Sony CDX-DAB6650 Service Manual ▷ View online
1
Ver. 1.0 2005. 06
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-611TA-186//Q
Optical Pick-up Name
KSS1000E
SERVICE MANUAL
AEP Model
UK Model
CDX-DAB6650
CD player section
Signal-to-noise ratio
120 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
87.5 – 108.0 MHz
Aerial terminal
External aerial connector
Intermediate frequency
10.7 MHz/450 kHz
Usable sensitivity
9 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
67 dB (stereo),
69 dB (mono)
69 dB (mono)
Harmonic distortion at 1 kHz
0.5% (stereo),
0.3% (mono)
0.3% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
MW/LW
Tuning range
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
Aerial terminal
External aerial connector
Intermediate frequency
10.7 MHz/450 kHz
Sensitivity
MW: 30 µV
LW: 40 µV
LW: 40 µV
SPECIFICATIONS
DAB section
Tuning range
DAB BAND III: 174.928 – 239.200 MHz
DAB L-BAND: 1,452.960 – 1,490.624 MHz
DAB L-BAND: 1,452.960 – 1,490.624 MHz
Usable sensitivity
DAB BAND III: –97 dBm
DAB L-BAND: –95 dBm
DAB L-BAND: –95 dBm
Transmission mode
I, II, III, IV
Aerial terminal
External aerial connector
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 52 W
×
4 (at 4 ohms)
General
Outputs
Audio outputs terminal (front, sub/rear switchable)
Power aerial relay control terminal
Power amplifier control terminal
Power aerial relay control terminal
Power amplifier control terminal
Inputs
Telephone ATT control terminal
Illumination control terminal
AUX IN terminal
Remote controller input terminal
Antenna input terminal
DAB aerial input
Illumination control terminal
AUX IN terminal
Remote controller input terminal
Antenna input terminal
DAB aerial input
• The tuner and CD sections have no adjustments.
Sony Corporation
e Vehicle Group
Published by Sony Engineering Corporation
9-879-770-01
2005F04-1
© 2005. 06
– Continued on next page –
FM/MW/LW/DAB COMPACT DISC PLAYER
2
CDX-DAB6650
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Tone controls
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements
12 V DC car battery
(negative earth)
(negative earth)
Dimensions
Approx. 178
×
50
×
182 mm
(w/h/d)
Mounting dimensions
Approx. 182
×
53
×
161 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Card remote commander RM-X151
Parts for installation and connections (1 set)
Front panel cover (1)
Parts for installation and connections (1 set)
Front panel cover (1)
US and foreign patents licensed from Dolby Laboratories.
MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
Fraunhofer IIS and Thomson.
Note
This unit cannot be connected to a digital preamplifier or an equalizer
which is Sony BUS system compatible.
which is Sony BUS system compatible.
Design and specifications are subject to change without
notice.
notice.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
SERVICE NOTES
This label is located on the bottom of the chassis.
optical pick-up
semi-fixed resistor
3
CDX-DAB6650
• CD Playback:
You can play CD-DA (also containing CD TEXT*
1
), CD-R/CD-
RW (MP3 files also containing Multi Session and ATRAC CD
(ATRAC3 and ATRAC3plus format).
(ATRAC3 and ATRAC3plus format).
Type of discs
Label on the disc
CD-DA
MP3
ATRAC CD
*1 A CD TEXT disc is a CD-DA that includes information such as
disc, artist and track name.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
as shown below.
• Connect the MAIN board (CNP301) and the SERVO board (CN2)
with the extension cable (Part No. J-2502-076-1).
SERVO BOARD
CN2
CN2
MAIN BOARD
CNP301
CNP301
J-2502-076-1
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
4
CDX-DAB6650
TABLE OF CONTENTS
1. GENERAL
Location of Controls ................................................................ 5
Connections ............................................................................. 6
Connections ............................................................................. 6
2. DISASSEMBLY
2-1. Sub Panel (LCD) Assy ........................................................ 9
2-2. CD Mechanism Block ......................................................... 9
2-3. Main Board ....................................................................... 10
2-4. Chassis (T) Sub Assy ........................................................ 10
2-5. Roller Arm Assy ................................................................ 11
2-6. Chassis (OP) Assy ............................................................. 11
2-7. Optical Pick-up ................................................................. 12
2-8. SL Motor Assy (M902) ..................................................... 12
2-9. LE Motor Assy (M903) ..................................................... 13
2-10. Servo Board ....................................................................... 13
2-11. Front Back Panel (LCD) ................................................... 14
2-12. Key Base Board ................................................................. 14
2-13. Display Section ................................................................. 15
2-14. Spring (M) ......................................................................... 15
2-15. Spring (S) .......................................................................... 16
2-2. CD Mechanism Block ......................................................... 9
2-3. Main Board ....................................................................... 10
2-4. Chassis (T) Sub Assy ........................................................ 10
2-5. Roller Arm Assy ................................................................ 11
2-6. Chassis (OP) Assy ............................................................. 11
2-7. Optical Pick-up ................................................................. 12
2-8. SL Motor Assy (M902) ..................................................... 12
2-9. LE Motor Assy (M903) ..................................................... 13
2-10. Servo Board ....................................................................... 13
2-11. Front Back Panel (LCD) ................................................... 14
2-12. Key Base Board ................................................................. 14
2-13. Display Section ................................................................. 15
2-14. Spring (M) ......................................................................... 15
2-15. Spring (S) .......................................................................... 16
3. DIAGRAMS
3-1. Block Diagram –CD Section– ........................................... 17
3-2. Block Diagram –Main Section– ........................................ 18
3-3. Block Diagram –Display Section– .................................... 19
3-4. Circuit Boards Location .................................................... 19
3-5. Printed Wiring Boards –CD Mechanism Section– ............ 21
3-6. Schematic Diagram –CD Mechanism Section (1/2)– ....... 22
3-7. Schematic Diagram –CD Mechanism Section (2/2)– ....... 23
3-8. Printed Wiring Board –Main Section– .............................. 24
3-9. Schematic Diagram –Main Section (1/3)– ........................ 26
3-10. Schematic Diagram –Main Section (2/3)– ........................ 27
3-11. Schematic Diagram –Main Section (3/3)– ........................ 28
3-12. Printed Wiring Board –Preset Section– ............................. 29
3-13. Schematic Diagram –Preset Section– ............................... 29
3-14. Printed Wiring Board –Key Base Section– ....................... 30
3-15. Schematic Diagram –Key Base Section– .......................... 31
3-16. Printed Wiring Board –Key Display Section– .................. 32
3-17. Schematic Diagram –Key Display Section– ..................... 33
3-2. Block Diagram –Main Section– ........................................ 18
3-3. Block Diagram –Display Section– .................................... 19
3-4. Circuit Boards Location .................................................... 19
3-5. Printed Wiring Boards –CD Mechanism Section– ............ 21
3-6. Schematic Diagram –CD Mechanism Section (1/2)– ....... 22
3-7. Schematic Diagram –CD Mechanism Section (2/2)– ....... 23
3-8. Printed Wiring Board –Main Section– .............................. 24
3-9. Schematic Diagram –Main Section (1/3)– ........................ 26
3-10. Schematic Diagram –Main Section (2/3)– ........................ 27
3-11. Schematic Diagram –Main Section (3/3)– ........................ 28
3-12. Printed Wiring Board –Preset Section– ............................. 29
3-13. Schematic Diagram –Preset Section– ............................... 29
3-14. Printed Wiring Board –Key Base Section– ....................... 30
3-15. Schematic Diagram –Key Base Section– .......................... 31
3-16. Printed Wiring Board –Key Display Section– .................. 32
3-17. Schematic Diagram –Key Display Section– ..................... 33
4. EXPLODED VIEWS
4-1. Main Section ..................................................................... 42
4-2. Front Panel Section ........................................................... 43
4-3. CD Mechanism Section (1) ............................................... 44
4-4. CD Mechanism Section (2) ............................................... 45
4-5. CD Mechanism Section (3) ............................................... 46
4-6. CD Mechanism Section (4) ............................................... 47
4-2. Front Panel Section ........................................................... 43
4-3. CD Mechanism Section (1) ............................................... 44
4-4. CD Mechanism Section (2) ............................................... 45
4-5. CD Mechanism Section (3) ............................................... 46
4-6. CD Mechanism Section (4) ............................................... 47
5. ELECTRICAL PARTS LIST
........................................ 48