Sony XM-5020X / XM-502X Service Manual ▷ View online
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STEREO POWER AMPLIFIER
XM-502X
SERVICE MANUAL
Circuit system
OTL (output transformerless) circuit
Pulse power supply
Pulse power supply
Inputs
RCA pin jacks
High level input connector
High level input connector
Outputs
Speaker terminals
Through out pin jacks
Through out pin jacks
Speaker impedance
2 - 8 ohms (stereo)
4 - 8 ohms (when used as a bridging
amplifier)
4 - 8 ohms (when used as a bridging
amplifier)
Maximum outputs
100 watts per channel (at 4 ohms)
260 watts (monaural) at 4 ohms
260 watts (monaural) at 4 ohms
Rated outputs (supply voltage at 14.4 V)
50 watts per channel (20 Hz -
20 kHz, 0.04 % THD, at 4 ohms)
65 watts per channel (20 Hz -
20 kHz, 0.1 % THD, at 2 ohms)
130 watts (monaural) (20 Hz -
20 kHz, 0.1 % THD, at 4 ohms)
20 kHz, 0.04 % THD, at 4 ohms)
65 watts per channel (20 Hz -
20 kHz, 0.1 % THD, at 2 ohms)
130 watts (monaural) (20 Hz -
20 kHz, 0.1 % THD, at 4 ohms)
Frequency response
5 Hz - 100 kHz ( dB)
Harmonic distortion
0.005 % or less
(at 1 kHz, 4 ohms)
(at 1 kHz, 4 ohms)
Input level adjustment range
0.2 - 4.0 V (RCA pin jacks)
0.4 - 8.0 V (High level input)
0.4 - 8.0 V (High level input)
SPECIFICATIONS
High-pass filter
50 - 200 Hz, –12 dB/oct
Low-pass filter
50 - 200 Hz, –12 dB/oct
Low boost
0 - 10 dB (40 Hz)
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Power supply voltage
10.5 - 16 V
Current drain
at rated output: 15 A
Remote input: 2 mA
Remote input: 2 mA
Dimensions
Approx. 258
×
55
×
182 mm
(10
1/4
×
2
3/8
×
7
1/4
in.)
(l/h/p) not incl. projecting parts and
controls
controls
Mass
Approx. 1.9 kg (4 lb. 3 oz.)
not incl. accessories
not incl. accessories
Supplied accessories
Mounting screws (4)
High level input cord (1)
Protect cover (1)
High level input cord (1)
Protect cover (1)
Design and specifications are subject to change without
notice.
notice.
+0
–3
Ver 1.1 2001. 08
Sony Corporation
e Vehicle Company
Shinagawa Tec Service Manual Production Group
9-925-591-12
2001H0400-1
© 2001. 8
– 2 –
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls ......................................... 3
Connections ............................................................................ 4
Connections ............................................................................ 4
2. DISASSEMBLY
2-1. Bottom Plate ....................................................................... 6
2-2. Panel (Front) ....................................................................... 6
2-3. Amplifier Board ................................................................. 7
2-4. Filter Board ........................................................................ 7
2-2. Panel (Front) ....................................................................... 6
2-3. Amplifier Board ................................................................. 7
2-4. Filter Board ........................................................................ 7
3. DIAGRAMS
3-1. Block Diagram ................................................................... 8
3-2. Printed Wiring Boards ...................................................... 10
3-3. Schematic Diagram .......................................................... 13
3-2. Printed Wiring Boards ...................................................... 10
3-3. Schematic Diagram .......................................................... 13
4. EXPLODED VIEWS
4-1. Amplifier Board Section .................................................. 17
4-2. Filter Board Section ......................................................... 18
4-2. Filter Board Section ......................................................... 18
5. ELECTRICAL PARTS LIST
...................................
19
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
– 3 –
SECTION 1
GENERAL
This section extracted from
instruction manual.
instruction manual.
– 4 –
