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DSC-R1_L2

2008J0500-1

  © 2008.10

US Model

Canadian Model

AEP Model

UK Model

E Model

Australian Model

Hong Kong Model

Chinese Model

Korea Model

Japanese Model

Tourist Model

The components identified by
mark  0  or dotted line with
mark 0 are critical for safety.
Replace only with part num-
ber specified.

Les composants identifiés par une
marque  0  sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.

• Precaution on Replacing the SY-132 Board
• Note for Disassemble Lens Assemble Repair (EK01A)

Revised-1

Replace the previously issued
SERVICE MANUAL 9-876-898-31
with this manual.

— 2 —

DSC-R1_L2

Image device

21.5 

× 14.4 mm color CMOS 

sensor, Primary 3-color filter

Total pixel number of camera

Approx. 10 784 000 pixels

Effective pixel number of camera

Approx. 10 286 000 pixels

Lens

Carl Zeiss Vario-Sonnar T

*

5

× zoom lens

f = 14.3 

− 71.5 mm (24 − 

120 mm when converted to a 
35 mm still camera)
F2.8 

− 4.8

Filter diameter: 67 mm

Exposure control Automatic, Shutter speed 

priority, Aperture priority, 
Manual exposure, Scene 
selection (4 modes)

White balance

Automatic, Daylight, Cloudy, 
Fluorescent, Incandescent, 
Flash, One-push

File format (DCF compliant)

Still images: Exif Ver. 2.21
JPEG compliant, RAW (SR2), 
DPOF compatible

Recording media “Memory Stick”

Microdrive
CompactFlash card (TypeI/
TypeII)

Flash

Recommended distance (ISO 
set to Auto): approx. 0.5 m to 
8.5 m (1 feet 7 3/4 inches to 27 
feet 10 3/4 inches) (W)/approx. 
0.4 m to 5.0 m (1 feet 3 3/4 
inches to 16 feet 4 7/8 inches) 
(T)

Viewfinder

Electric viewfinder (color)

VIDEO OUT jack

Minijack
1 Vp-p, 75 

Ω, unbalanced, sync 

negative

ACC jack

Mini-minijack (ø 2.5 mm)

USB jack

mini-B

USB communication

Hi-Speed USB (USB 2.0 
compliant)

LCD panel

5.1 cm (2.0 type) TFT drive

Total number of dots

134 000 (560 

× 240) dots

LCD panel

1.1 cm (0.44 type) TFT drive

Total number of dots

235 200 (980 

× 240) dots

Used battery pack

Rechargeable battery pack 
NP-FM50

Power requirements

7.2 V

Power consumption (during shooting with LCD 

on)
1.7 W

Operating temperature

0

°C to +40°C (+32°F to 

+104

°F)

(When using the Microdrive: 
+5

°C to +40°C (41°F to 

+104

°F))

Storage temperature

−20°C to +60°C (−4°F to 
+140

°F)

Dimensions (lens: W-end)

139.4 

× 97.7 × 156.0 mm

(5 1/2 

× 3 7/8 × 6 1/4 inches)

(W/H/D, excluding protrusions)

Mass

Approx. 1047 g (2 lb 4.9 oz) 
(including NP-FM50 battery 
pack, “Memory Stick”, 
shoulder strap, and lens hood, 
etc.)

Speaker

Dynamic speaker

Exif Print

Compatible

PRINT Image Matching III

Compatible

PictBridge

Compatible

Input rating

100 V to 240 V AC, 50/60 Hz, 
18 W 

Output rating

 8.4 V DC*
* See the label on the AC 

Adaptor for other 
specifications.

Operating temperature range

0

°C to +40°C (32°F to +104°F)

Storage temperature range

-20

°C to +60°C (-4°F to 

+140

°F)

Maximum dimensions

Approx. 56 

× 31 × 100 mm 

(2 1/4 

× 1 1/4 × 4 inches) (W/H/

D), excluding projecting parts

Mass

Approx. 190 g (6.7 oz) 
excluding power cord (mains 
lead)

Used battery

Lithium-ion battery

Maximum voltage 

DC 8.4 V 

Nominal voltage  DC 7.2 V

Capacity 

8.5 Wh (1 180 mAh)

Design and specifications are subject to change 
without notice.

— 3 —

DSC-R1_L2

0

0

0

1.

Check the area of your repair for unsoldered or poorly-soldered
connections.  Check the entire board surface for solder splashes
and bridges.

2.

Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.

3.

Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.  Point
them out to the customer and recommend their replacement.

4.

Look for parts which, through functioning, show obvious signs
of deterioration.  Point them out to the customer and
recommend their replacement.

5.

Check the B+ voltage to see it is at the values specified.

6.

FLEXIBLE Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

After correcting the original service problem, perform the following

safety checks before releasing the set to the customer.

CAUTION

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

— 4 —

DSC-R1_L2

1-1.

Description on Self-diagnosis Display ···························· 1-1

1-2.

Precaution on Replacing the SY-132 Board ···················· 1-2

1-3.

Note when Replacing the Lens Block,
CMOS Block and Optical Filter Block ··························· 1-3

2-1.

Disassembly ····································································· 2-3

2-2.

The Method Of Attachment Of
PN-002 Flexible Board ···················································· 2-5

2-3.

How To Disassemble BT Lid ·········································· 2-7

2-4.

The Method Of Attachment Of BK-002 Board
and Control (Mode) Switch Block ·································· 2-7

3-1.

Overall Block Diagram (1/3) ··········································· 3-1

3-2.

Overall Block Diagram (2/3) ··········································· 3-3

3-3.

Overall Block Diagram (3/3) ··········································· 3-5

3-4.

Power Block Diagram (1/3) ············································· 3-7

3-5.

Power Block Diagram (2/3) ············································· 3-9

3-6.

Power Block Diagram (3/3) ··········································· 3-11

4-1.

Frame Schematic Diagram ·············································· 4-1

4-2.

Schematic Diagrams ························································ 4-5

4-3.

Printed Wiring Boards ··················································· 4-43

4-4.

Waveforms ····································································· 4-69

4-5.

Mounted Parts Location ················································ 4-74

5-1.

Exploded Views ······························································· 5-2

5-2.

Electrical Parts List ························································· 5-9

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