Sony MEX-DV700 / MEX-DV707 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
SPECIFICATIONS
MULTI DISC PLAYER
9-889-694-01
2009K0500-1
©
2009.11
E Model
MEX-DV700
Indian Model
MEX-DV707
Ver. 1.0 2009.11
Model Name Using Similar Mechanism
NEW
Mechanism Type
MG-613Z-187
Optical Pick-up Name
KHS-360A
Photo: MEX-DV700
System
Laser: Semiconductor laser
Signal format system: PAL/NTSC switchable
Signal format system: PAL/NTSC switchable
DVD/CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Harmonic distortion: 0.01 %
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Harmonic distortion: 0.01 %
Tuner section
FM
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 150 kHz
Usable sensitivity: 10 dBf
Usable sensitivity: 10 dBf
Siginal-to-noise ratio: 70dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range:531 – 1,602 kHz
Antenna (aerial) terminal:
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Sensitivity: 26 μV
Sensitivity: 26 μV
Power amplifier section
Outputs: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
General
Outputs:
Video output terminal
Audio output terminals (rear/sub switchable)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Audio output terminals (rear/sub switchable)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Inputs:
Antenna (aerial) input terminal
Parking break control terminal
AUX input jack (stereo mini jack)
Parking break control terminal
AUX input jack (stereo mini jack)
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178 × 50 × 179 mm
(7
1
/
8
× 2 × 7
1
/
8
in) (w/h/d)
Mounting dimensions: Approx. 182 × 53 × 162 mm
(7
1
/
4
× 2
1
/
8
× 6
1
/
2
in) (w/h/d)
Mass: Approx. 1.3 kg (2 lb 14 oz)
Supplied accessories:
Supplied accessories:
Card remote commander: RM-X168
Parts for installation and connections (1 set)
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
without notice.
US and foreign patents licensed from Dolby
Laboratories.
Laboratories.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
patents licensed from Fraunhofer IIS and
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
Thomson.
Region code: Labeled on the bottom of the unit
AUX audio input terminals
Remote controller input terminal
Remote controller input terminal
Selectivity: 75 dB at 400 kHz
MEX-DV700/DV707
MEX-DV700/DV707
2
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
CAUTION
RADIATION WHEN OPEN AND INTERLOCKS DEFEATED.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.
:CLASS 1M VISIBLE/INVISIBLE LASER
This label is located on the bottom of the
chassis.
This label is located on the drive unit’s internal
chassis.
“DVD VIDEO,” “DVD-R,” “DVD-RW,” “DVD+R,” and “DVD+RW”
are trademarks.
THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR DECODING
MPEG-4 VIDEO THAT WAS ENCODED BY A CONSUMER
ENGAGED IN A PERSONAL AND NON-COMMERCIAL
ACTIVITY AND/OR WAS OBTAINED FROM A VIDEO
PROVIDER LICENSED BY MPEG LA TO PROVIDE MPEG-4
VIDEO. NO LICENSE IS GRANTED OR SHALL BE IMPLIED
FOR ANY OTHER USE.
ADDITIONAL INFORMATION INCLUDING THAT RELATING
TO PROMOTIONAL, INTERNAL AND COMMERCIAL USES
AND LICENSING MAY BE OBTAINED FROM MPEG LA, LLC.
SEE
HTTP://WWW.MPEGLA.COM
Manufactured under license from Dolby Laboratories.
“Dolby” and the double-D symbol are trademarks of
Dolby Laboratories.
Windows Media, and the Windows logo are
trademarks or registered trademarks of Microsoft
Corporation in the United States and/or other
Corporation in the United States and/or other
countries.
ZAPPIN is a trademark of Sony Corporation.
iPod is a trademark of Apple Inc., registered in the U.S. and other
countries.
iPhone is a trademark of Apple Inc.
DivX
®
, DivX Certified
®
andassociated logos are
registered trademarks of DivX, Inc.
1.
SERVICING NOTES
.............................................
3
2. GENERAL
.................................................................. 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 7
3-2. Sub Panel Complete Assy ............................................... 7
3-3. DVD Mechanism Deck Block ........................................ 8
3-4. DC Fan (25X25) (M601), MAIN Board ......................... 8
3-5. SERVO Board ................................................................. 9
3-6. Chassis (T612Z) Sub Assy, SENSOR Board .................. 9
3-7. Chassis (OP, ZA) Complete Assy ................................... 10
3-2. Sub Panel Complete Assy ............................................... 7
3-3. DVD Mechanism Deck Block ........................................ 8
3-4. DC Fan (25X25) (M601), MAIN Board ......................... 8
3-5. SERVO Board ................................................................. 9
3-6. Chassis (T612Z) Sub Assy, SENSOR Board .................. 9
3-7. Chassis (OP, ZA) Complete Assy ................................... 10
4.
ELECTRICAL CHECK
......................................... 11
5. DIAGRAMS
5-1. Block Diagram - SERVO Section - ................................ 13
5-2. Block Diagram - AUDIO Section - ................................. 14
5-3. Block
5-2. Block Diagram - AUDIO Section - ................................. 14
5-3. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 15
5-4. Printed Wiring Boards - SERVO Section - ..................... 17
5-5. Schematic Diagram - SERVO Section (1/3) - ................. 18
5-6. Schematic Diagram - SERVO Section (2/3) - ................. 19
5-7. Schematic Diagram - SERVO Section (3/3) - ................. 20
5-8. Printed
5-5. Schematic Diagram - SERVO Section (1/3) - ................. 18
5-6. Schematic Diagram - SERVO Section (2/3) - ................. 19
5-7. Schematic Diagram - SERVO Section (3/3) - ................. 20
5-8. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 21
5-9. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 22
5-10. Schematic Diagram - MAIN Board (1/4) - ..................... 23
5-11. Schematic Diagram - MAIN Board (2/4) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/4) - ..................... 25
5-13. Schematic Diagram - MAIN Board (4/4) - ..................... 26
5-14. Printed Wiring Board - KEY Board -.............................. 27
5-15. Schematic Diagram - KEY Board - ................................ 28
5-11. Schematic Diagram - MAIN Board (2/4) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/4) - ..................... 25
5-13. Schematic Diagram - MAIN Board (4/4) - ..................... 26
5-14. Printed Wiring Board - KEY Board -.............................. 27
5-15. Schematic Diagram - KEY Board - ................................ 28
6.
EXPLODED VIEWS
6-1. Main
Section
................................................................... 40
6-2. Front Panel Section ......................................................... 41
6-3. DVD Mechanism Deck Section (MG-613Z-187) .......... 42
6-3. DVD Mechanism Deck Section (MG-613Z-187) .......... 42
7.
ELECTRICAL PARTS LIST
.............................. 43
Accessories are given in the last of the electrical parts list.
MEX-DV700/DV707
3
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTE ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in tha optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in tha optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
MODEL IDENTIFICATION
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
– Bottom View –
Part No.
Region Code
Label indication
Destination
Signal format
system
Region
code
Part No.
PAL
3
4-158-221-0[]
DV700: E (PAL) models
PAL
2
4-158-223-0[]
DV700: Saudi Arabia model
PAL
5
4-158-224-0[]
DV707: Indian model
NOTE THE IC4 AND IC11 ON THE SERVO BOARD
REPLACING
IC4 and IC11 on the SERVO board cannot exchange with single.
When these parts are damaged, exchange the entire mounted board.
REPLACING
IC4 and IC11 on the SERVO board cannot exchange with single.
When these parts are damaged, exchange the entire mounted board.
NOTE FOR REPLACING THE COMPLETE MAIN
BOARD
If the complete MAIN board was replaced, be sure to refer to Tech-
nical News published separately.
BOARD
If the complete MAIN board was replaced, be sure to refer to Tech-
nical News published separately.
NOTE FOR THE 20-PIN CONNECTOR (CN901)
Do not use alcohol to clean the 20-pin connector (CN901) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
Do not use alcohol to clean the 20-pin connector (CN901) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
MEX-DV700/DV707
4
NOTE FOR FLEXIBLE BOARD OF THE OPTICAL
PICK-UP
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.
PICK-UP
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.
Note: When soldering the short lands, solder within 5 seconds at the tem-
perature of soldering iron below 300°C.
Disconnection:
1. Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO
1. Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO
board.
Connection:
1. Connect
1. Connect
the
fl exible board to the CN2 of the SERVO board.
2. Unsolder two shortland.
KEY board
AUX jack
front panel
NOTE FOR REPLACEMENT OF THE AUX JACK (J901)
To replace the AUX jack requires alignment.
1. Insert the AUX jack into the KEY board.
2. Place the KEY board on the front panel.
3. Solder the three terminals of the jack.
To replace the AUX jack requires alignment.
1. Insert the AUX jack into the KEY board.
2. Place the KEY board on the front panel.
3. Solder the three terminals of the jack.