Sony CDX-3170 Service Manual ▷ View online
4-2. CIRCUIT BOARDS LOCATION
tuner assy
(TU1)
(TU1)
DISC IN SW board
DISPLAY SUB board
DISPLAY board
LOAD SW board
SERVO board
MAIN board
LIMIT SW board
SUB board
• Waveforms
(MODE:PLAY)
1
2
3
4
5
6
7
Approx. 620mVp-p
IC2
1
(FEO)
0V
IC2
#¡
(RFO)
1.2Vp-p
Approx. 200mVp-p
IC2
$™
(TEO)
0V
IC1
3
(MDP)
2.6Vp-p
7.6
µ
sec
IC1
@º
(LRCK)
5.8Vp-p
22.7
µ
sec
IC1
@™
(BCK)
5.7Vp-p
474nsec
16.89MHz
IC1
#¢
(XTAI)
3.2Vp-p
– 21 –
– 22 –
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
Note: The components identified by mark
!
or dotted line
with mark
!
are critical for safety.
Replace only with part number specified.
•
U
: B+ Line.
•
H
: adjustment for repair.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
no mark : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
J
: CD
4-3. PRINTED WIRING BOARDS — CD MECHANISM SECTION —
CDX-3170
Ref. No.
Location
IC1
D-3
IC2
E-6
IC3
B-3
Q1
F-6
Q2
F-7
• Semiconductor
Location
Note:
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
– 23 –
– 24 –
(Page 31)
4-4. SCHEMATIC DIAGRAM — CD MECHANISM SECTION — • Refer to page 22 for Waveforms and Note and page 37 for IC Block Diagrams.
CDX-3170
– 25 –
– 26 –
(Page 33)
D863
C-2
D864
A-3
D865
B-2
D868
B-4
D869
A-5
D870
A-6
D872
B-12
D873
B-11
D874
B-11
D875
B-9
IC801
B-8
CDX-3170
4-5. PRINTED WIRING BOARDS — DISPLAY SECTION —
Note:
• X
: parts extracted from the component side.
• b
: Pattern from the side which enables seeing.
• Semiconductor Location
Ref. No.
Location
D851
B-12
D852
C-12
D853
C-13
D854
C-13
D855
A-13
D856
A-8
D857
A-9
D858
A-10
D859
A-10
D860
B-3
D861
C-2
D862
C-1
Ref. No.
Location
.
– 27 –
– 28 –
(Page 31)
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