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DSC-H9_L2

2007E0200-1

  © 2007.5

Brazilian Model

The components identified by
mark  0  or dotted line with
mark 0 are critical for safety.
Replace only with part num-
ber specified.

Les composants identifiés par une
marque  0  sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.

DSC-H7/H9

4-H01-431-01(1)

D:\Sony 2007\DSC-H9\DSC-H9 MANUAL DE INSTRUCOES\4H01431011DSCH9\060PC.fm

master:Right

Dispositivo de imagem: CCD colorido de 

7,18 mm (tipo 1/2,5), filtro de cor primário

Número total de pixels da câmera: 

Aprox. 8 286 000 pixels

Número efetivo de pixels da câmera: 

Aprox. 8 083 000 pixels

Lente: Lente Carl Zeiss Vario-Tessar com zoom 

de 15× f = 5,2 – 78 mm (31 – 465 mm quando 
convertida para uma câmera fotográfica de 
35 mm) F2,7 – 4,5

Controle de exposição: Exposição automática, 

Prioridade de velocidade do obturador, 
Prioridade de abertura, Exposição manual, 
Selecção de cena (9 modos)

Equilíbrio de branco: Automático, Luz do dia, 

Nebuloso, Fluorescente 1,2,3, Incandescente, 
Flash, Um toque

Formato de arquivo (Compatível com DCF): 

Fotos: Exif Ver. 2.21 compatível com JPEG, 
compatível com DPOF
Filmes: compatível com MPEG1 (Mono)

Mídia de gravação: Memória Interna (aprox. 

31 MB), “Memory Stick Duo”

Flash: Alcance do Flash (Sensibilidade ISO (Valor 

de exposição recomendado) ajustado em 
ISOAUTO): aprox. 0,2 a 9,8 m (W) aprox. 1,2 
a 6 m (T)

Visor: Visor eletrônico (colorido)

Conector múltiplo Saída de vídeo

Saída de áudio (mono)
Comunicação USB

Comunicação USB: Hi-Speed USB (compatível 

com USB 2.0)

Painel LCD:

DSC-H9:

Unidade TFT de 7,5 cm (tipo 3,0)

Número total de pontos: 

DSC-H9:

230 400 (960 × 240) pontos

Painel:

 

0,5 cm (tipo 0,2), colorido

Número total de pontos: 

Equivalente a aprox. 200 000 pontos

Alimentação: Bateria recarregável NP-BG1, 3,6 V

Adaptador de alimentação CA AC-LS5K (não 
fornecido), 4,2 V

Consumo de energia (durante a gravação com a 

tela LCD ligada):

DSC-H9:

1,2 W

Temperatura de operação: 0 a 40°C
Temperatura de armazenamento: –20 a +60°C
Dimensões: 109,5 mm × 83,4 mm × 85,7 mm 

(L×A×P, excluindo as partes salientes) (para 
DSC-H9 )

Peso:

DSC-H9:

Aprox. 546 g 
(incluindo a bateria recarregável 
NP-BG1, alça de transporte a tiracolo, 
anel adaptador, pára-sol da lente e 
tampa da lente, etc.)

Microfone: Mono
Alto-falante: Mono
Exif Print: Compatível
PRINT Image Matching III: Compatível
PictBridge: Compatível

Requisitos de alimentação: CA 100 V a 240 V, 50/

60 Hz, 2 W

Tensão de saída: CC 4,2 V, 0,25 A
Temperatura de operação: 0 a 40°C
Temperatura de armazenamento: –20 a +60°C
Dimensões: Aprox. 62 × 24 × 91 mm (L×A×P)
Peso: Aprox. 75 g

Bateria utilizada: Bateria de íons de lítio
Tensão máxima: CC 4,2 V
Tensão nominal: CC 3,6 V
Capacidade: 3,4 Wh (960 mAh)

Design e especificações sujeitos a alterações sem 
aviso prévio.

010COV.book  Page 33  Tuesday, May 22, 2007  4:38 PM

Black process 45,0° 60,0 LPI 

— 3 —

DSC-H9_L2

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

1.

Check the area of your repair for unsoldered or poorly-soldered
connections.  Check the entire board surface for solder splashes
and bridges.

2.

Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.

3.

Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.  Point
them out to the customer and recommend their replacement.

4.

Look for parts which, through functioning, show obvious signs
of deterioration.  Point them out to the customer and
recommend their replacement.

5.

Check the B+ voltage to see it is at the values specified.

6.

FLEXIBLE Circuit Board Repairing

•

Keep the temperature of the soldering iron around 270

°

C

during repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering
or unsoldering.

Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40

°

C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

After correcting the original service problem, perform the following

safety checks before releasing the set to the customer.

CAUTION

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

Model 

DSC-H9/Black

Destination

BR

LCD

CK board

MS board

PL board

SW board

3.0 inch

CK-179, CK-182

MS-366

PL-047

SW-499

 

— 4 —

DSC-H9_L2

1-1.

Precaution on Replacing the SY-177 Board ···················· 1-1

1-2.

Self-diagnosis Function ··················································· 1-1

1-3.

Process After Fixing Flash Error ····································· 1-2

1-4.

Method for Copying or Erasing the Data in Internal
Memory ··········································································· 1-3

1-5.

How to Write Data to Internal Memory ·························· 1-4

2-1.

Disassembly ····································································· 2-2

3-1.

Overall Block Diagram (1/2) ··········································· 3-1

3-2.

Overall Block Diagram (2/2) ··········································· 3-2

3-3.

Power Block Diagram (1/2) ············································ 3-3

3-4.

Power Block Diagram (2/2) ············································ 3-4

4-1.

Frame Schematic Diagram ·············································· 4-1

4-2.

Schematic Diagrams ························································ 4-2

4-3.

Printed Wiring Boards ··················································· 4-22

5-1.

Exploded Views ······························································· 5-2

5-2.

Electrical Parts List ······················································· 5-10

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