Sony CDX-2250 / CDX-3500 Service Manual ▷ View online
4-2. CIRCUIT BOARDS LOCATION
TU01
tuner assy
tuner assy
DISCIN board
DISPLAY board
LOAD board
SERVO board
MAIN board
LIMIT board
SUB board
• Waveforms
(MODE:PLAY)
1
2
3
4
5
6
7
Approx. 620mVp-p
IC2
1
(FEO)
0V
IC2
#¡
(RFO)
1.2Vp-p
Approx. 200mVp-p
IC2
$™
(TEO)
0V
IC1
3
(MDP)
2.6Vp-p
7.6
µ
sec
IC1
@º
(LRCK)
5.8Vp-p
22.7
µ
sec
IC1
@™
(BCK)
5.7Vp-p
474nsec
16.89MHz
IC1
#¢
(XTAI)
3.2Vp-p
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
Note: The components identified by mark
!
or dotted line
with mark
!
are critical for safety.
Replace only with part number specified.
•
U
: B+ Line.
•
H
: adjustment for repair.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
no mark : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
J
: CD
– 21 –
– 22 –
4-3. PRINTED WIRING BOARDS — CD MECHANISM SECTION —
CDX-2250/3500
Ref. No.
Location
IC1
D-2
IC2
E-5
IC3
B-2
Q1
F-6
Q2
F-6
• Semiconductor
Location
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
– 23 –
– 24 –
4-4. SCHEMATIC DIAGRAM — CD MECHANISM SECTION — • Refer to page 22 for Waveforms and Note and page 37 for IC Block Diagrams.
CDX-2250/3500
– 25 –
– 26 –
(Page
33)
4-5. PRINTED WIRING BOARD — DISPLAY SECTION —
Note:
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Semiconductor Location
Ref. No.
Location
(D551)
B-10
(D552)
B-9
(D554)
B-10
D561
B-12
D562
A-13
D563
B-13
D564
C-5
D565
C-4
Ref. No.
Location
D566
A-4
D567
C-2
D568
C-9
D569
C-8
D570
C-7
D571
C-12
D572
C-11
D573
C-3
– 27 –
– 28 –
CDX-2250/3500
D574
C-2
D575
B-3
D576
A-2
D577
B-1
D578
A-1
(IC551)
B-7
Ref. No.
Location
( ) : SIDE B
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