Sony CDX-60X Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC CHANGER
US Model
SPECIFICATIONS
CDX-60X
Model Name Using Similar Mechanism
CDX-636
CD Drive Mechanism Type
MG-251A-137
Optical Pick-up Name
KSS-720A/K1NP
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
3
Installation .......................................................................
4
Connections .....................................................................
4
3.
DISASSEMBLY
.........................................................
5
4.
MECHANISM DECK ASSEMBLY
.................... 11
5.
MECHANICAL ADJUSTMENT
.......................... 13
6.
ELECTRICAL CHECK
.......................................... 14
7.
DIAGRAMS
7-1. Block Diagram – RF SERVO/
DA CONVERTER Section – .......................................... 17
7-2. Block Diagram – BUS CONTROL/
POWER SUPPLY Section – ........................................... 18
7-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
7-4. Printed Wiring Boards – RF/LSW Boards – ................. 20
7-5. Schematic Diagram – RF/LSW Boards – ...................... 21
7-6. Printed Wiring Boards
7-5. Schematic Diagram – RF/LSW Boards – ...................... 21
7-6. Printed Wiring Boards
– MAIN Board (Component Side) – .............................. 22
7-7. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 23
7-8. Schematic Diagram – MAIN Board (1/2) – .................. 24
7-9. Schematic Diagram – MAIN Board (2/2) – .................. 25
7-10. Printed Wiring Boards – JACK/SWITCH Boards – ..... 26
7-11. Schematic Diagram – JACK/SWITCH Boards – .......... 26
7-12. IC Pin Function Description ........................................... 32
7-9. Schematic Diagram – MAIN Board (2/2) – .................. 25
7-10. Printed Wiring Boards – JACK/SWITCH Boards – ..... 26
7-11. Schematic Diagram – JACK/SWITCH Boards – .......... 26
7-12. IC Pin Function Description ........................................... 32
8.
EXPLODED VIEWS
................................................ 35
9.
ELECTRICAL PARTS LIST
............................... 40
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
3
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT
UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
DISC MAGAZINE GETTING OUT PROCEDURE
ON THE POWER SUPPLY IS OFF
ON THE POWER SUPPLY IS OFF
Remove the COVER (LOWER T) beforehand
1) Press the lever (ML.S) assy in the direction of arrow A.
2) Removal the magazine assy.
2) Removal the magazine assy.
Note:
Take out the magazine only when the tray is completely within the
magazine. If the disk or tray is sticking out, turn on the power and
eject the magazine.
eject the magazine.
Lever (ML.S)
Magazine ass’y
A
SECTION 2
GENERAL
This section is extracted from
instruction manual.
instruction manual.
4
4
