Sony CDX-4270R Service Manual ▷ View online
25
25
tuner unit
(TU601)
(TU601)
DISC IN SW board
DISPLAY board
LOAD SW board
SERVO board
MAIN board
LIMIT SW board
SUB board
4-5. CIRCUIT BOARDS LOCATION
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
¢
: internal component.
•
C
: panel designation.
•
U
: B+ Line.
•
H
: adjustment for repair.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: FM
f
: MW
J
: CD
• Abbreviation
G
: German model.
for printed wiring boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
(Side A)
parts face are indicated.
Note: The components identified by mark
!
or dotted line
with mark
!
are critical for safety.
Replace only with part number specified.
• Abbreviation
G
: German model.
• Waveforms
(MODE:PLAY)
1
2
3
4
5
6
7
Approx. 620mVp-p
IC2
1
(FEO)
0V
IC2
#¡
(RFO)
1.2Vp-p
Approx. 200mVp-p
IC2
$™
(TEO)
0V
IC1
3
(MDP)
2.6Vp-p
7.6
µ
sec
IC1
@º
(LRCK)
5.8Vp-p
22.7
µ
sec
IC1
@™
(BCK)
5.7Vp-p
474nsec
16.89MHz
IC1
#¢
(XTAI)
3.2Vp-p
26
26
CDX-4270R
4-6. PRINTED WIRING BOARDS — CD MECHANISM SECTION —
(Page 29)
Ref. No.
Location
IC1
D-2
IC2
E-5
IC3
B-2
Q1
F-5
Q2
F-6
• Semiconductor
Location
27
27
CDX-4270R
4-7. SCHEMATIC DIAGRAM — CD MECHANISM SECTION — • Refer to page 25 for Waveforms.
• Refer to page 35 for IC Block Diagrams.
Note:
• Voltage and waveforms are dc with respect to ground
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
no mark : CD PLAY
∗
: Impossible to measure
(Page
30)
28
28
CDX-4270R
4-8. PRINTED WIRING BOARD — MAIN SECTION —
D403
B-3
D603
G-2
D881
H-4
D909
D-10
D914
B-9
D918
J-9
D919
K-9
D920
B-9
D930
C-9
D940
D-10
IC401
F-6
IC601
F-3
IC602
I-3
IC603
G-3
IC801
J-7
Q110
B-4
Q111
B-4
Q210
C-4
Q211
C-5
Q615
F-5
Q618
J-1
Q905
C-10
Q906
H-5
Q907
I-12
Q908
I-12
Q913
G-13
Q914
K-9
Q915
K-9
Q916
C-9
Q917
C-10
Q918
C-10
Q919
G-13
Q924
D-12
Q925
D-11
Q940
D-11
• Semiconductor
Location (side A)
Ref. No.
Location
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