Sony CDX-3700 Service Manual ▷ View online
– 1 –
MICROFILM
SERVICE MANUAL
E Model
CDX-3700
FM/AM COMPACT DISC PLAYER
CD player section
System
Compact disc digital audio
system
system
Signal-to-noise ratio
90 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
FM tuning interval:
50 kHz/200 kHz
switchable
87.5 – 108.0 MHz
(at 50 kHz step)
87.5 – 107.9 MHz
(at 200 kHz step)
50 kHz/200 kHz
switchable
87.5 – 108.0 MHz
(at 50 kHz step)
87.5 – 107.9 MHz
(at 200 kHz step)
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz
Usable sensitivity
Usable sensitivity
12 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
65 dB (stereo),
68 dB (mono)
68 dB (mono)
Harmonic distortion at 1 kHz
0.7% (stereo),
0.5% (mono)
0.5% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
AM
Tuning range
AM tuning interval:
9 kHz/10 kHz switchable
531 – 1,602 kHz
(at 9 kHz step)
530 – 1,710 kHz
(at 10 kHz step)
9 kHz/10 kHz switchable
531 – 1,602 kHz
(at 9 kHz step)
530 – 1,710 kHz
(at 10 kHz step)
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
SPECIFICATIONS
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 40 W
×
4 (at 4 ohms)
General
Outputs
Line output
Power amplifier control
lead
Power aerial relay control
lead
Power amplifier control
lead
Power aerial relay control
lead
Tone controls
Bass ±8 dB at 100 Hz
Treble ±8 dB at 10 kHz
Treble ±8 dB at 10 kHz
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Dimensions
Approx. 178
×
50
×
178 mm
(w/h/d)
Mounting dimensions
Approx. 182
×
53
×
162 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Parts for installation and
connections (1 set)
connections (1 set)
Design and specifications are subject to change without
notice.
notice.
• The tuner and CD sections have no adjustments.
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-310-153
– 2 –
TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................ 3
Getting Started ........................................................................ 3
Setting the clock ..................................................................... 4
CD Player ................................................................................ 4
Radio ....................................................................................... 4
Other Functions ...................................................................... 5
Connections ............................................................................ 6
Getting Started ........................................................................ 3
Setting the clock ..................................................................... 4
CD Player ................................................................................ 4
Radio ....................................................................................... 4
Other Functions ...................................................................... 5
Connections ............................................................................ 6
2. DISASSEMBLY
2-1. Cover ................................................................................... 8
2-2. Front Panel Assy ................................................................. 8
2-3. Key Board ........................................................................... 9
2-4. Main Sub Assy .................................................................... 9
2-5. CD Mechanism Block ....................................................... 10
2-6. Heat Sink ........................................................................... 10
2-7. Chassis (R) Block Assy ..................................................... 11
2-8. Floating Block Assy .......................................................... 11
2-9. Roller Arm Assy ................................................................ 12
2-10. Optical Pick-up Block ....................................................... 12
2-2. Front Panel Assy ................................................................. 8
2-3. Key Board ........................................................................... 9
2-4. Main Sub Assy .................................................................... 9
2-5. CD Mechanism Block ....................................................... 10
2-6. Heat Sink ........................................................................... 10
2-7. Chassis (R) Block Assy ..................................................... 11
2-8. Floating Block Assy .......................................................... 11
2-9. Roller Arm Assy ................................................................ 12
2-10. Optical Pick-up Block ....................................................... 12
3. DIAGRAMS
3-1. IC Pin Description ............................................................. 13
3-2. Block Diagram .................................................................. 15
3-3. Printed Wiring Boards –Main Section– ............................ 17
3-4. Schematic Diagram –Main Section (1/3)– ........................ 21
3-5. Schematic Diagram –Main Section (2/3)– ........................ 23
3-6. Schematic Diagram –Main Section (3/3)– ........................ 25
3-7. Schematic Diagram –Display Section– ............................. 27
3-8. Printed Wiring Board –Display Section– .......................... 29
3-2. Block Diagram .................................................................. 15
3-3. Printed Wiring Boards –Main Section– ............................ 17
3-4. Schematic Diagram –Main Section (1/3)– ........................ 21
3-5. Schematic Diagram –Main Section (2/3)– ........................ 23
3-6. Schematic Diagram –Main Section (3/3)– ........................ 25
3-7. Schematic Diagram –Display Section– ............................. 27
3-8. Printed Wiring Board –Display Section– .......................... 29
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 33
4-2. Front Panel Section ........................................................... 34
4-3. CD Mechanism Section (1) ............................................... 35
4-4. CD Mechanism Section (2) ............................................... 36
4-2. Front Panel Section ........................................................... 34
4-3. CD Mechanism Section (1) ............................................... 35
4-4. CD Mechanism Section (2) ............................................... 36
5. ELECTRICAL PARTS LIST
........................................ 37
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-up
with an adhesive tape. Once the tape is removed, an adhering force
becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-up
flexible board with a new one.
with an adhesive tape. Once the tape is removed, an adhering force
becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-up
flexible board with a new one.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
– 3 –
SECTION 1
GENERAL
This section is extracted
from instruction manual.
– 4 –
