Sony MDX-C800REC (serv.man2) Service Manual ▷ View online
1
Model Name Using Similar Mechanism
NEW
Mini Disc Mechanism Type
MG-715B-160
Optical Pick-up Name
KMS-263A
SERVICE MANUAL
US Model
Canadian Model
MDX-C800REC
FM/AM MINI DISC RECORDER
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
19 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.
19 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.
Other Specifications
MD recoder section
MD recoder section
Signal-to-noise ratio
92 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Laser Diode Properties
Material
GaAlAs
Wavelength
790 nm
Emission Duration
Continuous
Laser output power
Less than 5 mW*
* This output is the value measured at a distance
of 200 mm from the objective lens surface on the
Optical Pick-up Block.
Optical Pick-up Block.
Tuner section
FM
Tuning range
87.5 – 107.9 MHz
Antenna terminal
External antenna connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity
Usable sensitivity
8 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
66 dB (stereo),
72 dB (mono)
72 dB (mono)
Harmonic distortion at 1 kHz
0.6% (stereo),
0.3% (mono)
0.3% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
AM
Tuning range
530 – 1,710 kHz
Antenna terminal
External antenna connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 45 W
×
4 (at 4 ohms)
SPECIFICATIONS
General
Outputs
Audio outputs
Power antenna relay
control lead
Power amplifier control
lead
Power antenna relay
control lead
Power amplifier control
lead
Inputs
Telephone ATT control
lead
Digital input connector
BUS audio input connector
BUS control input connector
lead
Digital input connector
BUS audio input connector
BUS control input connector
Tone controls
Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Treble ±9 dB at 10 kHz
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Dimensions
Approx. 178
×
50
×
184 mm
(7
1/8
×
2
×
7
1/4
in.)
(w/h/d)
Mounting dimensions
Approx. 182
×
53
×
163 mm
(7
1/4
×
2
1/8
×
6
1/2
in.)
(w/h/d)
Mass
Approx. 1.5 kg (3 lb. 1 oz.)
Supplied accessories
Parts for installation and
connections (1 set)
Front panel case (1)
connections (1 set)
Front panel case (1)
U.S. and foreign patents licensed from Dolby
laboratories Licensing Corporation.
laboratories Licensing Corporation.
Design and specifications are subject to change without
notice.
notice.
2
over write head
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-263A)
(KMS-263A)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The flex-
ible board is easily damaged and should be handled with care.
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The flex-
ible board is easily damaged and should be handled with care.
HANDLING PRECAUTION FOR THE OVER WRITE HEAD
The over write head is susceptible to damage. When adjusting and
checking the over write head, it requires careful handling.
checking the over write head, it requires careful handling.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
pick-up
flexible board
laser-tap
variable resistor
Never turn this
variable resistor.
variable resistor.
3
1. GENERAL
Location of controls ................................................................. 4
Getting Started ......................................................................... 4
Setting the clock ...................................................................... 4
MD player CD/MD unit .......................................................... 5
Recording on an MD ............................................................... 6
Editing an MD ......................................................................... 8
Radio ....................................................................................... 9
Other Functions ..................................................................... 10
TV/Video ............................................................................... 11
Connections ........................................................................... 13
Getting Started ......................................................................... 4
Setting the clock ...................................................................... 4
MD player CD/MD unit .......................................................... 5
Recording on an MD ............................................................... 6
Editing an MD ......................................................................... 8
Radio ....................................................................................... 9
Other Functions ..................................................................... 10
TV/Video ............................................................................... 11
Connections ........................................................................... 13
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................. 16
2-2. MD Mechanism Block ...................................................... 16
2-3. Main Board, Digital Board ................................................ 17
2-4. Heat Sink (REC) ............................................................... 17
2-5. MD Mechanism ................................................................. 18
2-6. Computer Board ................................................................ 18
2-7. Servo Board ....................................................................... 19
2-8. Tension Spring (B) ............................................................ 19
2-9. Chassis (L), (R) Assy ........................................................ 20
2-10. Loading Motor Assy .......................................................... 20
2-11. Sled Motor Assy ................................................................ 21
2-12. Sensor Board ..................................................................... 21
2-13. Spindle Motor Assy ........................................................... 22
2-14. Over Write Head ............................................................... 22
2-15. Optical Pick-up ................................................................. 23
2-2. MD Mechanism Block ...................................................... 16
2-3. Main Board, Digital Board ................................................ 17
2-4. Heat Sink (REC) ............................................................... 17
2-5. MD Mechanism ................................................................. 18
2-6. Computer Board ................................................................ 18
2-7. Servo Board ....................................................................... 19
2-8. Tension Spring (B) ............................................................ 19
2-9. Chassis (L), (R) Assy ........................................................ 20
2-10. Loading Motor Assy .......................................................... 20
2-11. Sled Motor Assy ................................................................ 21
2-12. Sensor Board ..................................................................... 21
2-13. Spindle Motor Assy ........................................................... 22
2-14. Over Write Head ............................................................... 22
2-15. Optical Pick-up ................................................................. 23
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 24
3-2. Block Diagram –MD Section– .......................................... 30
3-3. Block Diagram –Tuner Section– ....................................... 31
3-4. Block Diagram –Display Section– .................................... 32
3-5. Circuit Boards Location .................................................... 33
3-6. Printed Wiring Board –Servo Section– ............................. 34
3-7. Schematic Diagram –Servo Section (1/3)– ....................... 36
3-8. Schematic Diagram –Servo Section (2/3)– ....................... 37
3-9. Schematic Diagram –Servo Section (3/3)– ....................... 38
3-10. Printed Wiring Board –Sensor Section– ........................... 39
3-11. Schematic Diagram –Sensor Section– .............................. 39
3-12. Printed Wiring Board –Computer Section– ...................... 40
3-13. Schematic Diagram –Computer Section– ......................... 41
3-14. Printed Wiring Boards –Main Section– ............................ 42
3-15. Schematic Diagram –Main Section (1/4)– ........................ 44
3-16. Schematic Diagram –Main Section (2/4)– ........................ 45
3-17. Schematic Diagram –Main Section (3/4)– ........................ 46
3-18. Schematic Diagram –Main Section (4/4)– ........................ 47
3-19. Printed Wiring Board –Relay Section– ............................. 48
3-20. Schematic Diagram –Relay Section– ................................ 49
3-21. Printed Wiring Board –Key Section– ................................ 50
3-22. Schematic Diagram –Key Section– ................................... 51
3-2. Block Diagram –MD Section– .......................................... 30
3-3. Block Diagram –Tuner Section– ....................................... 31
3-4. Block Diagram –Display Section– .................................... 32
3-5. Circuit Boards Location .................................................... 33
3-6. Printed Wiring Board –Servo Section– ............................. 34
3-7. Schematic Diagram –Servo Section (1/3)– ....................... 36
3-8. Schematic Diagram –Servo Section (2/3)– ....................... 37
3-9. Schematic Diagram –Servo Section (3/3)– ....................... 38
3-10. Printed Wiring Board –Sensor Section– ........................... 39
3-11. Schematic Diagram –Sensor Section– .............................. 39
3-12. Printed Wiring Board –Computer Section– ...................... 40
3-13. Schematic Diagram –Computer Section– ......................... 41
3-14. Printed Wiring Boards –Main Section– ............................ 42
3-15. Schematic Diagram –Main Section (1/4)– ........................ 44
3-16. Schematic Diagram –Main Section (2/4)– ........................ 45
3-17. Schematic Diagram –Main Section (3/4)– ........................ 46
3-18. Schematic Diagram –Main Section (4/4)– ........................ 47
3-19. Printed Wiring Board –Relay Section– ............................. 48
3-20. Schematic Diagram –Relay Section– ................................ 49
3-21. Printed Wiring Board –Key Section– ................................ 50
3-22. Schematic Diagram –Key Section– ................................... 51
4. EXPLODED VIEWS
4-1. Sub Panel Section .............................................................. 57
4-2. Front Panel Section ........................................................... 58
4-3. Chassis Section ................................................................. 59
4-4. MD Mechanism Section (1) .............................................. 60
4-5. MD Mechanism Section (2) .............................................. 61
4-6. MD Mechanism Section (3) .............................................. 62
4-2. Front Panel Section ........................................................... 58
4-3. Chassis Section ................................................................. 59
4-4. MD Mechanism Section (1) .............................................. 60
4-5. MD Mechanism Section (2) .............................................. 61
4-6. MD Mechanism Section (3) .............................................. 62
5. ELECTRICAL PARTS LIST
........................................ 63
TABLE OF CONTENTS
4
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.