Sony CDX-L450V Service Manual ▷ View online
1
Model Name Using Similar Mechanism
CDX-L450X/L470X
CD Drive Mechanism Type
MG-393X-121//K
Optical Pick-up Name
KSS-720A
SERVICE MANUAL
CDX-L450V
FM/AM COMPACT DISC PLAYER
• The CD sections have no adjustments.
CD player section
Signal-to-noise ratio
90 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
FM tuning interval:
50 kHz/200 kHz
switchable
87.5 – 108 MHz
(at 50 kHz step)
87.5 – 107.9 MHz
(at 200 kHz step)
50 kHz/200 kHz
switchable
87.5 – 108 MHz
(at 50 kHz step)
87.5 – 107.9 MHz
(at 200 kHz step)
Antenna terminal
External antenna connector
Intermediate frequency 10.7 MHz
Usable sensitivity
Usable sensitivity
11 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
65 dB (stereo),
68 dB (mono)
68 dB (mono)
Harmonic distortion at 1 kHz
0.7% (stereo),
0.5% (mono)
0.5% (mono)
Separation
33 dB at 1 kHz
Frequency response
30 – 15,000 Hz
AM
Tuning range
AM tuning interval:
9 kHz/10 kHz
switchable
531 – 1,602 kHz
(at 9 kHz step)
530 – 1,710 kHz
(at 10 kHz step)
9 kHz/10 kHz
switchable
531 – 1,602 kHz
(at 9 kHz step)
530 – 1,710 kHz
(at 10 kHz step)
Antenna terminal
External antenna connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
SPECIFICATIONS
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 50 W
×
4 (at 4 ohms)
General
Outputs
Audio output
Power amplifier control
lead
Power aerial relay control
lead
Power amplifier control
lead
Power aerial relay control
lead
Tone controls
Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Treble ±9 dB at 10 kHz
Power requirements
12 V DC car battery
(negative earth)
(negative earth)
Dimensions
Approx. 178
×
50
×
176 mm
(w/h/d)
Mounting dimensions
Approx. 182
×
53
×
161 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Parts for installation and
connections (1 set)
Front panel case (1)
connections (1 set)
Front panel case (1)
Note
This unit cannot be connected to a digital
preamplifier or an equalizer.
preamplifier or an equalizer.
Design and specifications are subject to change without
notice.
notice.
Ver 1.1 2001. 11
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-873-251-02
2001K0400-1
© 2001. 11
E Model
2
optical pick-up block
semi-fixed resistor
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
CDX-L450V
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 4
Getting Started ......................................................................... 4
CD Player ................................................................................ 5
Radio ....................................................................................... 5
Other Functions ....................................................................... 6
Connections ............................................................................. 7
Getting Started ......................................................................... 4
CD Player ................................................................................ 5
Radio ....................................................................................... 5
Other Functions ....................................................................... 6
Connections ............................................................................. 7
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 9
2-2. CD Mechanism Block ....................................................... 10
2-3. Main Board ....................................................................... 10
2-4. Heat Sink ........................................................................... 11
2-5. Chassis (T) Sub Assy ........................................................ 11
2-6. Lever Section .................................................................... 12
2-7. Servo Board ....................................................................... 12
2-8. Shaft Roller Assy .............................................................. 13
2-9. Floating Block Assy .......................................................... 13
2-10. Optical Pick-up Block ....................................................... 14
2-2. CD Mechanism Block ....................................................... 10
2-3. Main Board ....................................................................... 10
2-4. Heat Sink ........................................................................... 11
2-5. Chassis (T) Sub Assy ........................................................ 11
2-6. Lever Section .................................................................... 12
2-7. Servo Board ....................................................................... 12
2-8. Shaft Roller Assy .............................................................. 13
2-9. Floating Block Assy .......................................................... 13
2-10. Optical Pick-up Block ....................................................... 14
3. ELECTRICAL ADJUSTMENTS
................................. 15
4. DIAGRAMS
4-1. IC Pin Description ............................................................. 17
4-2. Block Diagram –CD Section– ........................................... 19
4-3. Block Diagram –Tuner Section– ....................................... 20
4-4. Block Diagram –Display Section– .................................... 21
4-5. Circuit Boards Location .................................................... 21
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
4-7. Schematic Diagram –CD Mechanism Section– ................ 24
4-8. Printed Wiring Board –Main Section– .............................. 25
4-9. Schematic Diagram –Main Section (1/2)– ........................ 26
4-10. Schematic Diagram –Main Section (2/2)– ........................ 27
4-11. Printed Wiring Board –Display Section– .......................... 28
4-12. Schematic Diagram –Display Section– ............................. 29
4-2. Block Diagram –CD Section– ........................................... 19
4-3. Block Diagram –Tuner Section– ....................................... 20
4-4. Block Diagram –Display Section– .................................... 21
4-5. Circuit Boards Location .................................................... 21
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
4-7. Schematic Diagram –CD Mechanism Section– ................ 24
4-8. Printed Wiring Board –Main Section– .............................. 25
4-9. Schematic Diagram –Main Section (1/2)– ........................ 26
4-10. Schematic Diagram –Main Section (2/2)– ........................ 27
4-11. Printed Wiring Board –Display Section– .......................... 28
4-12. Schematic Diagram –Display Section– ............................. 29
5. EXPLODED VIEWS
5-1. Chassis Section ................................................................. 32
5-2. Front Panel Section ........................................................... 33
5-3. CD Mechanism Section (1) ............................................... 34
5-4. CD Mechanism Section (2) ............................................... 35
5-5. CD Mechanism Section (3) ............................................... 36
5-2. Front Panel Section ........................................................... 33
5-3. CD Mechanism Section (1) ............................................... 34
5-4. CD Mechanism Section (2) ............................................... 35
5-5. CD Mechanism Section (3) ............................................... 36
6. ELECTRICAL PARTS LIST
........................................ 37
CDX-L450V
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CDX-L450V
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.