Sony DSC-HX50 / DSC-HX50V Service Manual ▷ View online
4-3
DSC-HX50/HX50V_L3
4-3. POWER BLOCK DIAGRAM (1/2)
( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
21,26,28
BT901
BATTERY
TERMINAL
SY-1018 BOARD (1/2)
BATT_UNREG
BATT_UNREG
REG_UNREG
REG_UNREG
ST_UNREG
BATT_TEMP
BATT_UNREG
BATT_TEMP
BATT_TEMP
REG_GND
CN712
Q051
F051
S
HDMI_5.0V
USB_VBUS
19
1
USB_VBUS_DET
USB_VBUS_DET
08
15
XPWR_ON_ACC
CN704
CN711
D701
CN701
CN405
A_3.3V
A_3.3V
DD_3.3V
VINT1
VDD
VDDIO
DRV
ST_UNREG
REG_UNREG
REG_UNREG
CD-1005 FLEXIBLE BOARD
MULTI
HDMI
F052
NEGATIVE
VOLTAGE
PROTECTOR
VB
NVP
D3
SFOUT
C4
THM
C1
PVCC1
A_VID, D_VID
B1
A5, B5
BATT
A3, B3
F053
PVCC2
A3
PVCC3
A4
PVCC4
E8
LX5
G1
AUX_PWR_ON
SD_PWR_ON
C5
A4, B4
SYS
LX1 C1
IN1 D2
USB
INTERFACE
(2/11)
IC051
DC/DC CONVERTER
(1/11)
IC001
FRONT CONTROL
(3/11)
IC101
Q251
L001
DD_1.2V
LX2 A2
IN2 C3
L002
DD_1.8V, A_1.8V
LX3 A5
IN3 B6
L003
L006
D002
L005
F001
DD_3.3V, A_3.3V
MT_5.0V
VO4 B7
VL6 F8
PSWOUT5 G3
BL_H
BL_L
LX6 G7
OVP6 F7
IN4 C7
DD_1.8V
DD_3.3V
DD_3.3V
MS_PWR_ON
MS_PWR_ON
C6
PWM6
CABC_PWM
F6
XCTRL
XWAKE
D3
XWAKE
F1
EXT_VCC
AUX_PSW A7
MS_VCC
MS_PSW A8
DDR_1.2V
VOUT2 B3
DDR_1.8V
VOUT3 B4
DD_1.2V
DD_1.8V, A_1.8V
DD_3.3V, A_3.3V
EXT_VCC
DDR_1.2V
DDR_1.8V
DDR_1.8V
EVER_VDD
EVER_VDD
BACKUP_VDD
VOUT1 C4
D251
D001
FRC_RTG_IN1
SD_PWR_ON
GPIO_S_6
MS_PWR_ON
P24
LCD_CABC_PWM
CABC_PWM
UNREG_MON
BATT_SENS
F2
ADC0_IN0
A11
XPWR_OFF
XPWR_OFF
BATT_SENS
XPWR_OFF
XPWR_OFF
USB_CUR_LIM
D4
XPWR_ON4
XUSB_PWR_ON
F4
XPWR_ON2
XPWR_ON_ACC
G3
XPWR_ON3
XDIRECT_PB
F3
XPWR_ON1
E3
USB_VBUS
A2
GPIO_SB_1
V25
MT_5.0V
HDMI_5V_ON
HDMI_5V_ON
HDMI_5V_ON
TPU5_OUT
AJ8
CTYP
USB_PWR_EN
AF21
XUSB_PWR_EN
IRIS1
A16
XINT_CHG
DC_PLATE_JUDGE
USB_VBUS_DET
GPIO_SB__4
U24
ADC1_IN0
USB_CUR_LIM
IDEF
A1
CTYP
CTYP
A2
6
DD_3.3V
XUSB_PWR_EN
STDB
B1
XUSB_PWR_ON
UOK1
C3
XINT_CHG
nINT
E1
DC PLATE
JUDGE
SWITCH
TPU3_OUT
USB_VBUS
AJ20
5.0V REG
(1/11)
IC002
VOUT
4
VDD 3
CE 2
DD_3.3V
FRC_RTG_OUT2
A_VID
D_VID
DD_3.3V
DD_3.3V
DD_3.3V
DD_1.2V
MT_5.0V
MT_5.0V
LDO_1.125V
GVIF_ON
IC_401_2.8V
2.8V REG
(7/11)
IC402
VDD
4
CE
1
VOUT 3
MIC_REG_L D6
MIC_REG_R E6
OIS DRIVE,
IRIS/FOCUS/
ZOOM/SHUTTER
MOTOR DRIVE
(7/11)
IC401
AUDIO PROCESSOR
(8/11)
IC501
VIDEO TRANSMITTER
(10/11)
IC805
CE
G7
FB351
FOR
MICROPHONE
CIRCUIT
A_3.3V
A_2.8V
2.8V REG
LENS
BLOCK
3 AXIAL
ACCELERATION
SENSOR
(11/11)
SE901
IC001
CMOS
IMAGER
CP001
VDD
4
CE
3
VOUT 1
DD_1.8V
DD_1.8V
DD_3.3V
DD_1.8V
DD_1.8V
MIC_REG_R
1.125V REG
(1/11)
IC003
VDD 3
CE 4
GPIO_E__0 L14
Vout
1
3.0 INCH
COLOR
LCD
BACKLIGHT
LCD901
(LCD MODULE)
48
16, 17
48, 49
44, 45
20
18
8
30
BL_H
BL_L
IO_1.8V
D_LGC_1.2V
LVDS_1.8V
DD_1.2V
DD_1.8V
DD_3.3V
SE401
PITCH/YAW
SENSOR
(7/11)
IC_401_2.8V
CN708
D709
(CHARGE)
XPWR_ON
AB10
AF10
Y10
Y10
G9
AL7
IC_401_2.8V
BACKUP_VDD
DD_1.2V
DD_1.8V
PSWIN3 B5
PSWIN2 B2
PSWIN2 B2
POWER (2/2)
(PAGE 4-4)
B
CN707
(1/2)
(1/2)
BT-2006
FLEXIBLE
BOARD
(1/2)
20
21 - 24
L701
Q701
DISCHARGE
1, 2
3, 4
CPU, CAMERA DSP,
AV SIGNAL PROCESS, LENS CONTROL,
MODE CONTROL, HDMI PROCESS
(4/11 - 6/11)
IC201
(1/2)
D_3.3V, A_3.1V
MT_5.0V
MT_5.0V
MS_VCC
EXT_VCC
EVER_VDD
DD_1.8V
IC_401_2.8V
POWER (2/2)
(PAGE 4-4)
A
FB805
DSC-HX50/HX50V_L3
4-4E
2.8V REG
(3/3)
IC401
VDD
4
ND_DIR_B
H17
ND_DIR_A
H18
OUT 2
GPS_UNREG
CN001
GPS_EN_M
1.8V
A_3.1V
CN003
EVER_VDD
4.2V REG
(3/3)
IC402
D401
VDD
4
EN
3
GPS
RECEIVER
(3/3)
IC404
RF AMP
(3/3)
IC405
LEVEL SHIFT
(3/3)
IC403
TIMER
G5
OUT 1
T101
CN707
(2/2)
BT-2006 FLEXIBLE BOARD (2/2)
FL-2000
FLEXIBLE
BOARD
ST_UNREG
ST_UNREG
IC101
XE_A
XE_A
CN001
D101
+
+
FLASH CONTROL,
CHARGE CONTROL
(2/2)
C901, C902
CHARGING
CAPACITOR
IC804
EVF/STROBE
SWITCH
(10/11)
IC801
STROBE
SWITCH
(10/11)
5
14, 15
23
24
A_3.1V
6
IC_401_2.8V
12
12 - 14
26, 27
1, 2
BT001
LITHIUM
BATTERY
D_3.3V
D_3.3V
MT_5.0V
D_3.3V
13
11
BACKUP_VDD
MT_5.0V
BACKUP_VDD
ST_UNREG
D_3.3V, A_3.1V
MT_5.0V
BACKUP_VDD
FLASH
UNIT
ST-1014 FLEXIBLE
BOARD
SW-1007
FLEXIBLE
BOARD
SW-1006 BOARD
CN001
15 - 17
RL-1011 BOARD
RL-1012
FLEXIBLE
BOARD
CONTROL
SWITCH
BLOCK
(SW63470)
XPWR_ON
14
20
ROLL SENSOR
AMP
(2/3)
IC001
ROLL SENSOR
SE001
POP-UP
DETECT
SE001
S002
ON/OFF
23
24
6
12
26, 27
14
REG_UNREG
CN703
GPS_ON
GPS_ON
EVER_VDD
A_3.3V
IC_401_2.8V
XPWR_ON
XPWR_ON
SY-1018 BOARD (2/2)
D001
SELF-TIMER,
SMILE SHUTTER,
AF ILLUMINATOR
AF ILLUMINATOR
MS-505
FLEXIBLE
BOARD
MS-1013
BOARD
15, 16
6, 7
CN002
CN001
MS_VCC
19
EXT_VCC
15, 16
6, 7
CN709
12
MS_VCC
MS_VCC
EXT_VCC
EXT_VCC
MEMORY
STICK
PRO DUO
SD
DD_1.8V
WLAN_VH_ON
WLAN_VL_ON
XDIRECT_PB
B+ SWITCH
(2/2)
IC905
WIRELESS LAN
MODULE
(2/2)
CP901
Vout1
Vin1
B1
EN1
A2
Vout2 A4
Vin2
B4
EN2
A3
Vcc
B2
A1
DD_3.1V
DD_1.8V
WLAN_VH_ON
WLAN_VL_ON
WLAN_VL_ON
DD_3.3V
CN901
CN702
11
9
10
7
11
5
9
10
7
S801
XDIRECT_PB
5
8, 9
SH-1006 FLEXIBLE
BOARD
UNREG
ST UNREG
SHOE_UNREG_ON
CN001
CN713
17
LOGIC_VDD
13
11
MULTI
INTERFACE
SHOE
B+ SWITCH
Q806, Q809
DD_3.3V
ST UNREG_SHOE
ACC_3.1V_SHOE
ST_VCC_ON
DD_3.3V
08
B+ SWITCH
Q810, Q811
CPU, CAMERA DSP,
AV SIGNAL PROCESS, LENS CONTROL,
MODE CONTROL, HDMI PROCESS
(4/11 - 6/11)
IC201
(2/2)
TE1_DAT_6 K15
TE1_DAT_5 L16
EXTIN_CLK1 AD16
REG_UNREG
EVER_VDD
DD_1.8V
IC_401_2.8V
POWER (1/2)
(PAGE 4-3)
A
POWER (1/2)
(PAGE 4-3)
B
D706
(ACCESS)
HX50V
4-4. POWER BLOCK DIAGRAM (2/2)
( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
DSC-HX50/HX50V_L3
5-1E
5. FRAME SCHEMATIC DIAGRAMS
4
1
1
2
15
5
54
1
2
38
39
1
1
2
50
51
51
1 2
24
25
1
1
1
1
1
2
20
20
20
26
27
27
1
27
CN405
IC001
(Not supplied)
IC201
(Not supplied)
IC402
(Not supplied)
IC801
(Not supplied)
IC051
(Not supplied)
CN701
CN702
CN703
CN704
CN711
CN713
1
1
24
24
19
1
1
1
5
6
15
2
28
29
IC002
(Not supplied)
IC805
(Not supplied)
SE401
PITCH/YAW
SENSOR
CN707
CN708
CN709
CN712
IC501
(Not supplied)
1
1
24
24
CN101
CP001
(Not supplied)
1
26
27
28
1
2
28
29
CN002
CN001
S002
S003
S004
(MODE DIAL)
1
2
26
27
1
6
CN001
CN003
IC001
(Not supplied)
IC401
(Not supplied)
IC402
(Not supplied)
1
1
21
25
23
24
22
CN001
MIC001
(MICROPHONE) (R)
MIC002
(MICROPHONE) (L)
11
4
CN001
S801
S802
S804
S805
(DELETE)
S806
S807
IC905
(Not supplied)
1
20
CN901
SY-1018 BOARD
(SIDE A)
SY-1018 BOARD
(SIDE B)
SW-1006 BOARD
(SIDE A)
SW-1007
FLEXIBLE
BOARD
RL-1012
FLEXIBLE
BOARD
SW-1006 BOARD
(SIDE B)
BT-2006 FLEXIBLE BOARD
SH-1006
FLEXIBLE
BOARD
ST-1014
FLEXIBLE
BOARD
CD-1005 FLEXIBLE BOARD
MS-1013 BOARD
RL-1011 BOARD (SIDE A)
RL-1011 BOARD (SIDE B)
29
1
29
1
MS-505
FLEXIBLE
BOARD
FL-2000
FLEXIBLE BOARD
1
14
FLASH
UNIT
LCD901
(LCD MODULE)
BACKLIGHT
3.0 INCH
COLOR
LCD
MOVIE
CUSTOM
MULTI
HDMI
CONTROL
WHEEL
MENU
SHUTTER,
ZOOM
ON/OFF
C901, C902
(CHARGING CAPACITOR)
C902
C901
S
BT901
BATTERY
TERMINAL
BT001
(LITHIUM BATTERY)
LENS BLOCK
CONTROL
SWITCH
BLOCK
(SW63470)
SP901
(SPEAKER)
RED
BLK
6-1
DSC-HX50/HX50V_L3
6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS
– ENGLISH –
– JAPANESE –
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams
• All capacitors are in
• All capacitors are in
μF unless otherwise noted. pF : μ μF. 50
V or less are not indicated except for electrolytics and tantal-
ums.
ums.
• Chip resistors are 1/10 W unless otherwise noted.
k
k
Ω=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum capacitor,
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum capacitor,
Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example
Example
C541
L452
22U
10UH
TA
A
2520
Kinds of capacitor External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX indicate
Case size
• Constants of resistors, capacitors, ICs and etc with XX indicate
that they are not used.
In such cases, the unused circuits may be indicated.
• Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic curve
• Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic curve
B, unless otherwise noted.
• Signal name
XEDIT
XEDIT
→ EDIT PB/XREC
→ PB/REC
•
: non flammable resistor
•
: fusible resistor
•
: panel designation
•
: B+ Line
•
: B– Line
•
: IN/OUT direction of (+, –) B LINE.
•
: adjustment for repair.
For Printed Wiring Boards
•
•
: Uses unleaded solder.
•
: Circuit board
: Flexible board
Pattern from the side which enables seeing.
: pattern of the rear side
(The other layers’ patterns are not indicated)
• Through hole is omitted.
• There are a few cases that the part printed on diagram isn’t
• Through hole is omitted.
• There are a few cases that the part printed on diagram isn’t
mounted in this model.
•
: panel designation
• Chip parts.
Transistor Diode
Transistor Diode
2
1
3
2
1
3
2
1
3
3
4
5
2
1
1
2
3
6
5
4
E
B
C
3
1
5
2
4
6
1
2
3
6
5
4
3
1
5
2
4
6
1
2
3
5
4
4 3
1
2
3
1 2
4
5
5
3 4
1
2
1
4
2
3
4
6
2
5
3
1
1
2
4
3
1
4
2
3
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from its
structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with dusts
nor exposed to strong light.
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
The components identified by mark
or dotted line with mark are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
or dotted line with mark are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
回路図，プリント図共通ノート
（他に必要なノートは各セクションに記載しています）
回路図ノート
・ ケミコン，タンタルを除くコンデンサで，耐圧50V以下のも
のはその耐圧を省略。単位はすべてμF（pはpF）。
・ チップ抵抗で指示のないものは，1/10W以下。
kΩ＝1000Ω，MΩ＝1000kΩ
・ チップ部品交換時の注意
取り外した部品は再使用せず，未使用の部品をご使用くだ
さい。
タンタルコンデンサのマイナス側は熱に弱いため注意して
ください。
・ チップ部品には下記のように表示したものがあります。
例
C541
L452
22U
10UH
TA A
2520
種類 外形寸法（mm）
ケースサイズ
・ 抵抗，コンデンサ，ICなど定数にXXがあるものは，使用し
ていない事を示しています。このため，使用していない回
路が記載されている事があります。
路が記載されている事があります。
・ ★印のある部品は，機種などにより異なりますので機能別
マウント一覧表を参照してください。
・ 可変抵抗と半固定抵抗で，B特性の表示を省略。
・ 信号名表記について，下記のような場合があります。
・ 信号名表記について，下記のような場合があります。
XEDIT → EDIT PB/XREC → PB/REC
・
は不燃性抵抗。
・
はヒューズ抵抗。
・
はパネル表示名称。
・
はB＋ライン。
・
はB−ライン。
・
はBライン（＋，−）の入出力方向を示す。
・
は調整名称。
プリント図ノート
・
：無鉛半田を使用しています。
・
：基板
：フレキシブル配線板
見ている面側のパターン。
：裏側のパターン
（他のパターンについては表示されていません）
・ スルーホールは省略。
・ プリント図には，本機で使用していない部品が記載されて
・ プリント図には，本機で使用していない部品が記載されて
いる場合があります。
・
はパネル表示名称。
• Chip parts.
Transistor Diode
Transistor Diode
2
1
3
2
1
3
2
1
3
3
4
5
2
1
1
2
3
6
5
4
E
B
C
3
1
5
2
4
6
1
2
3
6
5
4
3
1
5
2
4
6
1
2
3
5
4
4 3
1
2
3
1 2
4
5
5
3 4
1
2
1
4
2
3
4
6
2
5
3
1
1
2
4
3
1
4
2
3
イメージャ交換時の注意
・ イメージャを交換した場合は，カメラ部の全調整を行って
ください。
・ イメージャは構造上，静電気により破壊される恐れがある
ため，MOS ICと同様に注意して取り扱ってください。
また，受光部にはゴミの付着，および強い光がはいること
のないように注意してください。
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
を併せて指定してください。
お願い
印の部品，または印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
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