Sony CX-LEM550 / XR-EM550 Service Manual ▷ View online
2
CX-LEM550
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
Dimensions (w/h/d)
Approx. 164
× 230.5 × 266
mm incl. projecting parts
and controls
and controls
Mass
Approx. 4.1 kg
Design and specifications are subject to change
without notice.
without notice.
3
CX-LEM550
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
3-1.
Rear Cabinet ....................................................................
8
3-2.
Top Panel Assy ................................................................
9
3-3.
Front Panel Assy ..............................................................
9
3-4.
Base Unit (BU-K7BD81B) ............................................. 10
3-5.
Tape Cassette Mechanism Deck ...................................... 10
3-6.
MAIN Board .................................................................... 11
3-7.
AMP Board ...................................................................... 11
4.
TEST MODE
............................................................... 12
5.
MECHANICAL ADJUSTMENTS
......................... 13
6.
ELECTRICAL ADJUSTMENTS
Deck Section .................................................................... 13
CD Section ...................................................................... 14
CD Section ...................................................................... 14
7.
DIAGRAMS
7-1.
Block Diagram – CD Servo Section – ............................ 16
– MAIN Section – ........................................................... 17
– MAIN Section – ........................................................... 17
7-2.
Printed Wiring Board – CD Board – .............................. 18
7-3.
Schematic Diagram – CD Board – ................................. 19
7-4.
Printed Wiring Board – MAIN Board – ......................... 20
7-5.
Schematic Diagram – MAIN Board – ............................ 21
7-6.
Printed Wiring Board – AMP Section – ......................... 22
7-7.
Schematic Diagram – AMP Section – ............................ 23
7-8.
Printed Wiring Board – CONTROL Board – .................. 24
7-9.
Schematic Diagram – CONTROL Board – .................... 25
7-10. Printed Wiring Board – POWER Board – ....................... 26
7-11. Schematic Diagram – POWER Board – .......................... 27
7-11. Schematic Diagram – POWER Board – .......................... 27
8.
EXPLODED VIEWS
8-1.
Overall Section ................................................................ 34
8-2.
Front Panel Assy-1 .......................................................... 35
8-3.
Front Panel Assy-2 .......................................................... 36
8-4.
Top Panel Assy ................................................................ 37
9.
ELECTRICAL PARTS LIST
.................................. 38
4
CX-LEM550
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model Name
Power Voltage Indication
AEP and UK models
230 V AC, 50/60 Hz 67W
Korean model
220 V AC, 50/60 Hz 67W
Other models (Singapore,
110 – 120 V or
Chilean and peruvian models)
220 – 240 V AC, 50/60Hz 67W
SERVICE POSITION OF THE CD MECHANISM DECK
CD board
CD Mechanism Deck
Power Voltage Indication
5
CX-LEM550
SERVICE POSITION OF THE TAPE CASSETTE MECHANISM DECK
SERVICE POSITION OF THE AMP BOARD
Tape Cassette Mechanism Deck
(CMAL1Z240A)
(CMAL1Z240A)
AMP board
