Sony CDX-GT820IP Service Manual ▷ View online
SERVICE MANUAL
Published by Sony Techno Create Corporation
Sony Corporation
Audio Business Group
SPECIFICATIONS
FM/AM COMPACT DISC PLAYER
9-887-935-01
2007L04-1
©
2007.12
US Model
Ver. 1.0 2007.12
Model Name Using Similar Mechanism
CDX-GT620IP
CD Drive Mechanism Type
MG-101I-188//Q
Optical Pick-up Name
DAX-25A
• The tuner and CD sections have no adjustments.
CDX-GT820IP
CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Tuner section
FM
Tuning range:
87.5 – 107.9 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio:
67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz:
0.5 % (stereo), 0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
Tuning range:
87.5 – 107.9 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio:
67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz:
0.5 % (stereo), 0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
AM
Tuning range:
530 – 1,710 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
10.7 MHz/450 kHz
Sensitivity:
30
Tuning range:
530 – 1,710 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
10.7 MHz/450 kHz
Sensitivity:
30
μV
Power amplifi er section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
General
Output:
Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna (aerial) relay control terminal
Power
Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna (aerial) relay control terminal
Power
amplifi er control terminal
Inputs:
Telephone ATT control terminal
Illumination control terminal
Bus control input terminal
Bus audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
iPod signal input terminal (dock connector)
Telephone ATT control terminal
Illumination control terminal
Bus control input terminal
Bus audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
iPod signal input terminal (dock connector)
– Continued on next page –
AUDIO POWER SPECIFICATIONS POWER OUTPUT
AND TOTAL HARMONIC DISTORTION
23.2 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 5% total harmonic distortion.
AND TOTAL HARMONIC DISTORTION
23.2 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 5% total harmonic distortion.
CDX-GT820IP
2
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SERVICE NOTES
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
TEST DISCS
Please use the following test discs for the check on the CD section.
Please use the following test discs for the check on the CD section.
YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
Tone controls:
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178
× 50 × 180 mm
(7
1/8
× 2 × 7
1/8
in) (w/h/d)
Mounting dimensions: Approx. 182
× 53 × 162 mm
(7
1/4
× 2
1/8
× 6
1/2
in) (w/h/d)
Mass: Approx. 1.3 kg (2 lb. 14 oz.)
Supplied accessories:
Card remote commander: RM-X152
Parts for installation and connections (1 set)
Supplied accessories:
Card remote commander: RM-X152
Parts for installation and connections (1 set)
MPEG Layer-3 audio coding technology and patents licensed from Fraun-
hofer IIS and Thomson.
This product is protected by certain intellectual property rights of Micro-
soft Corporation. Use or distribution of such technology outside of this
product is prohibited without a license from Microsoft or an authorized
Microsoft subsidiary.
hofer IIS and Thomson.
This product is protected by certain intellectual property rights of Micro-
soft Corporation. Use or distribution of such technology outside of this
product is prohibited without a license from Microsoft or an authorized
Microsoft subsidiary.
Design and specifi cations are subject to change
without notice.
without notice.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
optical pick-up
semi-fixed resistor
CDX-GT820IP
3
• CD playback
You can play CD-DA (also containing CD TEXT), CD-R/CD-
RW (MP3/WMA/AAC fi les).
RW (MP3/WMA/AAC fi les).
Type of discs
Label on the disc
CD-DA
MP3
WMA
AAC
1.
SERVICE NOTE
..................................................... 4
2. GENERAL
Location of Controls ....................................................... 5
Connections
....................................................................
6
3. DISASSEMBLY
3-1. Sub Panel Assy ............................................................... 8
3-2. CD Mechanism Block ..................................................... 8
3-3. Main Board ..................................................................... 9
3-4. Servo
3-2. CD Mechanism Block ..................................................... 8
3-3. Main Board ..................................................................... 9
3-4. Servo
Board
.................................................................... 9
3-5. Chassis
(T)
Sub
Assy
...................................................... 10
3-6. Roller Arm Assy .............................................................. 10
3-7. Chassis
3-7. Chassis
(OP)
Assy
........................................................... 11
3-8. Chucking
Arm
Sub
Assy
................................................. 11
3-9. Sled
Motor
Assy
.............................................................. 12
3-10. Optical Pick-up Section .................................................. 13
3-11. Optical Pick-up ............................................................... 13
3-11. Optical Pick-up ............................................................... 13
4.
DIAGNOSIS FUNCTION
..................................... 14
5. DIAGRAMS
5-1. Block Diagram –Main Section– ..................................... 17
5-2. Block Diagram –Display Section– ................................. 18
5-3. Printed Wiring Board –Main Section (1/2)– ................... 20
5-4. Printed Wiring Board –Main Section (2/2)– ................... 21
5-5. Schematic Diagram –Main Section (1/4)– ...................... 22
5-6. Schematic Diagram –Main Section (2/4)– ...................... 23
5-7. Schematic Diagram –Main Section (3/4)– ...................... 24
5-8. Schematic Diagram –Main Section (4/4)– ...................... 25
5-9. Printed Wiring Board –Sub Section- .............................. 26
5-10. Schematic Diagram –Sub Section- ................................. 27
5-11. Printed Wiring Boards –Key Section – ........................... 28
5-12. Schematic Diagram –Key Section – ............................... 29
5-2. Block Diagram –Display Section– ................................. 18
5-3. Printed Wiring Board –Main Section (1/2)– ................... 20
5-4. Printed Wiring Board –Main Section (2/2)– ................... 21
5-5. Schematic Diagram –Main Section (1/4)– ...................... 22
5-6. Schematic Diagram –Main Section (2/4)– ...................... 23
5-7. Schematic Diagram –Main Section (3/4)– ...................... 24
5-8. Schematic Diagram –Main Section (4/4)– ...................... 25
5-9. Printed Wiring Board –Sub Section- .............................. 26
5-10. Schematic Diagram –Sub Section- ................................. 27
5-11. Printed Wiring Boards –Key Section – ........................... 28
5-12. Schematic Diagram –Key Section – ............................... 29
6.
EXPLODED VIEWS
6-1. Main
Section
................................................................... 36
6-2. Front Panel Section ......................................................... 37
6-3. CD Mechanism Section (MG-101I-188//Q) ................... 38
6-3. CD Mechanism Section (MG-101I-188//Q) ................... 38
7.
ELECTRICAL PARTS LIST
.............................. 39
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
CDX-GT820IP
4
SECTION 1
SERVICE NOTE
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
• Connect the MAIN board (CN350) and the SERVO board
(CN401) with the extension cable (Part No. J-2502-076-1).
NOTE FOR REPLACEMENT OF THE SERVO BOARD
When repairing, the complete SERVO board (A-1362-921-A)
should be replaced since any parts in the SERVO board cannot be
repaired.
When repairing, the complete SERVO board (A-1362-921-A)
should be replaced since any parts in the SERVO board cannot be
repaired.
NOTE FOR THE 24-PIN CONNECTOR (CN901)
Do not use alcohol to clean the 24-pin connector (CN901) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
Do not use alcohol to clean the 24-pin connector (CN901) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
SERVO BOARD
CN401
CN401
MAIN BOARD
CN350
CN350
J-2502-076-1