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E Model

2005D04-1
© 2005.04

CD player section
Signal-to-noise ratio

120 dB

Frequency response

10 – 20,000 Hz

Wow and flutter

Below measurable limit

Tuner section
FM
Tuning range

FM tuning interval:
50 kHz/200 kHz switchable
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)

Antenna/aerial terminal

External antenna/aerial connector

Intermediate frequency

10.7 MHz/450 kHz

Usable sensitivity

9 dBf

Selectivity

75 dB at 400 kHz

Signal-to-noise ratio

67 dB (stereo),
69 dB (mono)

Harmonic distortion at 1 kHz

0.5% (stereo),
0.3% (mono)

Separation

35 dB at 1 kHz

Frequency response

30 – 15,000 Hz

AM
Tuning range

AM tuning interval:
9 kHz/10 kHz switchable
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)

Antenna/aerial terminal

External antenna/aerial connector

Intermediate frequency

10.7 MHz/450 kHz

Sensitivity

AM: 30 

µV

Power amplifier section
Outputs

Speaker outputs
(sure seal connectors)

Speaker impedance

4 – 8 ohms

Maximum power output

52 W 

× 4 (at 4 ohms)

General
Outputs

Audio outputs terminal
(front, rear/sub switchable)
Power antenna/aerial relay control terminal
Power amplifier control terminal

Inputs

Telephone ATT control terminal
Remote controller input terminal
BUS control input terminal
BUS audio input terminal
Antenna/aerial input terminal

Tone controls

Low: 

±10 dB at 60 Hz (XPLOD)

Mid: 

±10 dB at 1 kHz (XPLOD)

High: 

±10 dB at 10 kHz (XPLOD)

Power requirements

12 V DC car battery (negative ground)

Dimensions

Approx. 178 

× 50 × 181 mm

(7

 1/8

 

× 2 × 7

 1/4

 in) (w/h/d)

Mounting dimensions

Approx. 182 

× 53 × 161 mm

(7

 1/4

 

× 2

 1/8

 

× 6

 3/8

 in) (w/h/d)

Mass

Approx. 1.2 kg

Supplied accessories

Card remote commander RM-X115
Parts for installation and connections (1 set)
Front panel case (1)

• The tuner and CD sections have no adjustments.

Model Name Using Similar Mechanism

CDX-F5500

CD Drive Mechanism Type

MG-611ME-186//Q

Optical Pick-up Name

KSS1000E

2

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged

by heat.

If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.

TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:

CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)

optical pick-up

semi-fixed resistor

This label is located on the bottom of the chassis.

3

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

Notes on CD-Rs (recordable CDs)/CD-RWs (rewritable
CDs)
This unit can play the following discs:

Type of discs

Label on the disc

Audio CD

MP3 files

• Some CD-Rs/CD-RWs (depending on the equipment used for its

recording or the condition of the disc) may not play on this unit.

• You cannot play a CD-R/CD-RW that is not finalized*.
• You can play MP3 files recorded on CD-ROMs, CD-Rs, and

CD-RWs.

• A CD-R/CD-RW to which a session can be added can be played.

* A  process necessary for a recorded CD-R/CD-RW disc to be

played on the audio CD player.

EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.

• Connect the MAIN board (CN350) and the SERVO board (CN2)

with the extension cable (Part No. J-2502-076-1).

SERVO BOARD
CN2

J-2502-076-1

MAIN BOARD
CN350

4

Location of controls .........................................................

5

Card remote commander RM-X115 ................................

6

2-1.

Sub Panel Assy ................................................................

7

2-2.

CD Mechanism Block .....................................................

8

2-3.

Main Board ......................................................................

8

2-4.

Chassis (T) Sub Assy .......................................................

9

2-5.

Roller Arm Assy ..............................................................

9

2-6.

Chassis (OP) Assy ........................................................... 10

2-7.

Optical Pick-up ................................................................ 10

2-8.

SL Motor Assy (M902) ................................................... 11

2-9.

LE Motor Assy (M903) ................................................... 11

2-10. Servo Board ..................................................................... 12

3-1.

IC Pin Descriptions ......................................................... 13

3-2.

Block Diagram –CD Section– ......................................... 19

3-3.

Block Diagram –Main Section– ...................................... 20

3-4.

Block Diagram –Display Section– .................................. 21

3-5.

Circuit Boards Location .................................................. 21

3-6.

Printed Wiring Boards –CD Mechanism Section– .......... 22

3-7.

Schematic Diagram –CD Mechanism Section (1/2)– ..... 23

3-8.

Schematic Diagram –CD Mechanism Section (2/2)– ..... 24

3-9.

Printed Wiring Board –Main Section– ............................ 25

3-10. Schematic Diagram –Main Section (1/2)– ...................... 26
3-11. Schematic Diagram –Main Section (2/2)– ...................... 27
3-12. Printed Wiring Board –Sub Section– .............................. 28
3-13. Schematic Diagram –Sub Section– ................................. 28
3-14. Printed Wiring Board –Key Section– .............................. 29
3-15. Schematic Diagram –Key Section– ................................. 30
3-16. IC Block Diagrams .......................................................... 31

4-1.

Main Section .................................................................... 34

4-2.

Front Panel Section ......................................................... 35

4-3.

CD Mechanism Section (1) ............................................. 36

4-4.

CD Mechanism Section (2) ............................................. 37

4-5.

CD Mechanism Section (3) ............................................. 38

4-6.

CD Mechanism Section (4) ............................................. 39

.................................. 40