Sony CDX-1000RF Service Manual ▷ View online
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Model Name Using Similar Mechanism
CDX-2500R
CD Drive Mechanism Type
MG-363X-121
Optical Pick-up Name
KSS-521A
SERVICE MANUAL
US Model
CDX-1000RF
COMPACT DISC PLAYER
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
13 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.
13 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.
Other Specifications
CD player section
CD player section
System
Compact disc digital audio
system
system
Signal-to-noise ratio
90 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Laser Diode Properties
Material
GaAs+GaAlAs
Wavelength
785 – 815 nm (Typ. 800 nm)
Emission Duration
Continuous
Laser output power
Less than 0.5 mW*
* This output is the value measured at a distance
of 0.7 mm from the objective lens surface on the
Optical Pick-up Block.
Optical Pick-up Block.
SPECIFICATIONS
General
Outputs
Line outputs
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Current drain
2A (at disc loading)
Dimensions
Approx. 178
×
50
×
173 mm
(7
1/8
×
2
×
6
7/8
in.)
(w/h/d)
Mounting dimensions
Approx. 182
×
53
×
159 mm
(7
1/4
×
2
1/8
×
6
3/8
in.)
(w/h/d)
Mass
Approx. 1.1 kg (2 lb. 7 oz.)
Supplied accessories
Parts for installation and
connections (1 set)
connections (1 set)
Design and specifications are subject to change without
notice.
notice.
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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 3
Getting Started ......................................................................... 3
Operation ................................................................................. 3
Connections ............................................................................. 4
Getting Started ......................................................................... 3
Operation ................................................................................. 3
Connections ............................................................................. 4
2. DISASSEMBLY
2-1. Panel Assy, Front ................................................................. 5
2-2. CD Mechanism Block ......................................................... 5
2-3. Main Board ......................................................................... 6
2-4. Chassis (Rear) ..................................................................... 6
2-5. Chassis (T) Sub Assy .......................................................... 7
2-6. Lever Assy ........................................................................... 7
2-7. Servo Board ......................................................................... 8
2-8. Roller Assy .......................................................................... 8
2-9. Chassis (OP) (O/S) Assy ..................................................... 9
2-10. Optical Pick-up Block ......................................................... 9
2-2. CD Mechanism Block ......................................................... 5
2-3. Main Board ......................................................................... 6
2-4. Chassis (Rear) ..................................................................... 6
2-5. Chassis (T) Sub Assy .......................................................... 7
2-6. Lever Assy ........................................................................... 7
2-7. Servo Board ......................................................................... 8
2-8. Roller Assy .......................................................................... 8
2-9. Chassis (OP) (O/S) Assy ..................................................... 9
2-10. Optical Pick-up Block ......................................................... 9
3. ELECTRICAL ADJUSTMENTS
CD Section ............................................................................ 10
4. DIAGRAMS
4-1. IC Pin Description ............................................................. 11
4-2. Block Diagram –CD Section (1/2)– .................................. 12
4-3. Block Diagram –CD Section (2/2)– .................................. 13
4-4. Block Diagram –Display, Power Supply Section– ............ 14
4-5. Circuit Boards Location .................................................... 15
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 16
4-7. Schematic Diagram –CD Mechanism Section– ................ 17
4-8. Printed Wiring Board –Main Section– .............................. 18
4-9. Schematic Diagram –Main Section (1/2)– ........................ 19
4-10. Schematic Diagram –Main Section (2/2)– ........................ 20
4-11. Schematic Diagram –Display Section– ............................. 21
4-12. Printed Wiring Board –Display Section– .......................... 22
4-2. Block Diagram –CD Section (1/2)– .................................. 12
4-3. Block Diagram –CD Section (2/2)– .................................. 13
4-4. Block Diagram –Display, Power Supply Section– ............ 14
4-5. Circuit Boards Location .................................................... 15
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 16
4-7. Schematic Diagram –CD Mechanism Section– ................ 17
4-8. Printed Wiring Board –Main Section– .............................. 18
4-9. Schematic Diagram –Main Section (1/2)– ........................ 19
4-10. Schematic Diagram –Main Section (2/2)– ........................ 20
4-11. Schematic Diagram –Display Section– ............................. 21
4-12. Printed Wiring Board –Display Section– .......................... 22
5. EXPLODED VIEWS
5-1. Chassis Section ................................................................. 26
5-2. Front Panel Section ........................................................... 27
5-3. CD Mechanism Section (1) ............................................... 28
5-4. CD Mechanism Section (2) ............................................... 29
5-5. CD Mechanism Section (3) ............................................... 30
5-2. Front Panel Section ........................................................... 27
5-3. CD Mechanism Section (1) ............................................... 28
5-4. CD Mechanism Section (2) ............................................... 29
5-5. CD Mechanism Section (3) ............................................... 30
6. ELECTRICAL PARTS LIST
........................................ 31
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
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SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
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