Sony CX-LDB30 / CX-LDB50 / XR-DB30 / XR-DB50 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
AEP Model
CX-LDB30/LDB50
UK Model
CX-LDB30
E Model
CX-LDB30/LDB50
Australian Model
CX-LDB30
MICRO HI-FI COMPONENT SYSTEM
9-879-476-03
2005E16-1
© 2005.05
© 2005.05
Ver. 1.2 2005.05
SPECIFICATIONS
CX-LDB30/LDB50
CX-LDB30/LDB50 are the Amplifier, CD player,
Tape Deck and Tuner section in XR-DB30/DB50.
Tape Deck and Tuner section in XR-DB30/DB50.
— Continued on next page —
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM80BV-F4BD81
Section
Base Unit Name
BU-F4BD81B
Optical Pick-up Name
KSM-215CFP/C2NP
TAPE
Model Name Using Similar Mechanism
CX-LEM330
Section
Tape Transport Mechanism Type
CMAL5Z220A
CX-LDB50
European model:
DIN power output (rated): 60 + 60 W
DIN power output (rated): 60 + 60 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
80 + 80 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
200 + 200 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Other models:
The following measured at AC 220 – 240 V, 50/60 Hz
DIN power output (rated): 60 + 60 W
The following measured at AC 220 – 240 V, 50/60 Hz
DIN power output (rated): 60 + 60 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
80 + 80 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
CX-LDB30
European model:
DIN power output (rated): 45 + 45 W
DIN power output (rated): 45 + 45 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
60 + 60 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
140 + 140 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Other models:
The following measured at AC 220 – 240 V, 50/60 Hz
DIN power output (rated): 45 + 45 W
The following measured at AC 220 – 240 V, 50/60 Hz
DIN power output (rated): 45 + 45 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
60 + 60 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Inputs
AUDIO IN (RCA pin jacks):
AUDIO IN (RCA pin jacks):
Sensitivity 700 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones with
an impedance of 32 ohms
or more
an impedance of 32 ohms
or more
SPEAKER:
accepts impedance of
6 ohms
6 ohms
CD player section
System
Compact disc and digital
audio system
audio system
Laser Diode Properties
Emission duration:
continuous
Laser Output*: Less than
44.6
continuous
Laser Output*: Less than
44.6
µW
* This output is the value measurement at a distance of
200 mm from the objective lens surface on the
Optical Pick-up Block with 7 mm aperture
Optical Pick-up Block with 7 mm aperture
2
CX-LDB30/LDB50
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
100 – 10,000 Hz, using
Sony TYPE I cassettes
Sony TYPE I cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European model:
European model:
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
European model:
European model:
AC 230 V, 50/60 Hz
Other models:
AC 120, 220 or
230 – 240 V, 50/60 Hz
Adjustable with voltage
selector
230 – 240 V, 50/60 Hz
Adjustable with voltage
selector
Power consumption
XR-DB50
European model:
XR-DB50
European model:
85 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Other models:
85 W
XR-DB30
European model:
European model:
70 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Other models:
70 W
Dimensions (w/h/d) excl. speakers:
Approx. 190 x 277 x
269 mm
269 mm
Mass excl. speakers
CX-LDB50:
CX-LDB50:
5.4 kg
CX-LDB30:
5.1 kg
Design and specifications are subject to change
without notice.
without notice.
• Standby power consumption: 0.3 W
• Halogenated flame retardants are not
used in the certain printed wiring boards.
• Lead-free solder is used for soldering
certain parts.
• Halogenated flame retardants are not
used in cabinets.
3
CX-LDB30/LDB50
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
7
3-2.
Side Panel (L)(R), Top Panel, Back Panel .......................
8
3-3.
CD Mechanism Section ...................................................
8
3-4.
Front Panel Section .........................................................
9
3-5.
Power Transformer ..........................................................
9
3-6.
MAIN Board .................................................................... 10
3-7.
PANEL Board, CD EJECT Board, JACK Board ............ 10
3-8.
Cassette Deck Mechanism ............................................... 11
3-9.
Cassette Panel .................................................................. 11
3-10. CD Mechanism Deck (CDM80BV-F4BD81) ................. 12
3-11. Chassis (Top) ................................................................... 12
3-12. Lever (Loading R/L) ........................................................ 13
3-13. Disc Stop Lever, Disc Sensor Lever ................................ 14
3-14. DRIVER Board ............................................................... 14
3-15. BD Board ......................................................................... 15
3-16. Optical Pick-up (KSM-215CFP/C2NP) .......................... 15
3-17. Base Unit (BU-F4BD81B) .............................................. 16
3-18. Lever (BU Lock) ............................................................. 16
3-19. Close Lever ...................................................................... 17
3-20. DIR Lever, Gear (IDL-B) ................................................ 17
3-21. Gear (IDL-C) ................................................................... 18
3-11. Chassis (Top) ................................................................... 12
3-12. Lever (Loading R/L) ........................................................ 13
3-13. Disc Stop Lever, Disc Sensor Lever ................................ 14
3-14. DRIVER Board ............................................................... 14
3-15. BD Board ......................................................................... 15
3-16. Optical Pick-up (KSM-215CFP/C2NP) .......................... 15
3-17. Base Unit (BU-F4BD81B) .............................................. 16
3-18. Lever (BU Lock) ............................................................. 16
3-19. Close Lever ...................................................................... 17
3-20. DIR Lever, Gear (IDL-B) ................................................ 17
3-21. Gear (IDL-C) ................................................................... 18
4.
TEST MODE
............................................................... 19
5.
MECHANICAL ADJUSTMENTS
......................... 20
6.
ELECTRICAL ADJUSTMENTS
.......................... 20
7.
DIAGRAMS
7-1.
Block Diagram — BD Section — ................................... 25
7-2.
Block Diagram — MAIN Section — .............................. 26
7-3.
Printed Wiring Board — BD Board — ........................... 27
7-4.
Schematic Diagram — BD Board — .............................. 28
7-5.
Printed Wiring Board
— DRIVER Board, JACK Board — ............................... 29
— DRIVER Board, JACK Board — ............................... 29
7-6.
Schematic Diagram
— DRIVER Board, JACK Board — ............................... 30
— DRIVER Board, JACK Board — ............................... 30
7-7.
Printed Wiring Board — MAIN Section (1/2) — ........... 31
7-8.
Printed Wiring Board — MAIN Section (2/2) — ........... 32
7-9.
Schematic Diagram — MAIN Section (1/5) — .............. 33
7-10. Schematic Diagram — MAIN Section (2/5) — .............. 34
7-11. Schematic Diagram — MAIN Section (3/5) — .............. 35
7-12. Schematic Diagram — MAIN Section (4/5) — .............. 36
7-13. Schematic Diagram — MAIN Section (5/5) — .............. 37
7-14. Printed Wiring Board — PANEL Board — .................... 38
7-15. Schematic Diagram — PANEL Board — ....................... 39
7-16. Printed Wiring Board — PT Board — ............................ 40
7-17. Schematic Diagram — PT Board — ............................... 41
7-11. Schematic Diagram — MAIN Section (3/5) — .............. 35
7-12. Schematic Diagram — MAIN Section (4/5) — .............. 36
7-13. Schematic Diagram — MAIN Section (5/5) — .............. 37
7-14. Printed Wiring Board — PANEL Board — .................... 38
7-15. Schematic Diagram — PANEL Board — ....................... 39
7-16. Printed Wiring Board — PT Board — ............................ 40
7-17. Schematic Diagram — PT Board — ............................... 41
8.
EXPLODED VIEWS
8-1.
Panel Section ................................................................... 47
8-2.
Front Panel Section ......................................................... 48
8-3.
Chassis Section ................................................................ 49
8-4.
CD Mechanism Deck Section 1 (CDM80BV-F4BD81) . 50
8-5.
CD Mechanism Deck Section 2 (CDM80BV-F4BD81) . 51
8-6.
CD Mechanism Deck Section 3 (CDM80BV-F4BD81) . 52
8-7.
Base Unit Section ............................................................ 53
9.
ELECTRICAL PARTS LIST
.................................. 54
4
CX-LDB30/LDB50
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
exterior.
The CLASS 1 LASER PRODUCT MARKING is located on the
exterior.
