Sony MEX-N6000BD / MEX-N6001BD Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
SPECIFICATIONS
9-896-028-03
2015B33-1
©
2015.02
AEP Model
UK Model
Australian Model
Hong Kong Model
Ver. 1.2 2015.02
Model Name Using Similar Mechanism
MEX-N5000BT/N5050BT
Mechanism Type
MG-101CF-188
Optical Pick-up Name
DAX-25A
• The tuner and CD sections have no adjustments.
AUDIO SYSTEM
The service manual of the mechanism deck, used in
this model, has been issued in a separate volume.
Please refer to the service manual of the MG-101
series for the mechanism deck information.
this model, has been issued in a separate volume.
Please refer to the service manual of the MG-101
series for the mechanism deck information.
MEX-N6000BD/N6001BD
Tuner section
DAB/ DAB+/D MB-R
Tuning range: 174.928 – 239.200 MHz
Usable sensitivity: –97 dBm
Antenna (aer ial) terminal:
Tuning range: 174.928 – 239.200 MHz
Usable sensitivity: –97 dBm
Antenna (aer ial) terminal:
External antenna (aerial) connector
FM
Tuning range: 87.5 – 108.0 MH z
Antenna (aer ial) terminal:
Tuning range: 87.5 – 108.0 MH z
Antenna (aer ial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kH z
Usable sensitivity: 8 dB f
Selectivity: 75 dB at 4 00 kH z
Signal-to- noise ratio: 80 dB (s tereo)
Separation: 50 dB at 1 kHz
Frequenc y response: 20 – 15,000 Hz
Usable sensitivity: 8 dB f
Selectivity: 75 dB at 4 00 kH z
Signal-to- noise ratio: 80 dB (s tereo)
Separation: 50 dB at 1 kHz
Frequenc y response: 20 – 15,000 Hz
MW /LW
Tuning range:
Tuning range:
MW : 531 – 1,602kHz
LW: 153 – 279 kHz
Antenna (aer ial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kH z or 9,115.5 kHz/4.5 kHz
Sensitivity: MW : 26 μV, LW: 45 μV
CD Playe r se ction
Signal-to- noise ratio: 120 dB
Frequenc y response: 10 – 20,000 Hz
Wow an d flutter: Below meas urable limit
Corresponding codec: MP3 (.mp3) and W MA (.wma)
Frequenc y response: 10 – 20,000 Hz
Wow an d flutter: Below meas urable limit
Corresponding codec: MP3 (.mp3) and W MA (.wma)
USB Player sect ion
Interface: USB (High-speed)
Maximum cu rrent: 1 A
The ma ximum number of recognizable tracks:
Maximum cu rrent: 1 A
The ma ximum number of recognizable tracks:
10,000
Correspondi ng codec:
MP3 (.mp3), WM A (.wma) and WAV (.wav )
Wi reless Commu nication
Communi cation System :
BLUETOOTH Standar d version 3.0
Output:
BLUETOOTH Standard Powe r Class 2
(Max. +4 dBm)
(Max. +4 dBm)
Maximum communica tion range:
Line of sight approx. 10 m (33 ft)*
1
Frequency band:
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
Compatible BL UETOOTH Profiles *
Compatible BL UETOOTH Profiles *
2
:
A2DP (Advanced Audio Distribution Profile) 1.3
AVRCP (Audio Video Remot e Control Profile) 1.5
HFP (Handsfree Profile) 1.6
PBA P (Phone Book Ac cess Profile)
SPP (Serial Port Profile)
MAP (Message Ac cess Pr ofile)
HID (Human Interface Devi ce Profile)
AVRCP (Audio Video Remot e Control Profile) 1.5
HFP (Handsfree Profile) 1.6
PBA P (Phone Book Ac cess Profile)
SPP (Serial Port Profile)
MAP (Message Ac cess Pr ofile)
HID (Human Interface Devi ce Profile)
*1 The actual range will vary depending on factors such
as obstacles be tween devices, magn etic fields
around a mi crowave ov en, static electricity,
reception se nsitivity, antenna (aerial)’s pe rformance,
operating system , software application, etc.
around a mi crowave ov en, static electricity,
reception se nsitivity, antenna (aerial)’s pe rformance,
operating system , software application, etc.
*2 BLUETOOTH standard profiles indicate the purpose
of BLUETOOTH commu nication between devices.
Power amplifier section
Output: Spea ker outputs
Speaker impedance: 4 – 8 ohms
Maximum powe r output: 55 W × 4 (at 4 ohms )
Speaker impedance: 4 – 8 ohms
Maximum powe r output: 55 W × 4 (at 4 ohms )
Gene ral
Outputs:
Audio outputs terminal (front, rear, sub)
Powe r antenna (aer ial)/P ower am plifier control
Powe r antenna (aer ial)/P ower am plifier control
terminal (REM OUT)
Inputs:
Remote controller input terminal
DAB an tenna (aer ial) input terminal
FM/M W/ LW antenna (aer ial) input terminal
MIC input terminal
AUX input jack (stereo mini jack)
USB port
DAB an tenna (aer ial) input terminal
FM/M W/ LW antenna (aer ial) input terminal
MIC input terminal
AUX input jack (stereo mini jack)
USB port
Powe r requirements: 12 V DC car battery (neg ative
ground (earth))
Dimens ions:
Approx. 178 mm × 50 mm × 177 mm
(7
(7
1
/
8
in × 2 in × 7 in) (w/h/d)
Mounting dimen sions:
Approx. 182 mm × 53 mm × 160 mm
(7
(7
1
/
4
in × 2
1
/
8
in × 6
5
/
16
in) (w/h/d )
Mass: Approx. 1.2 kg (2 lb 11 oz)
Package contents:
Package contents:
Microphone (1)
Parts for installation and connections (1 set)
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
without notice.
Photo: MEX-N6000BD
MEX-N6000BD/N6001BD
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
The Bluetooth® word ma rk and logos are registered
tradema rks owned by Bluetooth SIG, In c. an d an y
use of such ma rks by Sony Corporation is under
license . Other tradema rks and trade names are
thos e of their respective owne rs.
tradema rks owned by Bluetooth SIG, In c. an d an y
use of such ma rks by Sony Corporation is under
license . Other tradema rks and trade names are
thos e of their respective owne rs.
The N- Ma rk is a tradem ark or registered trademark
of NFC Forum, Inc. in the United States and in other
countries.
of NFC Forum, Inc. in the United States and in other
countries.
Windows Media is either a registered trademark or
trademark of Microsof t Corporation in the United
States and/ or other countries.
trademark of Microsof t Corporation in the United
States and/ or other countries.
This product is protected by certain intellectual
property rights of Microsof t Corporation. Use or
distribution of su ch technology outside of this
product is prohibited without a license from
Micros oft or an authorized Microsoft su bsidiary.
property rights of Microsof t Corporation. Use or
distribution of su ch technology outside of this
product is prohibited without a license from
Micros oft or an authorized Microsoft su bsidiary.
iPhone, iP od, iPod classic, iPod nano, and iP od
touch are trademar ks of Apple Inc., registered in
the U.S. and other countries . Ap p Store is a se rvice
mark of Apple Inc.
touch are trademar ks of Apple Inc., registered in
the U.S. and other countries . Ap p Store is a se rvice
mark of Apple Inc.
MP EG Layer-3 audio coding technology and patents
licens ed from Fraunhofer IIS and Thoms on.
licens ed from Fraunhofer IIS and Thoms on.
Google , Google Play and Android are tradem arks of
Google Inc.
Google Inc.
Copyrights
MEX-N6000BD/N6001BD
3
SECTION 1
SERVICING NOTES
1.
SERVICING NOTES
.............................................
3
2. GENERAL
.................................................................. 16
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 18
3-2. Mini Fuse (Blade Type) (10A/32V) (FU1), Cover ......... 18
3-3. Sub
3-3. Sub
Panel
Assy
................................................................ 19
3-4. CD Mechanism Deck (MG-101CF-188) ........................ 20
3-5. MAIN Board Block ........................................................ 21
3-6. Antenna BT (BT1) .......................................................... 21
3-5. MAIN Board Block ........................................................ 21
3-6. Antenna BT (BT1) .......................................................... 21
4.
TEST MODE
............................................................ 21
5. DIAGRAMS
5-1. Block Diagram - SERVO/BT/USB Section - ................. 22
5-2. Block Diagram - MAIN Section - ................................... 23
5-3. Block
5-2. Block Diagram - MAIN Section - ................................... 23
5-3. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 24
5-4. Printed Wiring Boards - MAIN Section (1/2) - .............. 26
5-5. Printed Wiring Boards - MAIN Section (2/2) - .............. 27
5-6. Schematic Diagram - MAIN Section (1/5) - ................... 28
5-7. Schematic Diagram - MAIN Section (2/5) - ................... 29
5-8. Schematic Diagram - MAIN Section (3/5) - ................... 30
5-9. Schematic Diagram - MAIN Section (4/5) - ................... 31
5-10. Schematic Diagram - MAIN Section (5/5) - ................... 32
5-5. Printed Wiring Boards - MAIN Section (2/2) - .............. 27
5-6. Schematic Diagram - MAIN Section (1/5) - ................... 28
5-7. Schematic Diagram - MAIN Section (2/5) - ................... 29
5-8. Schematic Diagram - MAIN Section (3/5) - ................... 30
5-9. Schematic Diagram - MAIN Section (4/5) - ................... 31
5-10. Schematic Diagram - MAIN Section (5/5) - ................... 32
6.
EXPLODED VIEWS
6-1. Sub Panel Section ........................................................... 41
6-2. Chassis
6-2. Chassis
Section
............................................................... 42
7.
ELECTRICAL PARTS LIST
.............................. 43
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up
semi-fixed resistor
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
MEX-N6000BD/N6001BD
4
DESTINATION SETTING METHOD
When the complete MAIN board or IC502 on the MAIN board is
replaced, the destination setting is necessary.
When the complete MAIN board or IC502 on the MAIN board is
replaced, the destination setting is necessary.
1. Destination
Setting
Set destination according to the procedure below.
1-1. Setting the Destination Code
1. In the state of source off (the clock is displayed on the liquid
1. In the state of source off (the clock is displayed on the liquid
crystal display), enter the test mode by pressing the buttons in
order of the [
order of the [
4]
t [MIC 5] t [PAUSE 6] (press only the
[PAUSE 6] button for two seconds).
2. In the state in which the software main version is displayed on
the liquid crystal display (refer to following fi gure), enter the
destination setting mode by pressing the buttons in order of the
[
destination setting mode by pressing the buttons in order of the
[
> M
SEEK+]
t [SEEK–
m
.
]
t [PUSH ENTER/
VOICE/
APP].
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
Software main version (MEX-N6000BD)
Software main version (MEX-N6001BD)
3. Input the alphanumeric character of 12 digits of “F XXXXXX”
displayed on the liquid crystal display, and execute the destina-
tion setting.
tion setting.
Note: Refer to following “1-3. Entering the Destination Code” for opera-
tion method.
4. The resetting operation is executed by pressing the [
OFF
SRC] button for 1 second after the setting ends, and the unit
returns to the normal condition.
returns to the normal condition.
1-2. Display in Destination Setting Mode
(Displayed characters/values in the following fi gure are example)
(Displayed characters/values in the following fi gure are example)
12 digits
OP5 OP4 OP3 OP2 OP1 OP0
Destination code
1-3. Entering the Destination Code
•
•
Method of operation by main unit
1. Rotate the control dial, and select the alphanumeric character
of “0 to F”.
2. The digit advances by pressing the [PUSH ENTER/VOICE/
APP] or [
> M
SEEK+] button.
The digit returns by pressing the [MODE
] or [SEEK–
m
.
] button.
3. The setting is completed by pressing the [PUSH ENTER/
VOICE/
APP] button, and the initialization operation is done.
1-4. Destination Code
OP5
OP4
OP3
OP2
OP1
OP0
0
2
8
8
F
1
– Continued on next page –
Ver. 1.2