Sony CDX-S2200 Service Manual ▷ View online
1
Ver 1.0 2004. 05
Model Name Using Similar Mechanism
CDX-R3300
CD Drive Mechanism Type
MG-611MA-186//Q
Optical Pick-up Name
KSS1000E
SERVICE MANUAL
AEP Model
UK Model
CDX-S2200
CD player section
Signal-to-noise ratio
120 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
87.5 – 108.0 MHz
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity
Usable sensitivity
9 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
67 dB (stereo),
69 dB (mono)
69 dB (mono)
Harmonic distortion at 1 kHz
0.5% (stereo),
0.3% (mono)
0.3% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
MW/LW
Tuning range
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
MW: 30
µV
LW: 40
µV
SPECIFICATIONS
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 50 W
× 4 (at 4 ohms)
General
Outputs
Audio outputs terminal
(rear)
Power aerial relay control terminal
Power amplifier control terminal
(rear)
Power aerial relay control terminal
Power amplifier control terminal
Inputs
Telephone ATT control terminal
Remote controller input terminal
Aerial input terminal
Remote controller input terminal
Aerial input terminal
Tone controls
Low:
±10 dB at 60 Hz (XPLOD)
Mid:
±10 dB at 1 kHz (XPLOD)
High:
±10 dB at 10 kHz (XPLOD)
• The tuner and CD sections have no adjustments.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-877-830-01
2004E04-1
© 2004. 05
– Continued on next page –
FM/MW/LW COMPACT DISC PLAYER
2
CDX-S2200
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Dimensions
Approx. 178
× 50 × 176 mm
(w/h/d)
Mounting dimensions
Approx. 182
× 53 × 161 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Parts for installation and connections (1 set)
Front panel case (1)
Front panel case (1)
Design and specifications are subject to change without
notice.
notice.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SERVICE NOTES
This label is located on the bottom of the chassis.
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
optical pick-up
semi-fixed resistor
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
than those specified herein may result in hazardous radiation
exposure.
This compact disc player is classified as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
3
CDX-S2200
Notes on CD-Rs (recordable CDs)/CD-RWs (rewritable
CDs)
CDs)
This unit can play the following discs:
Type of discs
Label on the disc
Audio CD
MP3 files
• Some CD-Rs/CD-RWs (depending on the equipment used for
its recording or the condition of the disc) may not play on this
unit.
unit.
• You cannot play a CD-R/CD-RW that is not finalized∗.
• You can play MP3 files recorded on CD-ROMs, CD-Rs, and
• You can play MP3 files recorded on CD-ROMs, CD-Rs, and
CD-RWs.
• A CD-R/CD-RW to which a session can be added can be played.
∗ A process necessary for a recorded CD-R/CD-RW disc to be
played on the audio CD player.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
as shown below.
• Connect the MAIN board (CN350) and the SERVO board (CN2)
with the extension cable (Part No. J-2502-076-1).
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SERVO BOARD
CN2
CN2
MAIN BOARD
CN350
CN350
J-2502-076-1
4
CDX-S2200
TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 5
Connections ............................................................................. 6
Connections ............................................................................. 6
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 7
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Chassis (T) Sub Assy .......................................................... 9
2-5. Roller Arm Assy .................................................................. 9
2-6. Chassis (OP) Assy ............................................................. 10
2-7. Optical Pick-up ................................................................. 10
2-8. SL Motor Assy (M902) ..................................................... 11
2-9. LE Motor Assy (M903) ..................................................... 11
2-10. Servo Board ....................................................................... 12
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Chassis (T) Sub Assy .......................................................... 9
2-5. Roller Arm Assy .................................................................. 9
2-6. Chassis (OP) Assy ............................................................. 10
2-7. Optical Pick-up ................................................................. 10
2-8. SL Motor Assy (M902) ..................................................... 11
2-9. LE Motor Assy (M903) ..................................................... 11
2-10. Servo Board ....................................................................... 12
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 13
3-2. Block Diagram –CD Section– ........................................... 19
3-3. Block Diagram –Tuner Section– ....................................... 20
3-4. Block Diagram –Display Section– .................................... 21
3-5. Printed Wiring Boards –CD Mechanism Section– ............ 22
3-6. Schematic Diagram –CD Mechanism Section (1/2)– ....... 23
3-7. Schematic Diagram –CD Mechanism Section (2/2)– ....... 24
3-8. Printed Wiring Board –Main Section– .............................. 25
3-9. Schematic Diagram –Main Section (1/2)– ........................ 26
3-10. Schematic Diagram –Main Section (2/2)– ........................ 27
3-11. Printed Wiring Board –Key Section– ................................ 28
3-12. Schematic Diagram –Key Section– ................................... 29
3-13. IC Block Diagrams ............................................................ 30
3-2. Block Diagram –CD Section– ........................................... 19
3-3. Block Diagram –Tuner Section– ....................................... 20
3-4. Block Diagram –Display Section– .................................... 21
3-5. Printed Wiring Boards –CD Mechanism Section– ............ 22
3-6. Schematic Diagram –CD Mechanism Section (1/2)– ....... 23
3-7. Schematic Diagram –CD Mechanism Section (2/2)– ....... 24
3-8. Printed Wiring Board –Main Section– .............................. 25
3-9. Schematic Diagram –Main Section (1/2)– ........................ 26
3-10. Schematic Diagram –Main Section (2/2)– ........................ 27
3-11. Printed Wiring Board –Key Section– ................................ 28
3-12. Schematic Diagram –Key Section– ................................... 29
3-13. IC Block Diagrams ............................................................ 30
4. EXPLODED VIEWS
4-1. Main Section ..................................................................... 32
4-2. Front Panel Section ........................................................... 33
4-3. CD Mechanism Section (1) ............................................... 34
4-4. CD Mechanism Section (2) ............................................... 35
4-5. CD Mechanism Section (3) ............................................... 36
4-6. CD Mechanism Section (4) ............................................... 37
4-2. Front Panel Section ........................................................... 33
4-3. CD Mechanism Section (1) ............................................... 34
4-4. CD Mechanism Section (2) ............................................... 35
4-5. CD Mechanism Section (3) ............................................... 36
4-6. CD Mechanism Section (4) ............................................... 37
5. ELECTRICAL PARTS LIST
........................................ 38