manual ↓ Size: 1.38 MB | Pages: 40 in PDF or view online for FREE

• For ADJUSTMENTS (SECTION 6), refer to SERVICE MANUAL, ADJ (987628053.pdf).
• For INSTRUCTION MANUAL, refer to SERVICE MANUAL, LEVEL 1 (987628043.pdf).

• Reference No. search on printed wiring boards is available.

This service manual provides the information that is premised the circuit board replacement service and not intended repair
inside the LD-140, MS-148 and SY-95 boards.
Therefore, schematic diagram, printed wiring board, waveforms, mounted parts location and electrical parts list of the LD-140,
MS-148 and SY-95 boards are not shown.
The following pages are not shown.

Schematic diagram ............................. Pages 4-15 to 4-36
Printed wiring board ............................ Pages 4-45 to 4-52

Mounted parts location ............................. Pages 4-54 to 4-55
Electrical parts list ................................... Pages 5-7 to 5-11

DSC-T1

US Model

Canadian Model

AEP Model

UK Model

E Model

Hong Kong Model

Australian Model

Korea Model

Chinese Model

Tourist Model

Japanese Model

— 2 —

x

7.66 mm (1/2.4 type) color CCD
Primary color filter

Approx. 5 255 000 pixels

Approx. 5 090 000 pixels

Carl Zeiss Vario-Tessar
3

×

 zoom lens

f = 6.7 – 20.1 mm (38 – 114 mm when 
converted to a 35 mm still camera)
F3.5 – 4.4

Automatic exposure, Scene selection 
(8 modes)

Automatic, Daylight, Cloudy, 
Fluorescent, Incandescent, Flash

Still images: Exif Ver. 2.2 JPEG 
compliant, DPOF compatible
Audio with still image: MPEG1 
compliant (Monaural)
Movies: MPEG1 compliant 
(Monaural)

“Memory Stick Duo”

Recommended distance (ISO set to 
Auto): 
0.3 m to 1.5 m (11 7/8 inches to 
59 1/8 inches) (W)
0.5 m to 1.5 m (19 3/4 inches to 
59 1/8 inches) (T)

6.2 cm (2.5 type) TFT drive

211200 (960

×

220) dots

NP-FT1

3.6 V

1.6 W

0

°

C to +40

°

C (+32

°

F to +104

°

F)

–20

°

C to +60

°

C (–4

°

F to +140

°

F)

91 

× 

60 

× 

21 mm 

(3 5/8 

× 

2 3/8 

× 

2 7/32 inches) 

(W/H/D, excluding maximum 
protrusions)

Approx. 180 g (6.3 oz) (including 
battery pack NP-FT1, “Memory Stick 
Duo” and wrist strap)

Electret condenser microphone

Piezo-electric speaker

Compatible

Compatible

x

Minijack 
Video: 1 Vp-p, 75 

Ω

, unbalanced, 

sync negative 

Audio: 327 mV (at a 47 k

Ω

 load) 

Output impedance 1 k

Ω

B

High-Speed USB 
(USB 2.0 High-Speed compatible)

x

100 to 240 V AC, 50/60 Hz

0.2 A

10 W

4.2 V DC, 1.5 A

0

°

C to +40

°

C (+32

°

F to +104

°

F) 

–20

°

C to +60

°

C (–4

°

F to +140

°

F) 

Approx. 47 

× 

30 

× 

80 mm

 

(1 7/ 8 

× 

1

 

3/16 

× 

31/4 inches) 

(W/H/D, excluding projecting parts)

Approx. 170 g (6.0 oz) excluding 
power cord (mains lead)

x

Lithium-ion battery 

DC 4.2 V 

DC 3.6 V

2.4 Wh (680 mAh)

x

• AC-LM5 AC Adaptor (1) 

• Power cord (mains lead) (1)

• UC-TA USB cradle (1)

• USB cable (1)

• NP-FT1 battery pack (1)

• A/V connecting cable (1)

• Wrist strap (1)

• “Memory Stick Duo” (32 MB) (1)

• Memory Stick Duo Adaptor (1)

• CD-ROM (USB driver SPVD-013) (1)

• Operating instructions (1)

Design and specifications are subject to change 
without notice.

— 3 —

1.

Check the area of your repair for unsoldered or poorly-soldered
connections.  Check the entire board surface for solder splashes
and bridges.

2.

Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.

3.

Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.  Point
them out to the customer and recommend their replacement.

4.

Look for parts which, through functioning, show obvious signs
of deterioration.  Point them out to the customer and
recommend their replacement.

5.

Check the B+ voltage to see it is at the values specified.

6.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

After correcting the original service problem, perform the following

safety checks before releasing the set to the customer.

0

0

0

CAUTION :
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

— 4 —

........................................................ 1-1

2-1.

DISASSEMBLY ······························································ 2-1

2-2.

SERVICE POSITION ····················································· 2-3

2-3.

CIRCUIT BOARDS LOCATION ··································· 2-5

2-4.

FLEXIBLE BOARDS LOCATION ································ 2-5

HELP (List of caution points is shown here.)

3-1.

OVERALL BLOCK DIAGRAM (1/2) ··························· 3-1

3-2.

OVERALL BLOCK DIAGRAM (2/2) ··························· 3-3

3-3.

POWER BLOCK DIAGRAM (1/2) ································ 3-5

3-4.

POWER BLOCK DIAGRAM (2/2) ································ 3-7

4-1.

FRAME SCHEMATIC DIAGRAM (1/2) ······················· 4-1
FRAME SCHEMATIC DIAGRAM (2/2) ······················· 4-3

4-2.

SCHEMATIC DIAGRAMS

• CD-463 (CCD IMAGER)

SCHEMATIC DIAGRAM ······························ 4-7

• CN-198 (MULTI CONNECTOR)

SCHEMATIC DIAGRAM ······························ 4-9

• ST-86 (FLASH)

SCHEMATIC DIAGRAM ···························· 4-11

• CONTROL SWITCH BLOCK (PW-125)

SCHEMATIC DIAGRAM ···························· 4-13

Shematic diagram of the SY-95, MS-148 and LD-140
boards are not shown.
Pages from 4-15 to 4-36 are not shown.

4-3.

PRINTED WIRING BOARDS

• CD-463 (CCD IMAGER)

PRINTED WIRING BOARD ······················· 4-41

• ST-86 (FLASH)

PRINTED WIRING BOARD ······················· 4-42

• CN-198 (MULTI CONNECTOR)

PRINTED WIRING BOARD ······················· 4-43

Printed wiring board of the SY-95, MS-148, LD-140
and FP-694 boards are not shown.
Pages from 4-45 to 4-52 are not shown.

4-4.

MOUNTED PARTS LOCATION ································· 4-53

Mounted parts location of the SY-95, MS-148
and FP-695  boards are not shown.
Pages from 4-54 to 4-55 are not shown.

5-1.

EXPLODED VIEWS ······················································ 5-1

5-1-1.  OVERALL SECTION ···················································· 5-3
5-1-2. BATTERY HOLDER SECTION ···································· 5-4
5-1-3. CABINET (REAR) SECTION ······································· 5-5
5-2.

ELECTRICAL PARTS LIST ·········································· 5-6

Parts list of the SY-95, MS-148 and LD-140 boards
are not shown.
Pages from 5-7 to 5-11 are not shown.