Sony CDX-MP50 Service Manual ▷ View online
2
CDX-MP50
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Power requirements
12 V DC car battery
(negative earth)
(negative earth)
Dimensions
Approx. 178
× 50 × 180 mm
(w/h/d)
Mounting dimensions
Approx. 182
× 53 × 161 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Parts for installation and connections
Front panel case (1)
Card remote commander RM-X115
Front panel case (1)
Card remote commander RM-X115
Note
This unit cannot be connected to a digital preamplifier or an equalizer
which is Sony BUS system compatible.
which is Sony BUS system compatible.
Design and specifications are subject to change without
notice.
notice.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
SERVICE NOTES
This label is located on the bottom of the chassis.
This label is located on the drive unit’s internal chassis.
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CDX-MP50
Notes on CD-Rs (recordable CDs)/CD-RWs (rewritable
CDs)
CDs)
This unit can play the following discs:
Type of discs
Label on the disc
Audio CD
MP3 files
• Some CD-Rs/CD-RWs (depending on the equipment used for
its recording or the condition of the disc) may not play on this
unit.
unit.
• You cannot play a CD-R/CD-RW that is not finalized∗.
• You can play MP3 files recorded on CD-ROMs, CD-Rs, and
• You can play MP3 files recorded on CD-ROMs, CD-Rs, and
CD-RWs.
• A CD-R/CD-RW to which a session can be added can be played.
∗ A process necessary for a recorded CD-R/CD-RW disc to be
played on the audio CD player.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
as shown below.
• Connect the MAIN board (CNP701) and the SERVO board (CN1)
with the extension cable (Part No. J-2502-062-1).
• Connect the RELAY board (CNP902) and the DISPLAY board
(CN901) with the extension cable (Part No. J-2502-071-1).
MAIN BOARD CNP701
J-2502-071-1
SERVO BOARD CN1
RELAY BOARD CNP902
DISPLAY BOARD CN901
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CDX-MP50
TABLE OF CONTENTS
1. GENERAL
Location of Controls ................................................................ 5
Connections ............................................................................. 5
Connections ............................................................................. 5
2. DISASSEMBLY
2-1. Sub Panel Assy (CD) ........................................................... 7
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T) Sub Assy .......................................................... 9
2-6. Lever Section ..................................................................... 10
2-7. Servo Board ....................................................................... 10
2-8. Shaft Roller Assy, Load Sw Board .................................... 11
2-9. Floating Block Assy .......................................................... 12
2-10. Optical Pick-up Block ....................................................... 12
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T) Sub Assy .......................................................... 9
2-6. Lever Section ..................................................................... 10
2-7. Servo Board ....................................................................... 10
2-8. Shaft Roller Assy, Load Sw Board .................................... 11
2-9. Floating Block Assy .......................................................... 12
2-10. Optical Pick-up Block ....................................................... 12
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 13
3-2. Circuit Boards Location .................................................... 18
3-3. Block Diagram –CD Section– ........................................... 19
3-4. Block Diagram –Main Section– ........................................ 20
3-5. Block Diagram –Display Section– .................................... 21
3-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
3-7. Schematic Diagram –CD Mechanism Section (1/2)– ....... 24
3-8. Schematic Diagram –CD Mechanism Section (2/2)– ....... 25
3-9. Printed Wiring Boards –Main Section– ............................ 26
3-10. Schematic Diagram –Main Section (1/2)– ........................ 27
3-11. Schematic Diagram –Main Section (2/2)– ........................ 28
3-12. Printed Wiring Board –Relay Section– ............................. 29
3-13. Printed Wiring Board –Display Section– .......................... 30
3-14. Schematic Diagram –Display Section– ............................. 31
3-15. IC Block Diagrams ............................................................ 32
3-2. Circuit Boards Location .................................................... 18
3-3. Block Diagram –CD Section– ........................................... 19
3-4. Block Diagram –Main Section– ........................................ 20
3-5. Block Diagram –Display Section– .................................... 21
3-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
3-7. Schematic Diagram –CD Mechanism Section (1/2)– ....... 24
3-8. Schematic Diagram –CD Mechanism Section (2/2)– ....... 25
3-9. Printed Wiring Boards –Main Section– ............................ 26
3-10. Schematic Diagram –Main Section (1/2)– ........................ 27
3-11. Schematic Diagram –Main Section (2/2)– ........................ 28
3-12. Printed Wiring Board –Relay Section– ............................. 29
3-13. Printed Wiring Board –Display Section– .......................... 30
3-14. Schematic Diagram –Display Section– ............................. 31
3-15. IC Block Diagrams ............................................................ 32
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 34
4-2. Front Panel Section ........................................................... 35
4-3. CD Mechanism Section (1) ............................................... 36
4-4. CD Mechanism Section (2) ............................................... 37
4-5. CD Mechanism Section (3) ............................................... 38
4-2. Front Panel Section ........................................................... 35
4-3. CD Mechanism Section (1) ............................................... 36
4-4. CD Mechanism Section (2) ............................................... 37
4-5. CD Mechanism Section (3) ............................................... 38
5. ELECTRICAL PARTS LIST
........................................ 39
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CDX-MP50
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Connections