Sony XAV-701HD (serv.man2) Service Manual ▷ View online
SERVICE MANUAL
SUPPLEMENT-1
9-893-516-81
Ver. 1.1 2012.11
File this supplement with the service manual.
File this supplement with the service manual.
Subject: Change of DVD mechanism deck (MG-614D-189)
XAV-701HD
US Model
Canadian Model
The DVD mechanism deck for this unit has been changed the MG-
614D-189 from MG-613XF-187 in the midway of production.
This supplement-1 contains the content of the New DVD mechanism
deck (MG-614D-189). Refer to original service manual for information
about DVD mechanism deck (MG-613XF-187).
614D-189 from MG-613XF-187 in the midway of production.
This supplement-1 contains the content of the New DVD mechanism
deck (MG-614D-189). Refer to original service manual for information
about DVD mechanism deck (MG-613XF-187).
MG-613XF-187/MG-614D-189 DISCRIMINATION
Check the serial number written on the model number label on the bottom of the unit.
– Bottom View –
Serial Number
MG-613XF-187
MG-614D-189
1502546 or smaller
1502547 or larger
XAV-701HD
2
1. SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE THE IC004 AND IC011 ON THE SERVO BOARD
REPLACING
IC004 and IC011 on the SERVO board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
REPLACING
IC004 and IC011 on the SERVO board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
NOTE FOR FLEXIBLE BOARD OF THE OPTICAL PICK-UP
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.
Note: When soldering the short lands, solder within 5 seconds at the tem-
perature of soldering iron below 300°C.
Disconnection:
1. Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO
1. Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO
board.
Connection:
1. Connect
1. Connect
the
fl exible board to the CN2 of the SERVO board.
2. Unsolder two shortland.
1.
SERVICING NOTES
.............................................
2
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 3
2-2. SERVO Board-1 .............................................................. 4
2-3. SERVO Board-2 .............................................................. 5
2-4. Tension Spring (KF) ....................................................... 6
2-5. Chassis (T, 614) Sub Assy (CHA1) ................................ 6
2-6. Chassis (OP, 614) Complete Assy (OP1) ........................ 7
2-3. SERVO Board-2 .............................................................. 5
2-4. Tension Spring (KF) ....................................................... 6
2-5. Chassis (T, 614) Sub Assy (CHA1) ................................ 6
2-6. Chassis (OP, 614) Complete Assy (OP1) ........................ 7
3.
ELECTRICAL CHECK
.........................................
8
TABLE OF CONTENTS
4. DIAGRAMS
4-1. Block Diagram - SERVO Section - ................................ 9
4-2. Printed Wiring Boards - SERVO Section - ..................... 11
4-3. Schematic Diagram - SERVO Section (1/2) - ................. 12
4-4. Schematic Diagram - SERVO Section (2/2) - ................. 13
4-2. Printed Wiring Boards - SERVO Section - ..................... 11
4-3. Schematic Diagram - SERVO Section (1/2) - ................. 12
4-4. Schematic Diagram - SERVO Section (2/2) - ................. 13
5.
EXPLODED VIEW
................................................. 18
6.
ELECTRICAL PARTS LIST
.............................. 19
XAV-701HD
3
2. DISASSEMBLY
•
This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
DVD MECHANISM DECK
(MG-614D-189)
2-5. CHASSIS (T, 614) SUB ASSY (CHA1)
(Page
(Page
6)
2-6. CHASSIS (OP, 614) COMPLETE ASSY (OP1)
(Page
(Page
7)
2-2. SERVO BOARD-1
(Page
(Page
4)
2-3. SERVO BOARD-2
(Page
(Page
5)
2-4. TENSION SPRING (KF)
(Page
(Page
6)
XAV-701HD
4
Note: Follow the disassembly procedure in the numerical order given.
2-2. SERVO BOARD-1
1 flexible flat cable
(60 core) (FFC1)
(CN10)
:LUHVHWWLQJ
:LUHVHWWLQJ
SERVO
board
board
[white]
[white]
[red]
[red]
[black]
4 sled motor flexible board
(CN1)
OK
NG
SERVO board
(CN10)
(CN10)
narrow side
blue color side
width side
SERVO board
NG
NG
OK
Insert is shallow
Insert is straight
to the interior.
to the interior.
Insert is incline
connector
flexible cable
flexible cable
flexible cable
connector
connector
Note 1: When installing the flexible cable, please install them correctly.
There is a possibility that this machine damages when not
correctly installing it.
Note 2: When installing the flexible flat cable (60 core)
(FFC1), check a direction and install correctly.
Note 3: Fit between chassis
and SERVO board.
Be careful wire not
protrude from this
part.
Note 4: Do not overlap
on the SERVO
board.
2 Remove two solders
of
loading motor wire.
3 Remove three solders
of
SENSOR board wire.
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