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AEP Model

UK Model

2007G05-1
© 2007.07

Model Name Using Similar Mechanism

ZS-X1

Optical Pick-up Block Name

KSM-213RAP

Optical Pick-up Name

KSS-213R

US and foreign patents licensed from Dolby Laboratories.

System

Compact disc digital audio system

Laser diode properties

Material: GaAlAs
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 

µW

(This output is the value measured at a distance of about
200 mm from the objective lens surface on the optical
pick-up block with 7 mm aperture.)

Spindle speed

400 r/min (rpm) to 1 000 r/min (rpm) (CLV)

Number of channels

2

Frequency response

20 - 20 000 Hz +0/–1 dB

Wow and flutter

Below measurable limit

Frequency range

FM

87.5 - 108 MHz

MW

531 - 1 611 kHz (9 kHz step)
530 - 1 610 kHz (10 kHz step)

LW

153 - 279 kHz

IF

FM: 10.7 MHz
AM/MW/LW: 450 kHz

Aerials

FM: Telescopic aerial
AM/MW/LW: Built-in ferrite bar aerial

Speaker

Full range: 8 cm (3 

1

⁄

4 

 in.) dia., 3.2 

Ω, cone type (2)

Input

LINE IN jack (stereo minijack):
Minimum input level 330 mV

Outputs

Headphones jack (stereo minijack):
For 16 - 64 

Ω impedance headphones

OPTICAL DIGITAL OUT (CD) (optical output
connector): Wavelength 630 - 690 nm

Maximum power output

4.6 W

Power requirements

For player: 230 V AC, 50 Hz
9 V DC, 6 R14 (size C) batteries
For remote control:
3 V DC, 2 R03 (size AAA) batteries

Power consumption

16 W

Battery life

For player:

Sony R14P: approx. 1.5 h

Sony alkaline LR14: approx. 8 h

Sony R14P: approx. 6 h

Sony alkaline LR14: approx. 20 h

Dimensions

Approx. 455 

× 214 × 180 mm  (w/h/d)

(18 

× 

 

8 

1

⁄

2

 

 

×

 

7 

1

⁄

8   

inches)

 

(incl. projecting parts)

Mass

Approx. 3.5 kg (7 lb. 11 oz) (incl. batteries)

Supplied accessories

Mains lead (1)
Remote control (1)
CD-ROM (SonicStage) (1)
SonicStage Installation/Operating Guide (1)

Design and specifications are subject to change without
notice.

2

................................................

3

...................................................................

5

3-1.

Disassembly Flow ...........................................................

7

3-2.

Cabinet Rear Assy ...........................................................

8

3-3.

Cabinet (Upper) ...............................................................

8

3-4.

Shassis Section ................................................................

9

3-5.

CD Block Section ............................................................

9

3-6.

LCD Board ...................................................................... 10

.............................................................. 11

TUNER Section ............................................................... 12
CD Section ...................................................................... 14

6-1.

Block Diagram  – CD SERVO Section – ........................ 16

6-2.

Block Diagram  – TUNER Section – .............................. 17

6-3.

Block Diagram  – MAIN Section – ................................. 18

6-4.

Printed Wiring Board  – CD Board – .............................. 20

6-5.

Schematic Diagram  – CD Board – ................................. 21

6-6.

Printed Wiring Board  – TU Board – ............................... 22

6-7.

Schematic Diagram  – TU Board – ................................. 23

6-8.

Printed Wiring Board
– MAIN Board (Component Side) – ............................... 24

6-9.

Printed Wiring Board
– MAIN Board (Conductor Side) – ................................. 25

6-10. Schematic Diagram  – MAIN Board (1/2) – ................... 26
6-11. Schematic Diagram  – MAIN Board (2/2) – ................... 27
6-12. Printed Wiring Boards  – KEY Section – ........................ 28
6-13. Printed Wiring Boards  – POWER Section – .................. 29
6-14. Schematic Diagram  – KEY/POWER Section – ............. 30

7-1.

Cabinet Rear Section ....................................................... 42

7-2.

Cabinet Front Section ...................................................... 43

7-3.

Chassis Section ................................................................ 44

7-4.

LID CD Section ............................................................... 45

7-5.

Optical Pick-up Block Section (KSM-213RAP) ............. 46

................................ 47

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

 0

0

This player can play CD-Rs/CD-RWs
recorded in the CD-DA format*, but
playback capability may vary depending on
the quality of the disc and the condition of
the recording device.

* CD-DA is the abbreviation for Compact

Disc Digital Audio. It is a recording
standard used for Audio CDs.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

3

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 

°

C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°

C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S421. (push switch type)
The following checking method for the laser diode is operable.

•

1. Open the upper lid.
2. Push the S421 as shown in Fig.1.

Do not push the detection lever strongly, or it may be bent or damaged.

3. Press the

u

button.

4. Check the object lens for confirming normal emission of the

laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.

In this operation, the object lens will move up and down 2

times along with inward motion for the focus search.

2

1

S421

4

MAIN board

H/P board

TU board