Sony XM-D500X Service Manual ▷ View online
7
XM-D500X
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
Note : This set can be disassemble according to the following sequence.
2-1.
BOTTOM PLATE
(Page 7)
(Page 7)
2-2.
MAIN BOARD SECTION,
LED BOARD
(Page 8)
LED BOARD
(Page 8)
SET
2-3.
MAIN BOARD
(Page 8)
(Page 8)
5
bottom plate
6
insulating sheet
2
three screws
(+P 3
x 6)
3
two screws
(+P 3
x 6)
4
three screws
(+P 3
x 6)
1
screw
(+P 3
x 8)
8
XM-D500X
2-3. MAIN BOARD
2-2. MAIN BOARD SECTION, LED BOARD
2
three screws
(+BTP 3
x 14)
6
screw
(+BTP 3
x 6)
7
LED board
4
CNT2
3
1
three screws
(+BTP 3
x 14)
5
MAIN board section
heat sink (MAIN)
after unfastening the screw,
taping with the screw inserted
facilitates the wark.
taping with the screw inserted
facilitates the wark.
3
panel (front)
4
MAIN board
1
two screws
(+P 3
x 8)
2
two screws
(+P 3
x 8)
9
9
XM-D500X
3-2. IC BLOCK DIAGRAM
IC6 TL494CN
SECTION 3
DIAGRAMS
3-1. NOTE FOR PRINTED WIRING BOARD AND
SCHEMATIC DIAGRAM
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
2
: nonflammable resistor.
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
•
A
: B+ Line.
•
B
: B– Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from +12V and REM terminals.
• Voltage is dc with respect to ground under no-signal
condition.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
for printed wiring boards:
Note:
Note:
• X
: parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
16
15
ERROR
ERROR
14
13
1
2
3
4
5
6
7
8
12
11
10
9
REF.REG.
OSC
0.1V
(D2)
D-7
D3
E-7
(D8)
E-6
D9
E-5
D11
G-4
(D13)
D-8
(D14)
D-8
(D15)
F-8
(D16)
F-8
D17
E-8
(D19)
C-2
(D20)
B-2
D26
E-7
(FET1)
B-12
(FET2)
C-12
(FET3)
C-12
(FET4)
D-12
(FET5)
D-12
(FET6)
E-12
(FET9)
C-2
(FET10)
D-2
(FET11)
E-2
(FET12)
E-2
IC2
G-6
IC3
G-5
IC4
G-4
IC5
F-4
(IC6)
E-9
IC7
F-9
IC8
C-7
(LED2)
F-14
(LED3)
F-14
(PTC1)
E-8
(PTC2)
D-8
(Q1)
F-6
(Q2)
G-6
(Q3)
F-5
(Q4)
G-5
Q5
F-8
Q6
F-8
• Semiconductor Location
(Main Section)
Ref. No.
Location
Ref. No.
Location
Q7
F-9
Q8
F-9
Q9
F-9
Q10
F-6
Q11
E-8
(Q12)
G-10
Q13
G-10
Q14
F-9
Q16
F-9
Q17
C-8
(Q18)
D-5
(Q19)
E-6
(Q20)
D-6
(Q21)
D-6
(Q22)
D-5
(Q23)
C-5
(Q24)
C-5
(Q25)
B-5
(Q26)
B-5
(Q27)
C-6
(Q28)
C-6
(Q29)
B-6
(Q30)
B-6
(Q31)
D-6
(Q33)
E-7
Q34
D-8
Q35
C-7
Q36
C-7
(Q37)
F-10
(Q38)
E-10
Q39
E-8
Q40
E-8
Q41
G-9
Q42
E-7
Q43
E-7
Q44
E-8
Q45
G-9
Q46
G-4
(ZD1)
F-7
(ZD2)
G-7
(ZD3)
F-5
(ZD4)
G-5
(ZD5)
C-7
( ): SIDE B
10
10
XM-D500X
3-3. PRINTED WIRING BOARDS — MAIN SECTION — • Refer to page 9 for Semiconductor Location.
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
10
11
12
13
14
R118
R153 C25
R137
R19 R112
CF1
R158
C19
C16
RG1
RG2
1-861-505-
11
(11)
RG3
RG4
RG5
RG6
THR1
RG9
RG10
RG11
RG12
D26
R95
R94
R91
C32
Q14
Q7
Q8
Q9
Q13
Q41
Q45
Q16
Q6
Q5
Q11
D17
Q39
Q40
Q44
Q42
D3
Q43
Q10
BCE
BCE
Q34
BCE
BCE
BCE
BCE
BCE
Q46
BCE
BCE
BCE
ECB
BCE
BCE
D11
Q35
Q17
Q36
1
4
8
5
BCE
BCE
D9
BCE
BCE
BCE
BCE
BCE
BCE
BCE
R58
R134
R165
R103
R175
R85
R76
R75
R74
C6
R78
R79
R70 R170
R84
R83
R71
C34
C43
R86
R166
R96
R160
R150
C38
R162
R151
R63
C3
R155
C12
C56
R2
R156
C55
R1
R157
RS1
C1
R5
RS6
R27
R28
R35
C59
R169
C17
R136
R53
R56
R109
R110
C46
RS5
R13
MC1
R15
R16
R57
R51
R62
C14
THR3
R185
R183
C23
R186
R184
R43
R52
R50
R60
R59
C20
R61
C15
R23
R20
R25
IC3
IC2
IC7
IC8
IC4
R29
R14
R174
R12
R24
R99
R100
R102
R119
R111
R123
C8
R113
R143
R117
R114
R126
C7
R132
R131
R129
R127
R130
R97
C24
C10
R115
C45
R181
R82
R182
R81
R54
C35
R69
R68
R65
R171
R17
C5
R18
C9
R64
R87
C42
R66
R80
R105
R178
R172
R173
R154
R149
R55
C36
R67
R77
C31
R73
R72
R89
C37
C18
R90
R92
C44
R93
R88
R167
R142
R141
C33
R140
R139
R104
R106
R6
R163
R7
R164
R11
C2
R52
C13
R10
R168
R138
R128
R108
C21
R125
R122
R116
R121
1
7
14
8
1
4
8
5
1
4
8
5
1
4
8
5
IC5
1
4
8
5
MAIN BOARD (SIDE A)
R180
C52
C51
C53
C50
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